My Inquiry
My Account
Renesas ISL62773AIRZ
- Part No.:
- ISL62773AIRZ
- Manufacturer:
- Renesas
- Category:
- Special Purpose Regulators
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
ISL62773AIRZ.pdf
- Description:
- IC REG CTRLR MULTIPH 2OUT 48QFN
- Quantity:
- Payment:
- Shipping:
Inventory:2,604
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
ISL62773AIRZ from Renesas (formerly Intersil) is a dual-output multiphase PWM controller for AMD Fusion™ mobile CPU/GPU core power delivery, compliant with SVI 2.0 interface. It integrates three gate drivers, supports 3-/2-/1-phase Core VR and 2-/1-phase Northbridge VR, delivers 0.5% system voltage accuracy over temperature, operates from 0.5V to 1.55V in 6.25mV steps, and uses R3™ modulator technology for adaptive switching frequency and fast transient response - deployed in high-efficiency notebook power subsystems.
For engineers reviewing the ISL62773AIRZ datasheet, ISL62773AIRZ pinout, ISL62773AIRZ application, or ISL62773AIRZ equivalent, key selection criteria include SVI 2.0 serial bus compatibility (100kHz–25MHz), dual-VR shared control architecture, DCR/resistor current sensing support, differential remote sensing, and thermal monitoring via dual NTC inputs for Core and Northbridge rails.
Technical Context
The ISL62773AIRZ implements two independent voltage regulator (VR) control loops - Core VR (up to 3-phase) and Northbridge VR (up to 2-phase) - sharing a single AMD SVI 2.0 serial bus for VID programming and telemetry. Its Robust Ripple Regulator R3™ modulator dynamically adjusts switching frequency during load transients to reduce settling time while maintaining high light-load efficiency.
Each VR supports lossless DCR current sensing with single NTC thermistor compensation or precision resistor-based sensing, differential remote voltage sense (FB/VSEN/RTN), programmable load line droop, and independent OCP/WOC, OVP, UVP, and thermal fault protection. The floating PWM_Y and BOOTX/UGATEX/PHASEX/LGATEX driver enables flexible configuration for either Core Phase 3 or Northbridge Phase 1.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| SVI 2.0 Interface | Serial VID clock range 100kHz–25MHz; bidirectional SVD, clock SVC, telemetry SVT - enables dynamic VID-on-the-fly updates and real-time IMON/VCORE/NB_V telemetry to AMD CPU. |
| Output Voltage Range | 0.5V–1.55V in 6.25mV steps; supports full AMD mobile CPU core and Northbridge VID tables with ±0.5% system accuracy over –40°C to +100°C ambient. |
| Switching Frequency | Programmable 280–450kHz per VR; R3™ modulator auto-adjusts frequency during transients to optimize response and efficiency across load range. |
| Current Sensing | DCR-based (inductor resistance) or precision resistor sensing on both VRs; single NTC input per VR enables temperature-compensated DCR tracking. |
| Protection Features | OCP/WOC (way-overcurrent), OVP/UVP (±375mV threshold), thermal shutdown (NTC voltage ≤530mV), and phase current imbalance detection (9mV threshold). |
| Package | 48-pin 6×6mm QFN with exposed thermal pad; RoHS-compliant, Pb-free; θJA = 29°C/W, θJC = 3.5°C/W - optimized for high-power density notebook VR designs. |
Pinout & Package
ISL62773AIRZ uses a 48-lead 6×6mm QFN package with exposed GND pad for thermal dissipation. Pin functions are validated per FN8410 Rev 1.00 datasheet (Pages 8–9).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| ISEN1 / ISEN2 / ISEN3 | Core VR channel enable/sense inputs | Pull to +5V disables corresponding Core phase; ISEN1 must be grounded via 10kΩ if ISEN2 is high - configures 1-/2-/3-phase Core operation. |
| ISEN1_NB / ISEN2_NB | Northbridge VR channel enable/sense inputs | Same logic as Core: ISEN2_NB high disables NB Phase 2; ISEN1_NB high shuts down entire Northbridge VR. |
| UGATE1 / LGATE1 / PHASE1 / BOOT1 | Phase 1 gate drive interface | Drives high-side/low-side MOSFETs for Core Phase 1; BOOT1–PHASE1 capacitor provides high-side gate bias; PHASE1 connects to HS source/LS drain node. |
| UGATEX / LGATEX / PHASEX / BOOTX | Floating driver for Core Phase 3 or NB Phase 1 | Configured by FCCM_NB resistor value; supports either third Core phase or first Northbridge phase - eliminates need for external driver IC. |
| SVC / SVD / SVT / PWROK | SVI 2.0 serial interface & system handshake | SVC clocks SVD data; SVT returns telemetry; PWROK high enables SVI protocol and validates system power-good sequencing per AMD guidelines. |
| VSEN / VSEN_NB / RTN | Differential remote voltage sensing | VSEN/VSEN_NB connect to +sense pins of CPU die; RTN connects to common –sense return - rejects PCB IR drop for precise regulation at point-of-load. |
| NTC / NTC_NB | Thermal monitor inputs | Accept NTC thermistors to track Core/Northbridge VR temperature; feed VR_HOT_L open-drain output for CPU thermal throttling coordination. |
| PGOOD / PGOOD_NB | Open-drain power-good indicators | Asserted after soft-start, OVP/UVP clear, and regulation achieved; require external pull-up to VDDP or 3.3V - signal VR readiness to system logic. |
Key Features
| Feature | Design Value |
|---|---|
| R3™ Adaptive Modulation | Automatically increases switching frequency during load steps to reduce voltage deviation and settling time - improves transient response without sacrificing light-load efficiency. |
| Dual Independent VR Control | Single IC manages both CPU core and GPU/Northbridge power rails with separate feedback, current sensing, and protection - reduces BOM count vs. dual-controller solutions. |
| Flexible Phase Configuration | Core VR supports 1/2/3-phase; Northbridge VR supports 1/2-phase; floating PWM_Y and driver X allow hardware-selectable assignment - adapts to CPU TDP and board space constraints. |
| VID-on-the-Fly Slew Rate Control | Programmable 8–24mV/µs slew rate prevents excessive dI/dt during dynamic VID changes - maintains stable current balance and avoids false OCP triggers. |
| Integrated Thermal Monitoring | Dual NTC inputs (NTC/NTC_NB) feed dedicated thermal comparators driving VR_HOT_L - enables coordinated CPU thermal throttling and VR thermal shutdown at 530–630mV thresholds. |
Applications
| AMD Mobile CPU Core Power | AMD Mobile GPU/Northbridge Power |
|---|---|
Use Scenario: High-efficiency, tightly regulated power delivery to AMD Fusion A-series or E-series mobile CPU cores in ultrabooks and thin-and-light notebooks. IC Role / Device Role / Timing Role: Primary multiphase PWM controller managing up to 3-phase Core VR with SVI 2.0 interface, R3™ modulation, and DCR current sensing. Use Value: Enables <1.5% total voltage error across –40°C to +100°C, supports dynamic frequency scaling via VID-on-the-fly, and achieves >90% peak efficiency at 1.1V/30A (VIN=12V). | Use Scenario: Dedicated low-noise, fast-response power rail for integrated AMD Radeon GPU or Northbridge logic in mobile APUs. IC Role / Device Role / Timing Role: Secondary VR controller within same IC managing 1- or 2-phase Northbridge output with independent feedback, telemetry, and thermal monitoring. Use Value: Eliminates second controller IC; shares SVI bus to reduce routing complexity; delivers 0.5% accuracy and differential sensing to maintain GPU stability under burst workloads. |
| Notebook System Power Sequencing | Thermally Adaptive Mobile Platform |
Use Scenario: Coordinated startup, power-good assertion, and fault handling across CPU core and GPU rails in Windows/Linux notebook platforms. IC Role / Device Role / Timing Role: Dual PGOOD outputs (PGOOD/PGOOD_NB) and PWROK handshake ensure correct boot sequence per AMD SVI 2.0 Controller Guidelines. Use Value: Guarantees Core VR powers up before NB VR; prevents premature CPU exit from reset; simplifies firmware timing requirements via hardware-synchronized ready signals. | Use Scenario: Real-time thermal management for mobile APUs where CPU and GPU share thermal envelope. IC Role / Device Role / Timing Role: Dual NTC inputs (NTC/NTC_NB) feed independent thermal comparators that drive VR_HOT_L - signals CPU to throttle before silicon damage. Use Value: Prevents thermal runaway by triggering CPU frequency reduction at 600–680mV NTC voltage (warning) and hard shutdown at ≤530mV - matches AMD thermal specification limits. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multiphase VR controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISL62771AIRZ | Single-output (Core-only) version; no Northbridge VR channel, no ISEN1_NB/ISEN2_NB, no VSEN_NB/COMP_NB pins; identical R3™ modulator and SVI 2.0 interface. | Supports only CPU core power; cannot replace ISL62773AIRZ in dual-rail APU designs requiring independent GPU/NB regulation. | Select when platform uses discrete GPU or separates NB power - reduces cost and layout area where dual VR not required. |
| RTQ2136BGE | Single-core 3+1 phase controller with I2C (not SVI 2.0); no native AMD serial interface; requires external level-shifting and firmware translation layer for VID updates. | Targeted at generic x86 or ARM SoC platforms; lacks SVI 2.0 telemetry (IMON_NB, SVT) and AMD-specific power state coordination. | Use only in non-AMD designs or custom firmware environments; not drop-in compatible due to interface and feature mismatch. |
Compared with ISL62773AIRZ, ISL62771AIRZ removes Northbridge functionality to lower cost and pin count but sacrifices dual-rail integration, while RTQ2136BGE offers higher phase count flexibility but lacks native SVI 2.0 compliance - making ISL62773AIRZ uniquely suited for AMD Fusion mobile APU reference designs.
Availability
ISL62773AIRZ is available at Aetrix Electronics and suitable for notebook computer power delivery, AMD APU core/Northbridge regulation, and thermally constrained mobile embedded systems requiring stable component supply across extended temperature ranges.
Supply support for ISL62773AIRZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics acquired Intersil in 2017 and continues its high-performance analog and power management portfolio. Renesas is a global semiconductor leader focused on embedded solutions for automotive, industrial, and computing markets.
The ISL62773AIRZ belongs to Renesas' AMD-qualified multiphase VR controller product line, designed specifically for energy-efficient, thermally aware power delivery to mobile APUs - emphasizing SVI 2.0 interoperability, R3™ transient performance, and dual-rail integration.
FAQ
What is the operating temperature range for the ISL62773AIRZ?
The ISL62773AIRZ is rated for –40°C to +100°C ambient temperature (IRZ grade), with junction temperature up to +125°C. This extended range supports deployment in thermally demanding notebook chassis and ensures reliable operation under sustained CPU/GPU load conditions. The device's thermal monitor inputs (NTC/NTC_NB) provide real-time die temperature feedback to coordinate throttling.
Does the ISL62773AIRZ support both DCR and resistor-based current sensing?
Yes, the ISL62773AIRZ supports both lossless inductor DCR current sensing and precision resistor current sensing on both Core and Northbridge VR outputs. Each VR has dedicated ISUMP/ISUMN and ISUMP_NB/ISUMN_NB inputs, and the datasheet provides detailed network design equations for both methods - enabling optimization for cost, accuracy, or thermal drift compensation.
How does the ISL62773AIRZ implement AMD SVI 2.0 compliance?
The ISL62773AIRZ implements full AMD SVI 2.0 compliance via dedicated pins: SVC (clock), SVD (bidirectional data), and SVT (telemetry). It supports 100kHz–25MHz clock rates, VID-on-the-fly updates with programmable slew rate (8–24mV/µs), and real-time telemetry including IMON, VCORE, and NB_V - all synchronized to AMD's defined protocol timing and power-state transitions.
Can the ISL62773AIRZ be configured for 1-phase Core and 1-phase Northbridge operation?
Yes, the ISL62773AIRZ supports 1+1 configuration: tie ISEN2 and ISEN2_NB to +5V to disable Core Phase 2 and NB Phase 2, leaving ISEN1 and ISEN1_NB active. The floating driver (UGATEX/PHASEX/LGATEX) remains unused in this mode. Figure 6 of FN8410 shows the simplified application circuit for this low-power CPU configuration.
What protection features are integrated into the ISL62773AIRZ?
The ISL62773AIRZ integrates comprehensive protection: overvoltage (±375mV), undervoltage (±375mV), way-overcurrent (WOC), cycle-by-cycle overcurrent (OCP), phase current imbalance (>9mV), thermal shutdown (NTC ≤530mV), and VR_HOT_L thermal warning. All protections feature latch-off or auto-retry behavior configurable via external components - ensuring robust operation in mobile platforms with variable loads.
ISL62773AIRZ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- Robust Ripple Regulator™ (R3)
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tube
- Product Status:
- Obsolete
- Applications:
- Controller, AMD Fusion™ SVI 2.0 CPU GPU
- Voltage - Input:
- 4.5V ~ 25V
- Number of Outputs:
- 2
- Voltage - Output:
- 0.006V ~ 1.55V
- Operating Temperature:
- -40°C ~ 100°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-QFN (6x6)
ISL62773AIRZ FAQ
1.How can I place an order for ISL62773AIRZ through Aetrix?
Please submit a Request for Quotation (RFQ) for ISL62773AIRZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ISL62773AIRZ reliable?
The price and inventory of ISL62773AIRZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ISL62773AIRZ is usually 5 days.
3.What payment methods are accepted for ISL62773AIRZ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ISL62773AIRZ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ISL62773AIRZ?
ISL62773AIRZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ISL62773AIRZ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ISL62773AIRZ?
For technical support, including ISL62773AIRZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ISL62773AIRZ requirements.
6.How does Aetrix verify that ISL62773AIRZ is sourced from the original manufacturer or authorized distributors?
All ISL62773AIRZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ISL62773AIRZ meets industry standards.
7.What is the process for return or replacement of ISL62773AIRZ?
All ISL62773AIRZ units undergo pre-shipment inspection (PSI). If there is an issue with ISL62773AIRZ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ISL62773AIRZ part is unused and in its original packaging.
Return procedure for ISL62773AIRZ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ISL62773AIRZ Tags
-
TPS51206DSQR
Texas Instruments
-
TPS51200DRCR
Texas Instruments
-
TPS51200DRCT
Texas Instruments
-
TPS62740DSSR
Texas Instruments
-
TPS51100DGQR
Texas Instruments
-
NCP51200MNTXG
onsemi
-
NCP51400MNTXG
onsemi
-
RT9026GSP
Richtek USA Inc.
-
LP2998MRX/NOPB
Texas Instruments
-
TPS51200QDRCRQ1
Texas Instruments
-
DPA423GN-TL
Power Integrations
-
LM10011SD/NOPB
Texas Instruments
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
