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Renesas ISL62771HRTZ-TS2775
- Part No.:
- ISL62771HRTZ-TS2775
- Manufacturer:
- Renesas
- Category:
- Special Purpose Regulators
- Package:
- 40-VFQFN Exposed Pad
- Datasheet:
-
ISL62771HRTZ-TS2775.pdf
- Description:
- IC REG CTRLR MULTIPH 2OUT 40TQFN
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
ISL62771HRTZ-TS2775 from Renesas (formerly Intersil) is a dual-output, multiphase PWM controller for AMD Fusion™ mobile CPUs using SVI 2.0 interface. It integrates three gate drivers to support 2-phase Core VR and 1-phase Northbridge VR, delivers 0.5% system voltage accuracy over temperature, operates from 4.5V–25V input, and uses R3™ modulator technology for adaptive switching frequency up to 320kHz. It targets notebook CPU/GPU core power regulation with DCR or resistor current sensing.
For engineers reviewing the ISL62771HRTZ-TS2775 datasheet, ISL62771HRTZ-TS2775 pinout, ISL62771HRTZ-TS2775 application, or ISL62771HRTZ-TS2775 equivalent, key selection considerations include SVI 2.0 serial bus compliance (100kHz–25MHz), dual-VR shared control architecture, differential remote voltage sensing, programmable load-line droop on both outputs, and thermal monitoring via dual NTC inputs.
Technical Context
The ISL62771HRTZ-TS2775 implements two independent voltage regulators-Core VR (configurable 1- or 2-phase) and Northbridge VR (1-phase only)-within a single die, sharing an AMD SVI 2.0 serial bus for VID programming and telemetry. Its R3™ modulator dynamically adjusts switching frequency during transients: rising COMP voltage accelerates master clock generation for faster load-step response, while falling COMP extends off-time to improve light-load efficiency.
Both VRs support lossless DCR current sensing with single NTC thermistor compensation or precision resistor-based sensing, and employ differential remote sense (VSEN/RTN) with ±0.5% output accuracy across –10°C to +100°C ambient. Protection includes OCP/WOC, OVP/UVP, PGOOD, and dual-channel thermal monitoring with programmable warning/shutdown thresholds.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| SVI 2.0 Interface | Serial VID clock range 100kHz–25MHz; supports VID-on-the-fly transitions and telemetry reporting via SVT pin. |
| Output Voltage Range | 0.5V–1.55V in 6.25mV steps; enables precise core/NB rail tuning per AMD processor requirements. |
| System Accuracy | ±0.5% over temperature (–10°C to +100°C); ensures stable CPU operation under thermal stress without recalibration. |
| Switching Frequency | Programmable 280–320kHz per VR; balances EMI, efficiency, and transient response for mid-power mobile CPUs. |
| Current Sensing | Supports DCR (inductor-based) or precision resistor methods; eliminates need for shunt resistors and reduces board space/cost. |
| Thermal Monitoring | Dual NTC inputs (NTC, NTC_NB) with 600–680mV warning threshold and 530–630mV shutdown threshold; enables per-rail thermal management. |
| Package | 40-pin 5×5mm TQFN; RoHS-compliant, exposed pad for thermal dissipation; suitable for high-density notebook PCB layouts. |
Pinout & Package
ISL62771HRTZ-TS2775 is housed in a 40-lead 5×5mm TQFN package with exposed thermal pad (bottom side). The package supports reflow soldering per Pb-free profile (J-STD-020) and provides low θJA = 33°C/W for thermal management in compact notebook designs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| ISEN1 / ISEN2 | Core VR phase enable/sense inputs | Configures Core VR as 1-phase (ISEN2 = +5V) or 2-phase; disables Core if ISEN1 = +5V. |
| VSEN / VSEN_NB | Differential voltage sense inputs | Connect to CPU die +sense pins; enables accurate remote regulation despite PCB IR drop. |
| RTN | Common sense return | Shared return for both Core and NB VRs; must connect to CPU die –sense pin to close feedback loop. |
| SVC / SVD / SVT | SVI 2.0 serial interface | SVC = clock, SVD = bidirectional data, SVT = telemetry output; enables dynamic VID updates and real-time current/voltage reporting. |
| UGATE1/2/NB, LGATE1/2/NB | Integrated gate drivers | Drive external high-/low-side MOSFETs; UGATE sink/source ≥2A, LGATE sink ≥4A, dead time ≤28ns for robust FET control. |
| NTC / NTC_NB | Thermal monitor inputs | Accept NTC thermistors to trigger VR_HOT_L (active-low thermal fault) and adjust load line based on die temperature. |
Key Features
| Feature | Design Value |
|---|---|
| R3™ Adaptive Modulation | Automatically increases switching frequency during load transients for <10µs settling time and maintains >90% efficiency at 10% load. |
| Dual-VR Shared SVI Bus | Reduces component count and PCB area vs. discrete controllers; eliminates inter-VR timing skew and simplifies firmware integration. |
| Programmable Load-Line Droop | Adjusts output voltage vs. current slope independently per VR to meet AMD processor VDDIO/VDDCORE spec requirements. |
| Differential Remote Sensing | Compensates for up to 50mV PCB trace IR drop between VR output and CPU power pins, ensuring ±0.5% regulation at point-of-load. |
| Diode Emulation Mode | Disables reverse conduction in low-side FET during light load, eliminating body diode losses and improving efficiency by 3–5% at <1A. |
Applications
| AMD Mobile CPU Core Power | AMD Mobile GPU/Northbridge Power |
|---|---|
|
Use Scenario: Regulating VDDCORE for AMD A-series APUs in ultrabooks with dynamic power states (C-states) and rapid load changes. IC Role / Device Role / Timing Role: Dual-output PWM controller managing 2-phase Core VR and 1-phase NB VR via shared SVI 2.0 bus. Use Value: Enables sub-10µs transient response and 0.5% voltage accuracy across –10°C to +100°C, meeting AMD Fusion processor spec. |
Use Scenario: Supplying stable VDDNB for integrated Radeon graphics in thin-and-light notebooks with constrained thermal envelope. IC Role / Device Role / Timing Role: Dedicated Northbridge VR channel with independent current sensing, telemetry, and thermal shutdown. Use Value: Prevents GPU throttling via NTC-based thermal monitoring and maintains <1% load-line deviation under 15A peak loads. |
| Notebook System Power Sequencing | Mobile Platform Telemetry Integration |
|
Use Scenario: Coordinating power-up of CPU core and Northbridge rails with precise timing alignment to AMD PWROK protocol. IC Role / Device Role / Timing Role: Uses PWROK input to gate SVI 2.0 activation and generate synchronized PGOOD signals for both VRs. Use Value: Ensures compliant boot sequence per AMD SVI 2.0 Controller Guidelines, avoiding CPU initialization failures. |
Use Scenario: Reporting real-time core/NB output current and voltage to platform controller hub (PCH) for thermal/power management. IC Role / Device Role / Timing Role: Delivers telemetry via SVT pin with 8–12mV/µs slew rate; supports VID-on-the-fly updates during runtime. Use Value: Enables dynamic voltage/frequency scaling (DVFS) and predictive thermal throttling without host software intervention. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multiphase VR controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISL62772HRTZ | Same pinout and SVI 2.0 interface; supports 3-phase Core VR instead of 2-phase; higher current capability. | Targeted at higher-TDP AMD processors (e.g., quad-core A10) requiring >40A core current. | Select ISL62772HRTZ only if design requires >30A Core VR current or 3-phase operation; otherwise, ISL62771HRTZ-TS2775 offers optimal cost/performance for mid-power APUs. |
| RTQ2134BGE | Single-output, 4-phase controller; no SVI 2.0 interface; uses PMBus 1.3 for digital communication. | Designed for Intel VR12/VR12.5 platforms; incompatible with AMD SVI 2.0 protocol and VID encoding. | RTQ2134BGE is not a functional substitute for ISL62771HRTZ-TS2775 in AMD systems due to protocol mismatch and lack of dual-VR architecture. |
Compared with ISL62772HRTZ, the ISL62771HRTZ-TS2775 provides optimized phase count and thermal performance for mainstream AMD Fusion CPUs, while RTQ2134BGE serves entirely different platform ecosystems and cannot replace ISL62771HRTZ-TS2775 without redesigning firmware, layout, and control logic.
Availability
ISL62771HRTZ-TS2775 is available at Aetrix Electronics and suitable for notebook computers, AMD APU core power systems, and mobile platform power management requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for ISL62771HRTZ-TS2775 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics acquired Intersil in 2017 and continues to support its high-performance analog and power management portfolio for computing and industrial applications.
The ISL62771HRTZ-TS2775 belongs to Renesas' AMD-optimized multiphase VR controller family, designed specifically for Fusion™ mobile CPU/GPU core power delivery with SVI 2.0 compliance and advanced thermal-aware regulation.
FAQ
What is the operating temperature range for the ISL62771HRTZ-TS2775?
The ISL62771HRTZ-TS2775 is rated for ambient temperatures from –10°C to +100°C and junction temperatures up to +125°C. This HRTZ-grade variant is qualified for consumer and commercial notebook applications where thermal margins are less extreme than industrial environments. Its thermal monitor inputs (NTC, NTC_NB) provide real-time die temperature feedback to maintain safe operation within this range. The ISL62771HRTZ-TS2775 also features thermal shutdown at 530–630mV NTC voltage to prevent damage during overload conditions.
Does the ISL62771HRTZ-TS2775 support both DCR and resistor-based current sensing?
Yes, the ISL62771HRTZ-TS2775 supports both lossless inductor DCR current sensing and precision resistor current sensing on both Core and Northbridge VR outputs. For DCR sensing, it uses the ISUMP/ISUMN and ISUMP_NB/ISUMN_NB pins with a single NTC thermistor for temperature compensation. For resistor sensing, external sense resistors connect to ISEN1/ISEN2 and corresponding NB pins, enabling accurate current measurement without inductor DCR tolerance errors. The ISL62771HRTZ-TS2775 automatically adapts its gain and offset calibration based on the selected method.
How does the R3™ modulator in the ISL62771HRTZ-TS2775 improve transient response?
The R3™ modulator in the ISL62771HRTZ-TS2775 improves transient response by dynamically adjusting switching frequency: during load steps, rising COMP voltage accelerates master clock generation, shortening PWM on-time intervals and increasing effective frequency for faster correction. During load release, falling COMP extends off-time, reducing switching losses. This yields <10µs transient settling time-significantly faster than fixed-frequency PWM-and maintains 0.5% voltage accuracy without external compensation. The ISL62771HRTZ-TS2775 achieves this while preserving low phase jitter and excellent current balance across phases.
Can the ISL62771HRTZ-TS2775 be used in a single-phase Core VR configuration?
Yes, the ISL62771HRTZ-TS2775 supports configurable 1-phase Core VR operation. Pulling ISEN2 to +5V disables Phase 2, forcing the Core VR into single-phase mode while retaining full functionality-including current sensing, telemetry, and protection-on Phase 1. The ISL62771HRTZ-TS2775 still uses its dual-gate-driver architecture (UGATE1/LGATE1 and UGATE2/LGATE2), but only Phase 1 drivers are active. This flexibility allows designers to optimize BOM cost and layout density for lower-power AMD APUs without changing the controller IC.
What is the purpose of the VR_HOT_L pin on the ISL62771HRTZ-TS2775?
The VR_HOT_L pin on the ISL62771HRTZ-TS2775 is an open-drain thermal indicator output that asserts active-low when either Core or Northbridge VR exceeds its thermal warning threshold (600–680mV on NTC/NTC_NB). It interfaces directly with AMD CPUs to signal thermal overload and trigger platform-level throttling or shutdown. The ISL62771HRTZ-TS2775 monitors both VRs independently and pulls VR_HOT_L low if either channel's NTC voltage drops below the warning threshold, providing fail-safe thermal protection without requiring external logic. This pin is essential for compliance with AMD Fusion thermal management requirements.
ISL62771HRTZ-TS2775 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- Robust Ripple Regulator™ (R3)
- Package/Case:
- 40-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Applications:
- Controller, AMD Fusion™ SVI 2.0 CPU GPU
- Voltage - Input:
- 4.5V ~ 25V
- Number of Outputs:
- 2
- Voltage - Output:
- 0.006V ~ 1.55V
- Operating Temperature:
- -10°C ~ 100°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 40-TQFN (5x5)
ISL62771HRTZ-TS2775 FAQ
1.How can I place an order for ISL62771HRTZ-TS2775 through Aetrix?
Please submit a Request for Quotation (RFQ) for ISL62771HRTZ-TS2775 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ISL62771HRTZ-TS2775 reliable?
The price and inventory of ISL62771HRTZ-TS2775 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ISL62771HRTZ-TS2775 is usually 5 days.
3.What payment methods are accepted for ISL62771HRTZ-TS2775?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ISL62771HRTZ-TS2775 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ISL62771HRTZ-TS2775?
ISL62771HRTZ-TS2775 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ISL62771HRTZ-TS2775 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ISL62771HRTZ-TS2775?
For technical support, including ISL62771HRTZ-TS2775 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ISL62771HRTZ-TS2775 requirements.
6.How does Aetrix verify that ISL62771HRTZ-TS2775 is sourced from the original manufacturer or authorized distributors?
All ISL62771HRTZ-TS2775 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ISL62771HRTZ-TS2775 meets industry standards.
7.What is the process for return or replacement of ISL62771HRTZ-TS2775?
All ISL62771HRTZ-TS2775 units undergo pre-shipment inspection (PSI). If there is an issue with ISL62771HRTZ-TS2775, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ISL62771HRTZ-TS2775 part is unused and in its original packaging.
Return procedure for ISL62771HRTZ-TS2775:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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