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Renesas ISL6267HRZ-T

Part No.:
ISL6267HRZ-T
Manufacturer:
Renesas
Category:
Special Purpose Regulators
Package:
48-VFQFN Exposed Pad
Datasheet:
AetrixISL6267HRZ-T.pdf
Description:
IC REG CTRLR MULTIPH 2OUT 48QFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,356

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Product details

Overview

ISL6267HRZ-T from Renesas (formerly Intersil) is a dual-output multiphase PWM controller IC designed specifically for AMD Fusion™ mobile CPU core and northbridge power delivery. It integrates three gate drivers, supports 3-/2-/1-phase core VR and 2-/1-phase NB VR, delivers 0.5% system voltage accuracy over temperature, operates from 4.5V–25V VIN, and uses R3™ modulator technology for fast transient response in notebook applications.

For engineers reviewing the ISL6267HRZ-T datasheet, ISL6267HRZ-T pinout, ISL6267HRZ-T application, or ISL6267HRZ-T equivalent, key selection criteria include AMD SVI 1.0 serial interface compliance, differential remote sensing capability, DCR/resistor current sensing flexibility, programmable phase count per output, and thermal monitoring with dual NTC inputs.

Technical Context

The ISL6267HRZ-T implements two independent VR controllers sharing one SVI 1.0 serial bus: Core VR supports 1–3 phases with integrated UG1/LG1/UG2/LG2/PWM3 drivers and ISEN1–ISEN3 sensing; Northbridge VR supports 1–2 phases with UG1_NB/LG1_NB/PWM2_NB and ISEN1_NB/ISEN2_NB. Both use R3™ modulator architecture enabling variable-frequency operation during transients and natural PFM at light load.

It features dual independent error amplifiers (COMP/COMP_NB), programmable switching frequency via VW/VW_NB resistors (200–500 kHz), precision load-line regulation, adaptive body diode conduction time reduction, and coordinated OCP/WOC, OVP, thermal alert (VR_HOT), and PGOOD signaling for both outputs.

Key Specifications

ParameterValue and Actual Design Meaning
VIN Range4.5V to 25V - supports wide-input notebook battery rails including 8V, 12V, and 19V systems.
Core Output Accuracy±0.5% over temperature - ensures stable CPU core voltage under thermal stress in mobile platforms.
Switching Frequency200–500 kHz programmable - enables optimization of efficiency vs. size trade-offs in compact layouts.
Phase ConfigurationsCore: 1/2/3-phase; NB: 1/2-phase - provides scalable power delivery matching CPU/NB load profiles.
Current SensingDCR or precision resistor - eliminates sense resistor losses or enables high-accuracy calibration.
Thermal MonitoringDual NTC inputs (NTC, NTC_NB) - enables independent thermal protection for core and northbridge VR sections.
InterfaceAMD SVI 1.0 compliant - guarantees interoperability with AMD Fusion™ processors' serial VID protocol.

Pinout & Package

ISL6267HRZ-T is housed in a Pb-free, RoHS-compliant 48-lead 6 mm × 6 mm QFN package with exposed thermal pad (PKG DWG L48.6x6B). The package supports high-power density layout and efficient heat dissipation in space-constrained notebook PCBs.

Pin/TerminalCircuit RoleDesign Meaning
ISEN1, ISEN2, ISEN3/FB2Core phase current sense inputsEnable per-phase current monitoring and dynamic balancing; FB2 repurposed for compensation in 2-phase mode.
UG1, LG1, PH1, BOOT1Core Phase 1 gate drive circuitDirect high-side/low-side MOSFET control with bootstrap charging-no external diode required.
UG2, LG2, PH2, BOOT2Core Phase 2 gate drive circuitIndependent second-phase driver supporting 2- or 3-phase core VR configurations.
UG1_NB, LG1_NB, PH1_NB, BOOT1_NBNorthbridge VR gate drive circuitFull gate driver set for dedicated NB power rail-enables independent timing and protection.
VSEN, RTN, VSEN_NB, RTN_NBDifferential remote voltage sense inputsCompensates for IR drop across PCB traces-critical for sub-1V CPU core regulation accuracy.
SVD, SVC, PWROKSVI 1.0 serial interface signalsBi-directional VID communication with AMD CPU; PWROK enables SVI protocol activation sequence.
PROG1, PROG2VID offset programming pinsAllow fine-tuning of core and NB output voltages beyond standard VID steps (e.g., for margining).
VR_HOT, NTC, NTC_NBThermal overload indicator & sensorsActive-low VR_HOT asserts when either core or NB thermal threshold is exceeded-supports system-level thermal shutdown.

Key Features

FeatureDesign Value
R3™ Robust Ripple Regulator modulatorDelivers faster load transient response than fixed-frequency buck controllers by dynamically adjusting switching frequency.
Dual independent VR controllersEliminates need for two discrete controllers-reduces BOM cost, board area, and inter-controller timing skew.
Programmable phase count per outputEnables flexible design reuse across multiple AMD Fusion CPU SKUs (e.g., 3-phase core + 2-phase NB or 2+1 configurations).
Differential remote sensing (VSEN/RTN)Maintains ±0.5% output accuracy despite PCB trace resistance up to 20 mΩ between VR and CPU die.
Adaptive body diode conduction time reductionMinimizes shoot-through risk and improves light-load efficiency by dynamically shortening low-side FET conduction during dead time.
Integrated thermal monitor with dual NTC inputsProvides independent temperature feedback for core and NB VR sections-enables asymmetric thermal management policies.

Applications

AMD Fusion CPU Core PowerNotebook Computer Mainboard

Use Scenario: Primary voltage regulation for AMD Fusion A-series APUs in ultraportable and mainstream notebooks.

IC Role / Device Role / Timing Role: Dual-output multiphase PWM controller managing core and northbridge power domains with synchronized SVI 1.0 interface.

Use Value: Enables precise 0.5% voltage accuracy and fast transient response required for dynamic CPU frequency scaling (Turbo Core).

Use Scenario: Central power management unit on 14"–15.6" consumer and business notebook mainboards.

IC Role / Device Role / Timing Role: System-level VR controller coordinating with embedded controller (EC) and CPU for power sequencing and thermal throttling.

Use Value: Reduces component count versus dual-IC solutions while maintaining independent PGOOD, OCP, and thermal alerts per rail.

AMD Torpedo PlatformLow-Power Mobile CPU + NB

Use Scenario: Reference platform implementation for AMD's Torpedo architecture targeting thin-and-light designs.

IC Role / Device Role / Timing Role: Reference design controller validating SVI 1.0 timing margins, phase interleaving, and load-line compliance.

Use Value: Provides validated layout guidelines and compensation networks for rapid customer design-in and qualification.

Use Scenario: Entry-level mobile platforms using lower TDP AMD CPUs with simplified 1-phase core + 1-phase NB configuration.

IC Role / Device Role / Timing Role: Scalable VR controller reconfigured via pin-strapping (ISEN2=VDD, PWM3=VDD) to disable unused phases.

Use Value: Maintains full feature set (remote sensing, thermal monitoring, SVI interface) even in minimal phase count mode.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-output multiphase VR controller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
ISL6268HRZ-TSame pinout and SVI 1.0 interface; supports higher max VIN (30V) and extended junction temp (135°C).Targeted at industrial or extended-temperature notebooks where ambient exceeds +100°C.Select ISL6268HRZ-T only if operating above +100°C ambient or requiring >25V input tolerance.
RTQ2136BGESingle-output 6-phase controller with PMBus interface; no native SVI 1.0 support or dual-rail architecture.Requires external logic or MCU to emulate SVI protocol; not drop-in compatible with AMD Fusion platforms.Consider only for non-AMD designs or custom firmware-based SVI emulation-adds validation overhead.

Compared with ISL6267HRZ-T, ISL6268HRZ-T offers extended thermal and voltage margins without layout change, while RTQ2136BGE requires interface redesign and lacks native dual-rail coordination-making ISL6267HRZ-T the optimal choice for AMD Fusion™-based notebooks.

Availability

ISL6267HRZ-T is available at Aetrix Electronics and suitable for AMD Fusion™ CPU core power, notebook computer mainboard design, and mobile platform reference development requiring stable component supply and long-term lifecycle support.

Supply support for ISL6267HRZ-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics acquired Intersil in 2017 and maintains full product continuity, technical documentation, and manufacturing for the ISL6267HRZ-T family.

The ISL6267HRZ-T belongs to Renesas' high-performance power management IC portfolio, engineered specifically for AMD mobile CPU power delivery with emphasis on SVI interface fidelity, multiphase current balance, and thermal robustness in thermally constrained notebooks.

FAQ

What is the operating temperature range for the ISL6267HRZ-T?

The ISL6267HRZ-T is rated for an ambient temperature range of -10°C to +100°C and a junction temperature range of -10°C to +125°C. This specification aligns with commercial-grade notebook environments and is documented in the FN7801 datasheet under Recommended Operating Conditions. The HRZ suffix denotes this temperature grade, distinguishing it from the wider-range IRZ variant.

Does the ISL6267HRZ-T support both DCR and resistor-based current sensing?

Yes, the ISL6267HRZ-T supports both lossless inductor DCR current sensing and precision resistor current sensing on both core and northbridge outputs. The datasheet confirms configurable ISEN inputs and dedicated compensation networks (e.g., FB2_NB for 1-phase NB mode) to optimize stability under either method-enabling design flexibility without hardware revision.

How does the R3™ modulator in the ISL6267HRZ-T improve transient response?

The R3™ modulator in the ISL6267HRZ-T achieves faster transient response by varying switching frequency during load steps-increasing frequency to reduce output voltage deviation and recovery time. Unlike fixed-frequency controllers, it naturally transitions into pulse-frequency modulation (PFM) at light loads, improving efficiency without requiring external mode-control circuitry.

Can the ISL6267HRZ-T be configured for single-phase operation on both outputs?

Yes, the ISL6267HRZ-T can be configured for 1-phase core VR (by pulling ISEN2 to VDD and PWM3 to VDD) and 1-phase northbridge VR (by pulling ISEN2_NB to VDD). Pin-strapping enables this mode without firmware changes, and all protections-including OCP, thermal monitoring, and PGOOD-remain fully functional per rail.

What is the purpose of the PROG1 and PROG2 pins on the ISL6267HRZ-T?

The PROG1 and PROG2 pins on the ISL6267HRZ-T allow programmable offset adjustment of the core and northbridge output voltages, respectively. This enables fine-grained voltage margining beyond standard VID code resolution (12.5 mV steps), supporting validation testing, binning, and adaptive voltage scaling in AMD Fusion™ platforms.

ISL6267HRZ-T Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
Robust Ripple Regulator™ (R3)
Package/Case:
48-VFQFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Applications:
Controller, AMD Fusion™ CPU GPU
Voltage - Input:
4.5V ~ 25V
Number of Outputs:
2
Voltage - Output:
0.013V ~ 1.55V
Operating Temperature:
-10°C ~ 100°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-QFN (6x6)

ISL6267HRZ-T FAQ

1.How can I place an order for ISL6267HRZ-T through Aetrix?

Please submit a Request for Quotation (RFQ) for ISL6267HRZ-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for ISL6267HRZ-T reliable?

The price and inventory of ISL6267HRZ-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ISL6267HRZ-T is usually 5 days.

3.What payment methods are accepted for ISL6267HRZ-T?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ISL6267HRZ-T transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for ISL6267HRZ-T?

ISL6267HRZ-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your ISL6267HRZ-T order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for ISL6267HRZ-T?

For technical support, including ISL6267HRZ-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ISL6267HRZ-T requirements.

6.How does Aetrix verify that ISL6267HRZ-T is sourced from the original manufacturer or authorized distributors?

All ISL6267HRZ-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ISL6267HRZ-T meets industry standards.

7.What is the process for return or replacement of ISL6267HRZ-T?

All ISL6267HRZ-T units undergo pre-shipment inspection (PSI). If there is an issue with ISL6267HRZ-T, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The ISL6267HRZ-T part is unused and in its original packaging.

Return procedure for ISL6267HRZ-T:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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