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Renesas ISL62771IRTZ-T
- Part No.:
- ISL62771IRTZ-T
- Manufacturer:
- Renesas
- Category:
- Special Purpose Regulators
- Package:
- 40-VFQFN Exposed Pad
- Datasheet:
-
ISL62771IRTZ-T.pdf
- Description:
- IC REG CTRLR MULTIPH 2OUT 40TQFN
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
ISL62771IRTZ-T from Renesas (formerly Intersil) is a dual-output, multiphase PWM controller IC designed specifically for AMD Fusion™ mobile CPU/GPU core power delivery using SVI 2.0 interface. It integrates three gate drivers to support 2-phase Core VR and 1-phase Northbridge VR, delivers 0.5% system voltage accuracy over temperature, operates from 4.5V–25V input, and features R3™ modulator technology for adaptive switching frequency up to 320kHz.
For engineers reviewing the ISL62771IRTZ-T datasheet, ISL62771IRTZ-T pinout, ISL62771IRTZ-T application, or ISL62771IRTZ-T equivalent, this page provides verified technical context, validated pin functions, confirmed dual-VR architecture with DCR/resistor current sensing, real-world thermal monitoring via NTC inputs, and precise SVI 2.0 timing compliance (100kHz–25MHz clock range).
Technical Context
The ISL62771IRTZ-T implements two independent voltage regulators on a single die: a programmable 1- or 2-phase Core VR and a fixed 1-phase Northbridge VR, sharing a common SVI 2.0 serial bus for CPU communication. Both VRs use R3™ modulator topology, enabling automatic frequency scaling during transients and maintaining 0.5% output accuracy across –40°C to +100°C ambient.
It supports lossless DCR current sensing with single NTC thermistor compensation or precision resistor-based sensing, differential remote voltage sensing (VSEN/RTN), and integrated protection including OCP/WOC, OVP, UVP, PGOOD, and thermal monitoring via dedicated NTC_NB and NTC pins. The controller enables adaptive body diode conduction time reduction and dynamic load line slope trim.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| SVI 2.0 Interface | Serial VID clock range 100kHz–25MHz; bidirectional SVD, clock SVC, telemetry SVT - enables direct AMD CPU coordination without external I²C bridge. |
| Output Voltage Range | 0.5V–1.55V in 6.25mV steps - matches AMD processor VID code resolution for precise core/NB rail control. |
| System Accuracy | ±0.8% over –40°C to +100°C - ensures stable microprocessor operation under thermal stress without recalibration. |
| Switching Frequency | Programmable 280–320kHz per VR - balances efficiency, EMI, and transient response for notebook power stages. |
| Current Sensing | DCR or resistor-based with single NTC compensation - eliminates sense resistor power loss while maintaining ±5% current measurement accuracy. |
| Thermal Monitoring | Dual NTC inputs (NTC, NTC_NB) with 600–680mV warning threshold and 530–630mV shutdown - enables per-rail thermal throttling per AMD SVI 2.0 spec. |
| Protection Features | OCP/WOC, OVP (±375mV), UVP, PGOOD, VR_HOT_L open-drain thermal indicator - meets AMD platform fault recovery requirements. |
Pinout & Package
ISL62771IRTZ-T is housed in a Pb-free, RoHS-compliant 40-lead 5mm × 5mm TQFN package with exposed thermal pad (package drawing L40.5x5). The pinout supports dual-VR layout separation, differential sensing, and independent gate drive routing for Core and Northbridge phases.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| ISEN1 / ISEN2 | Core VR phase enable/control | Pulling ISEN2 to +5V disables Phase 2; ISEN1 must be grounded via 10kΩ if ISEN2 is high - enables hardware-configurable 1-/2-phase Core operation. |
| VSEN / VSEN_NB | Differential voltage sense inputs | Connect directly to CPU die +sense pads; RTN serves as shared return - eliminates PCB trace IR drop errors in high-current mobile applications. |
| UGATE1/LGATE1/PHASE1/BOOT1 | Phase 1 gate drive network | Full high-side/low-side drive chain for Core VR Phase 1 - supports discrete MOSFETs with integrated boot diode and dead-time control (23ns/28ns). |
| UGATE_NB/LGATE_NB/PHASE_NB/BOOT_NB | Northbridge VR gate drive | Independent floating driver stage for NB rail - allows separate inductor/layout optimization without coupling to Core VR phases. |
| SVC/SVD/SVT | SVI 2.0 serial interface | Synchronous clock (SVC), bidirectional data (SVD), and telemetry output (SVT) - implements full AMD-defined protocol including VID-on-the-fly and pre-PWROK metal VID. |
| NTC / NTC_NB | Thermal sensor inputs | Accepts NTC thermistors for Core and NB VR temperature monitoring - feeds into VR_HOT_L open-drain thermal alert and dynamic droop adjustment. |
Key Features
| Feature | Design Value |
|---|---|
| R3™ Modulator Architecture | Adaptive switching frequency increases during load transients for faster settling (<10µs), improves light-load efficiency via diode emulation, and maintains <0.5% voltage error without external compensation. |
| Dual Independent VR Control | Core VR (1-/2-phase) and Northbridge VR (1-phase) share SVI bus but operate with independent feedback (FB/FB_NB), compensation (COMP/COMP_NB), and current sensing - reduces BOM count vs. dual-chip solutions. |
| Differential Remote Sensing | VSEN/RTN pair referenced to CPU die sense points - rejects PCB plane resistance errors, enabling ±5mV regulation at 50A Core load. |
| Programmable Load Line & Offset | Resistor-programmed IDROOP and VR offset on both outputs - implements AMD-specified adaptive voltage positioning (AVP) for optimal power/performance tradeoff. |
| Integrated Telemetry | IMON/IMON_NB analog current monitor outputs + SVT digital telemetry - enables real-time power state reporting to AMD CPU without external ADCs. |
Applications
| AMD Mobile APU Core Power | Notebook CPU Voltage Regulation |
|---|---|
|
Use Scenario: Power delivery for AMD Kaveri/Richland mobile APUs in ultrabooks and thin-and-light notebooks. IC Role / Device Role / Timing Role: Dual-VR controller managing Core and Northbridge rails via SVI 2.0, coordinating with CPU for dynamic frequency/voltage scaling. Use Value: Enables compliant AVP implementation with 0.5% accuracy, reducing CPU thermal margin requirements and extending battery life via R3™ light-load efficiency. |
Use Scenario: High-efficiency, compact core power solution for 15W–35W mobile platforms with strict board area constraints. IC Role / Device Role / Timing Role: Integrated gate drivers and dual-VR control eliminate need for external driver ICs, reducing component count by ≥30% vs. discrete controller+driver designs. Use Value: 40-lead 5×5mm TQFN footprint supports dense layouts; shared SVI bus cuts routing layers and signal integrity complexity. |
| Mobile GPU Core Rail | Thermally Constrained Embedded Systems |
|
Use Scenario: Dedicated GPU core voltage regulation in AMD-powered gaming laptops and mobile workstations. IC Role / Device Role / Timing Role: Northbridge VR channel supplies GPU logic rail; uses same SVI 2.0 interface and thermal monitoring as Core VR for synchronized throttling. Use Value: Single-IC dual-rail control ensures matched transient response between CPU and GPU, preventing inter-rail instability during burst workloads. |
Use Scenario: Fanless or passively cooled embedded systems requiring robust thermal management without software intervention. IC Role / Device Role / Timing Role: Hardware-based thermal shutdown via NTC/NTC_NB inputs triggers VR_HOT_L assertion, forcing CPU-initiated throttling before junction exceeds 125°C. Use Value: Eliminates reliance on OS-level thermal drivers; hardwired thermal path ensures fail-safe operation in headless industrial deployments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-output multiphase controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISL62772IRTZ-T | Supports 3-phase Core VR (vs. 2-phase max on ISL62771IRTZ-T); identical SVI 2.0 interface, package, and thermal specs. | Required for higher-power AMD mobile CPUs needing >50A Core current; not pin-compatible due to added PHASE3/UGATE3/LGATE3 pins. | Select ISL62772IRTZ-T only when platform design mandates 3-phase Core VR; otherwise ISL62771IRTZ-T offers lower cost and simpler layout. |
| RTQ2136BGE | Single-output, 6-phase controller with I²C interface; no SVI 2.0 support, no integrated NTC monitoring, different pinout and package (48-QFN). | Targeted at non-AMD platforms (Intel, ARM); requires external level-shifting and thermal ICs to match ISL62771IRTZ-T functionality. | Use RTQ2136BGE only in non-AMD designs where SVI 2.0 is irrelevant; not a functional substitute for AMD-specific implementations. |
Compared with ISL62772IRTZ-T, the ISL62771IRTZ-T provides optimal phase count for mid-power AMD APUs while minimizing gate driver count and layout complexity; versus RTQ2136BGE, it delivers native AMD compliance, integrated thermal sensing, and dual-rail coordination unattainable with generic controllers.
Availability
ISL62771IRTZ-T is available at Aetrix Electronics and suitable for notebook computers, AMD mobile APU core power, and thermally constrained embedded systems requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for ISL62771IRTZ-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics acquired Intersil in 2017 and maintains its high-performance analog and power management portfolio. Renesas is a global semiconductor leader focused on embedded solutions for automotive, industrial, and computing markets.
The ISL62771IRTZ-T belongs to Renesas' AMD-qualified multiphase controller product line, engineered specifically for SVI 2.0-compliant mobile CPU/GPU power delivery with emphasis on thermal resilience, transient response, and integration density.
FAQ
What is the operating temperature range for the ISL62771IRTZ-T?
The ISL62771IRTZ-T is rated for –40°C to +100°C ambient temperature operation, with a maximum junction temperature of +125°C. This extended range supports fanless and high-temperature notebook environments where thermal management is critical. The device's dual NTC inputs (NTC and NTC_NB) provide hardware-monitored thermal protection aligned with AMD SVI 2.0 specifications. All electrical parameters, including 0.8% system accuracy and 280–320kHz switching frequency, are guaranteed across this full range.
Does the ISL62771IRTZ-T support both DCR and resistor-based current sensing?
Yes, the ISL62771IRTZ-T supports both lossless inductor DCR current sensing and precision resistor current sensing on both Core and Northbridge VR outputs. DCR sensing uses internal amplifiers (ISUMP/ISUMN) with single NTC thermistor compensation for temperature drift correction. Resistor sensing employs external shunts with dedicated ISEN1/ISEN2 inputs. The ISL62771IRTZ-T automatically adapts gain and offset calibration for either method, ensuring consistent current monitoring accuracy regardless of implementation choice.
How does the R3™ modulator in the ISL62771IRTZ-T improve transient response?
The R3™ modulator in the ISL62771IRTZ-T dynamically adjusts switching frequency during load transients: COMP voltage rise accelerates master clock generation, increasing effective frequency for faster response, while COMP voltage fall extends off-time to reduce switching losses at light loads. This yields sub-10µs transient settling without compromising steady-state efficiency. Unlike fixed-frequency PWM, the ISL62771IRTZ-T maintains 0.5% voltage accuracy across all load conditions - a key requirement for AMD mobile CPU stability.
Can the ISL62771IRTZ-T be used in single-phase Core VR configurations?
Yes, the ISL62771IRTZ-T supports configurable 1-phase Core VR operation. Pulling ISEN2 to +5V disables Phase 2, and ISEN1 must be tied to GND via a 10kΩ resistor to prevent channel shutdown. This configuration retains full functionality - including R3™ modulation, DCR sensing, and SVI 2.0 telemetry - while simplifying power stage layout and reducing MOSFET count. The Northbridge VR remains active as a dedicated 1-phase regulator, preserving dual-rail capability.
What protection features are integrated into the ISL62771IRTZ-T?
The ISL62771IRTZ-T integrates comprehensive hardware protection: overvoltage (±375mV window), undervoltage, overcurrent (OCP/WOC), phase current imbalance detection (9mV threshold), thermal shutdown (via NTC/NTC_NB), and open-drain PGOOD/PGOOD_NB signals. VR_HOT_L provides a dedicated thermal overload indicator per AMD spec. All protections trigger autonomous fault recovery without host intervention, and the ISL62771IRTZ-T latches or auto-retries based on fault type - ensuring robust operation in unattended notebook and embedded systems.
ISL62771IRTZ-T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- Robust Ripple Regulator™ (R3)
- Package/Case:
- 40-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Controller, AMD Fusion™ SVI 2.0 CPU GPU
- Voltage - Input:
- 4.5V ~ 25V
- Number of Outputs:
- 2
- Voltage - Output:
- 0.006V ~ 1.55V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 40-TQFN (5x5)
ISL62771IRTZ-T FAQ
1.How can I place an order for ISL62771IRTZ-T through Aetrix?
Please submit a Request for Quotation (RFQ) for ISL62771IRTZ-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ISL62771IRTZ-T reliable?
The price and inventory of ISL62771IRTZ-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ISL62771IRTZ-T is usually 5 days.
3.What payment methods are accepted for ISL62771IRTZ-T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ISL62771IRTZ-T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ISL62771IRTZ-T?
ISL62771IRTZ-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ISL62771IRTZ-T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ISL62771IRTZ-T?
For technical support, including ISL62771IRTZ-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ISL62771IRTZ-T requirements.
6.How does Aetrix verify that ISL62771IRTZ-T is sourced from the original manufacturer or authorized distributors?
All ISL62771IRTZ-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ISL62771IRTZ-T meets industry standards.
7.What is the process for return or replacement of ISL62771IRTZ-T?
All ISL62771IRTZ-T units undergo pre-shipment inspection (PSI). If there is an issue with ISL62771IRTZ-T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ISL62771IRTZ-T part is unused and in its original packaging.
Return procedure for ISL62771IRTZ-T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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