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Renesas ISL62773AHRZ-T
- Part No.:
- ISL62773AHRZ-T
- Manufacturer:
- Renesas
- Category:
- Special Purpose Regulators
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
ISL62773AHRZ-T.pdf
- Description:
- IC REG CTRLR MULTIPH 2OUT 48QFN
- Quantity:
- Payment:
- Shipping:
Inventory:3,327
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Product details
Overview
ISL62773AHRZ-T from Renesas Electronics (formerly Intersil) is a dual-output, multiphase PWM controller IC designed specifically for AMD Fusion™ mobile CPU/GPU core power delivery using SVI 2.0 interface. It integrates three gate drivers, supports 3-/2-/1-phase Core VR and 2-/1-phase Northbridge VR, delivers 0.5% system voltage accuracy over temperature, operates from 4.5V–25V VIN, and uses R3™ ripple-based modulation for fast transient response in notebook applications.
For engineers reviewing the ISL62773AHRZ-T datasheet, ISL62773AHRZ-T pinout, ISL62773AHRZ-T application, or ISL62773AHRZ-T equivalent, key selection criteria include SVI 2.0 serial bus compliance (100kHz–25MHz), dual-VR shared control architecture, DCR/resistor current sensing support, differential remote sensing, programmable slew rate (8–24 mV/µs), and thermal monitoring with NTC inputs for both Core and Northbridge rails.
Technical Context
The ISL62773AHRZ-T implements two independent voltage regulator (VR) modulators - one for CPU core and one for Northbridge - sharing a single AMD SVI 2.0 serial interface to reduce component count and PCB area. Its Robust Ripple Regulator R3™ technology dynamically adjusts switching frequency during load transients to improve settling time and light-load efficiency.
Each VR supports lossless DCR current sensing with single NTC thermistor compensation or precision resistor sensing, differential remote voltage sense (FB/FB2 and FB_NB/VSEN_NB), and programmable load line droop. Protection includes OCP/WOC, OVP/UVP, PGOOD, and thermal monitoring via dedicated NTC inputs (NTC and NTC_NB) driving open-drain VR_HOT_L.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Voltage Accuracy | ±0.5% over temperature (0.5V–1.55V range); ensures tight regulation for AMD CPU VID steps of 6.25mV. |
| SVI 2.0 Interface | 100kHz–25MHz serial clock; enables dynamic VID-on-the-fly updates and telemetry exchange with AMD processors. |
| Switching Frequency | Programmable 280–450kHz per VR; supports CCM operation with adaptive body diode conduction reduction. |
| Current Sensing | DCR or precision resistor methods supported on both outputs; eliminates need for shunt resistors and reduces power loss. |
| Thermal Monitoring | Dual NTC inputs (NTC, NTC_NB); triggers VR_HOT_L active-low thermal indicator at 600–680mV warning threshold. |
| Gate Drivers | Three integrated drivers (UGATE1/LGATE1, UGATE2/LGATE2, UGATEX/LGATEX); supports up to 3-phase Core + 2-phase NB configurations. |
| VID Slew Rate | Programmable 8–24 mV/µs; controls voltage transition speed during frequency/voltage scaling to prevent overshoot/undershoot. |
Pinout & Package
ISL62773AHRZ-T is housed in a Pb-free, RoHS-compliant 48-lead 6mm × 6mm QFN package with exposed thermal pad (Package Drawing L48.6x6B). The package supports high-density notebook layouts and efficient thermal dissipation via the bottom GND pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| ISEN1, ISEN2, ISEN3 | Core VR phase enable/sense inputs | Pull to +5V disables corresponding phase; enables flexible 1-/2-/3-phase Core VR configuration. |
| ISEN1_NB, ISEN2_NB | Northbridge VR phase enable/sense inputs | Pull to +5V disables respective NB phase; supports 1-/2-phase NB VR operation. |
| UGATE1, LGATE1, PHASE1, BOOT1 | Phase 1 gate drive interface | Drives high-side/low-side MOSFETs for Core VR Phase 1; boot capacitor required between BOOT1 and PHASE1. |
| UGATE2, LGATE2, PHASE2, BOOT2 | Phase 2 gate drive interface | Drives high-side/low-side MOSFETs for Core VR Phase 2; identical boot architecture to Phase 1. |
| UGATEX, LGATEX, PHASEX, BOOTX | Programmable gate driver | Configurable via FCCM_NB resistor for either Core Phase 3 or NB Phase 1; enables dual-VR flexibility without external drivers. |
| SVC, SVD, SVT | SVI 2.0 serial interface | SVC = clock, SVD = bidirectional data, SVT = telemetry output; implements AMD-defined protocol for VID and IMON reporting. |
| VSEN, FB, COMP, FB2 | Core VR feedback network | VSEN/FB provide differential remote sense; COMP sets offset; FB2 enables 1-phase compensation tuning. |
| VSEN_NB, FB_NB, COMP_NB | Northbridge VR feedback network | Independent error amplifier path with dedicated compensation (COMP_NB) and sense (VSEN_NB/FB_NB). |
| NTC, NTC_NB | Thermal sensor inputs | Connect to NTC thermistors on Core/NB power stages; used by internal VR_HOT_L circuit for thermal warning/shutdown. |
| PGOOD, PGOOD_NB | Open-drain power-good indicators | Asserted after soft-start and fault clearance; require external pull-up to VDDP or 3.3V for system sequencing. |
Key Features
| Feature | Design Value |
|---|---|
| R3™ Modulation Architecture | Enables automatic frequency adjustment during load transients, reducing voltage deviation and improving light-load efficiency vs. fixed-frequency PWM. |
| Dual-VR Shared SVI 2.0 Bus | Eliminates second serial interface, saving PCB space and BOM cost while maintaining independent control of Core and Northbridge rails. |
| Programmable VID Slew Rate | 8–24 mV/µs range allows precise tuning of voltage transition speed during P-state changes, preventing instability or excessive inrush. |
| Adaptive Body Diode Conduction Reduction | Minimizes reverse conduction losses in low-side MOSFETs during light-load discontinuous conduction mode (DCM), boosting efficiency. |
| Differential Remote Voltage Sense | Compensates for IR drop across PCB traces and connectors, ensuring accurate die-level voltage regulation at CPU/NB pads. |
| Telemetry Support (IMON/IMON_NB) | Provides analog current monitor outputs proportional to Core/NB output currents, enabling real-time power estimation and thermal management. |
Applications
| AMD Mobile CPU Core Power | AMD Mobile GPU/Northbridge Power |
|---|---|
|
Use Scenario: Power delivery for AMD Fusion A-series or E-series APUs in ultrathin notebooks and 2-in-1 convertible devices. IC Role / Device Role / Timing Role: Dual-output multiphase PWM controller managing Core VR (up to 3-phase) and Northbridge VR (up to 2-phase) with synchronized SVI 2.0 communication. Use Value: Enables dynamic voltage/frequency scaling per AMD specification while maintaining ±0.5% regulation accuracy and fast transient response under CPU burst loads. |
Use Scenario: Dedicated power rail for integrated graphics and memory controller in AMD mobile platforms requiring independent voltage control. IC Role / Device Role / Timing Role: Secondary VR channel with separate feedback loop (FB_NB/VSEN_NB), programmable load line, and thermal monitoring (NTC_NB). Use Value: Prevents GPU throttling by delivering stable voltage under variable graphics workloads and provides thermal warning via VR_HOT_L signal. |
| Notebook System Power Sequencing | Thermally Adaptive Power Management |
|
Use Scenario: Coordinating power-up sequence between CPU core, GPU, and platform logic in Windows-based laptops with ACPI-compliant firmware. IC Role / Device Role / Timing Role: Uses PWROK input to gate SVI 2.0 activation and generates PGOOD/PGOOD_NB outputs for motherboard power sequencing logic. Use Value: Ensures proper startup order per AMD SVI 2.0 Controller Guidelines, avoiding premature processor initialization or latch-up conditions. |
Use Scenario: Real-time thermal protection for CPU and GPU power stages in fanless or thermally constrained designs. IC Role / Device Role / Timing Role: Monitors two independent NTC thermistors (NTC, NTC_NB) and asserts open-drain VR_HOT_L signal when thresholds are exceeded. Use Value: Triggers CPU throttling or system shutdown before junction temperatures exceed safe limits, extending reliability in compact enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-output multiphase VR controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISL62771AHRZ-T | Single-output (Core-only) version; lacks Northbridge VR channel, FB_NB, NTC_NB, and PWM2_NB pins. | Only suitable for platforms where Northbridge power is integrated or supplied externally; no NB telemetry or thermal monitoring. | Select ISL62771AHRZ-T only when Northbridge VR functionality is unnecessary and board space must be minimized. |
| RT8803AZSP | Single-chip dual-VR controller with integrated MOSFET drivers but no SVI 2.0 interface; uses proprietary digital interface and fixed VID mapping. | Requires redesign of CPU interface logic and firmware; incompatible with AMD SVI 2.0 host protocol and VID-on-the-fly commands. | Choose RT8803AZSP only for non-AMD platforms or custom embedded systems lacking SVI 2.0 support. |
Compared with ISL62771AHRZ-T, the ISL62773AHRZ-T adds full Northbridge VR control and telemetry, while RT8803AZSP offers higher integration but sacrifices AMD compatibility - making ISL62773AHRZ-T the only drop-in solution for SVI 2.0-compliant AMD mobile designs.
Availability
ISL62773AHRZ-T is available at Aetrix Electronics and suitable for notebook computers, AMD Fusion-based embedded systems, and mobile thin-client platforms requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for ISL62773AHRZ-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics acquired Intersil in 2017 and maintains its high-performance analog and power management portfolio. Renesas is a global leader in microcontrollers, analog, power, and SoC products for automotive, industrial, and computing markets.
The ISL62773AHRZ-T belongs to Renesas' legacy Intersil multiphase VR controller family, engineered specifically for AMD mobile CPU/GPU core power delivery with SVI 2.0 compliance, R3™ modulation, and dual-rail thermal management.
FAQ
What is the operating temperature range for the ISL62773AHRZ-T?
The ISL62773AHRZ-T is rated for ambient operation from –10°C to +100°C (HRZ grade). Its junction temperature must remain within –10°C to +125°C under normal operation. Thermal design must account for power dissipation in the 48-lead QFN package, especially when driving multiple phases at high current. The device includes dual NTC inputs (NTC and NTC_NB) to monitor thermal conditions of both Core and Northbridge power stages.
Does the ISL62773AHRZ-T support both DCR and resistor-based current sensing?
Yes, the ISL62773AHRZ-T supports both lossless inductor DCR current sensing and precision resistor current sensing on both Core and Northbridge VR outputs. DCR sensing uses the ISUMP/ISUMN and ISUMP_NB/ISUMN_NB differential inputs with optional NTC compensation, while resistor sensing connects directly to ISENx pins. This flexibility allows designers to optimize for efficiency (DCR) or accuracy (resistor) based on application requirements.
How does the ISL62773AHRZ-T implement AMD SVI 2.0 compliance?
The ISL62773AHRZ-T implements full AMD SVI 2.0 compliance through dedicated pins: SVC (serial clock), SVD (bidirectional data), and SVT (telemetry output). It supports VID-on-the-fly updates, dynamic load line adjustment, and real-time current telemetry (IMON/IMON_NB) as defined in the AMD specification. The interface operates from 100kHz to 25MHz and requires PWROK assertion before SVI 2.0 protocol activation.
Can the ISL62773AHRZ-T be configured for different phase counts on Core and Northbridge VRs?
Yes, the ISL62773AHRZ-T supports independent phase configuration: Core VR can be set to 3-, 2-, or 1-phase via ISEN1/ISEN2/ISEN3 pin states, while Northbridge VR supports 2- or 1-phase via ISEN1_NB/ISEN2_NB. The programmable driver (UGATEX/LGATEX/PHASEX/BOOTX) is assigned to either Core Phase 3 or NB Phase 1 using the FCCM_NB resistor, enabling hardware-selectable topology without firmware changes.
What protection features are integrated into the ISL62773AHRZ-T?
The ISL62773AHRZ-T integrates comprehensive protection: overvoltage (OVP) and undervoltage (UVP) detection on both VR outputs, overcurrent protection (OCP/WOC) per phase using IMON-based or voltage-based thresholds, current imbalance detection, thermal monitoring via dual NTC inputs, and open-drain PGOOD/PGOOD_NB signals. Fault recovery is automatic after condition clearance, and VR_HOT_L provides active-low thermal overload indication to the CPU.
ISL62773AHRZ-T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- Robust Ripple Regulator™ (R3)
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Controller, AMD Fusion™ SVI 2.0 CPU GPU
- Voltage - Input:
- 4.5V ~ 25V
- Number of Outputs:
- 2
- Voltage - Output:
- 0.006V ~ 1.55V
- Operating Temperature:
- -10°C ~ 100°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-QFN (6x6)
ISL62773AHRZ-T FAQ
1.How can I place an order for ISL62773AHRZ-T through Aetrix?
Please submit a Request for Quotation (RFQ) for ISL62773AHRZ-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ISL62773AHRZ-T reliable?
The price and inventory of ISL62773AHRZ-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ISL62773AHRZ-T is usually 5 days.
3.What payment methods are accepted for ISL62773AHRZ-T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ISL62773AHRZ-T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ISL62773AHRZ-T?
ISL62773AHRZ-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ISL62773AHRZ-T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ISL62773AHRZ-T?
For technical support, including ISL62773AHRZ-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ISL62773AHRZ-T requirements.
6.How does Aetrix verify that ISL62773AHRZ-T is sourced from the original manufacturer or authorized distributors?
All ISL62773AHRZ-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ISL62773AHRZ-T meets industry standards.
7.What is the process for return or replacement of ISL62773AHRZ-T?
All ISL62773AHRZ-T units undergo pre-shipment inspection (PSI). If there is an issue with ISL62773AHRZ-T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ISL62773AHRZ-T part is unused and in its original packaging.
Return procedure for ISL62773AHRZ-T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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