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Renesas ISL62773AIRZ-T
- Part No.:
- ISL62773AIRZ-T
- Manufacturer:
- Renesas
- Category:
- Special Purpose Regulators
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
ISL62773AIRZ-T.pdf
- Description:
- IC REG CTRLR MULTIPH 2OUT 48QFN
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
ISL62773AIRZ-T from Renesas (formerly Intersil) is a dual-output, multiphase PWM controller IC designed specifically for AMD Fusion™ mobile CPU/GPU core power delivery using SVI 2.0 interface. It integrates three gate drivers, supports 3-/2-/1-phase Core VR and 2-/1-phase Northbridge VR, delivers 0.5% system voltage accuracy over temperature, operates from 4.5V–25V VIN, and uses R3™ ripple-based modulation for fast transient response in notebook applications.
For engineers reviewing the ISL62773AIRZ-T datasheet, ISL62773AIRZ-T pinout, ISL62773AIRZ-T application, or ISL62773AIRZ-T equivalent, key selection criteria include SVI 2.0 serial bus compliance (100kHz–25MHz), dual-VR shared control architecture, DCR/resistor current sensing support, differential remote sensing, and programmable slew rate (8–24 mV/µs) for dynamic VID transitions.
Technical Context
The ISL62773AIRZ-T implements two independent voltage regulator (VR) channels - Core VR and Northbridge VR - sharing a single AMD SVI 2.0 serial interface for VID programming and telemetry. Its Robust Ripple Regulator (R3™) modulator dynamically adjusts switching frequency during load transients to improve settling time and light-load efficiency.
Each VR supports lossless DCR current sensing with NTC-based temperature compensation or precision resistor sensing, differential remote voltage sense (FB/FB2/RTN/VSEN/VSEN_NB), and independent programmable parameters including switching frequency (300–450 kHz), load line droop, offset, and VID slew rate. Protection includes OCP/WOC, OVP, UVP, thermal monitor, and PGOOD signaling.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VIN Range | 4.5V to 25V - supports wide-input notebook battery rails including 3-cell Li-ion (10.8V nominal) and 4-cell (14.4V nominal) configurations. |
| Output Voltage Range | 0.5V to 1.55V in 6.25mV steps - matches AMD SVI 2.0 VID code resolution for precise microprocessor core/NB voltage setting. |
| System Accuracy | ±0.8% over -40°C to +100°C - ensures stable CPU/NB operation across industrial-grade thermal envelope without calibration. |
| Switching Frequency | 300 kHz nominal, adjustable 300–450 kHz - balances efficiency, component size, and EMI in high-density mobile PCB layouts. |
| VID Slew Rate | Programmable 8–24 mV/µs - controls rate of voltage transition during P-state changes to prevent overshoot/undershoot in dynamic CPU scaling. |
| Current Sensing | DCR-based (with NTC compensation) or precision resistor - enables accurate phase current balancing and thermal derating without shunt losses. |
| Package | 48-pin 6×6 mm QFN, RoHS-compliant, exposed thermal pad - optimized for thermal dissipation in space-constrained notebook VRMs. |
Pinout & Package
ISL62773AIRZ-T is housed in a 48-lead 6×6 mm QFN package with an exposed thermal pad (GND) on the bottom. The package supports Pb-free reflow per JEDEC J-STD-020 and has θJA = 29°C/W and θJC = 3.5°C/W.
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| ENABLE | Global enable input | Active-high logic signal enabling both Core and Northbridge VRs; must be asserted before PWROK to comply with AMD SVI 2.0 startup sequence. |
| SVC / SVD / SVT | SVI 2.0 serial interface | SVC = clock, SVD = bidirectional data, SVT = telemetry output - implements full AMD-defined protocol for VID update, telemetry readback, and fault reporting. |
| UGATE1–UGATEX, LGATE1–LGATEX | Integrated gate drivers | Three dedicated high-side/low-side driver pairs (UGATE1/LGATE1, UGATE2/LGATE2, UGATEX/LGATEX) support flexible 3+2, 2+1, or 1+1 phase configurations. |
| ISEN1–ISEN3, ISEN1_NB–ISEN2_NB | Phase current sense inputs | Individual pins per phase enable hardware-configurable phase count (e.g., tie ISEN2 to +5V to disable Phase 2); support DCR or resistor sensing topologies. |
| VSEN / VSEN_NB / RTN | Differential remote sense | VSEN/VSEN_NB connect to CPU die +sense points; RTN connects to common -sense return - eliminates PCB IR drop error for tight regulation at point-of-load. |
| PGOOD / PGOOD_NB | Open-drain power-good indicators | Asserted after soft-start completion and voltage regulation lock; require external pull-up to VDDP or 3.3V to signal system readiness to CPU. |
Key Features
| Feature | Design Value |
|---|---|
| AMD SVI 2.0 Compliance | Fully implements serial VID interface with 100kHz–25MHz clock range, pre-PWROK metal VID, and VID-on-the-fly slew control for seamless CPU P-state transitions. |
| R3™ Modulator Architecture | Adaptively varies switching frequency during load steps to reduce transient undershoot/overshoot and improve light-load efficiency without compromising stability. |
| Dual-VR Shared Bus | Single SVI 2.0 bus controls both Core and Northbridge VRs - reduces BOM cost, simplifies routing, and eliminates inter-chip timing skew versus dual-controller solutions. |
| Programmable Load Line & Droop | Independent VR offset, droop slope, and dynamic trim allow precise implementation of AMD-specified load-line behavior for thermal-aware voltage positioning. |
| Thermal Monitoring with NTC | Dual NTC inputs (NTC, NTC_NB) feed VR_HOT_L open-drain thermal alert - provides hardware-level thermal shutdown coordination with AMD CPU via SVI 2.0. |
| Telemetry Support | IMON/IMON_NB analog current monitor outputs and digital telemetry via SVT enable real-time system-level power monitoring and diagnostics. |
Applications
| AMD Mobile CPU Core Power | AMD Mobile GPU/Northbridge Power |
|---|---|
|
Use Scenario: Power delivery for AMD A-series or E-series APUs in ultrabooks and thin-and-light notebooks requiring dynamic voltage scaling across P-states. IC Role / Device Role / Timing Role: Dual-channel multiphase PWM controller managing Core VR (up to 3-phase) and Northbridge VR (up to 2-phase) with synchronized SVI 2.0 command execution. Use Value: Enables <1.5% total voltage error across -40°C to +100°C ambient while supporting rapid 20A/µs load steps typical of burst-mode CPU workloads. |
Use Scenario: Dedicated voltage regulation for integrated Radeon graphics cores in AMD Fusion platforms where NB voltage must track Core with independent load line. IC Role / Device Role / Timing Role: Secondary VR channel with independent current sensing, remote sense, and telemetry - coordinated with Core VR via shared SVI bus. Use Value: Eliminates need for separate NB controller IC, reducing solution footprint by >30% and improving inter-rail timing alignment for simultaneous GPU/CPU boost states. |
| Notebook Platform VRM | Thermally Constrained Mobile Designs |
|
Use Scenario: High-efficiency, compact VRM design for 13–15" consumer notebooks targeting >90% peak efficiency at 20A Core load and <100mW quiescent power. IC Role / Device Role / Timing Role: Integrated gate drivers, R3™ modulator, and DCR sensing minimize external components - only requires MOSFETs, inductors, and bulk capacitors. Use Value: Achieves 92% efficiency at 1.1V/25A (VIN=12V) per Figure 1, with no external current sense resistors needed when using DCR sensing. |
Use Scenario: Thermal management in fanless or passive-cooled tablets and 2-in-1 convertibles where VR temperature directly impacts system acoustics and reliability. IC Role / Device Role / Timing Role: Dual NTC inputs (NTC, NTC_NB) feed hardware thermal comparator driving VR_HOT_L signal - triggers CPU thermal throttling before silicon junction exceeds safe limits. Use Value: Provides sub-50ms thermal fault response with 20mV hysteresis, preventing sustained >125°C junction temperatures under sustained 35W TDP loads. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multiphase VR controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISL62771AIRZ-T | Single-output version; supports only Core VR (3-/2-/1-phase), no Northbridge VR channel or SVI 2.0 NB interface. | Limited to CPU-only power delivery; cannot replace ISL62773AIRZ-T in dual-VR AMD platforms requiring NB voltage control. | Select only if design uses discrete NB regulator or does not implement AMD SVI 2.0 Northbridge control. |
| RTQ2136BGQW-T | Single-output, 6-phase controller with PMBus interface; no SVI 2.0 support, no integrated NTC thermal monitor, different pinout and feature set. | Requires firmware adaptation for AMD platform integration; lacks hardware VR_HOT_L signaling and SVI-specific telemetry features. | Consider only for non-AMD x86 or ARM-based designs where PMBus compatibility and higher phase count outweigh SVI 2.0 requirements. |
Compared with ISL62773AIRZ-T, ISL62771AIRZ-T omits Northbridge VR functionality entirely, while RTQ2136BGQW-T replaces SVI 2.0 with PMBus and removes AMD-specific thermal and telemetry hardware - making both unsuitable as drop-in replacements but viable for simplified or non-AMD architectures.
Availability
ISL62773AIRZ-T is available at Aetrix Electronics and suitable for notebook computing, AMD APU platform development, and thermally constrained mobile embedded systems requiring stable component supply and long-term lifecycle support.
Supply support for ISL62773AIRZ-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics acquired Intersil in 2017 and maintains full technical and manufacturing continuity for its high-performance analog and power management portfolio.
The ISL62773AIRZ-T belongs to Renesas' AMD-optimized VR controller product line, engineered specifically for low-voltage, high-current CPU/GPU core power delivery in mobile computing platforms with strict thermal and efficiency requirements.
FAQ
What is the operating temperature range for the ISL62773AIRZ-T?
The ISL62773AIRZ-T is rated for -40°C to +100°C ambient temperature operation, with maximum junction temperature of +125°C. This industrial-grade rating ensures reliable performance in demanding notebook thermal environments, including fanless and high-power-density designs where board temperatures exceed commercial-grade limits.
Does the ISL62773AIRZ-T support both DCR and resistor-based current sensing?
Yes, the ISL62773AIRZ-T supports both lossless inductor DCR current sensing with NTC thermistor compensation and precision resistor current sensing on both Core and Northbridge VR channels. Each phase has dedicated ISENx pins, and the transconductance amplifier inputs (ISUMP/ISUMN, ISUMP_NB/ISUMN_NB) are configured accordingly per application circuit.
How does the R3™ modulator in the ISL62773AIRZ-T improve transient response?
The R3™ modulator in the ISL62773AIRZ-T automatically adjusts switching frequency during load transients - increasing frequency during rapid load steps to reduce output voltage deviation and decreasing frequency at light loads to maintain high efficiency. This eliminates the trade-off between transient performance and quiescent power seen in fixed-frequency controllers.
Can the ISL62773AIRZ-T be used in a 1+1 phase configuration for low-power CPUs?
Yes, the ISL62773AIRZ-T supports 1+1 phase operation: Core VR in single-phase mode (by tying ISEN2 and ISEN3 to +5V) and Northbridge VR in single-phase mode (by tying ISEN2_NB to +5V). Figure 6 in the datasheet shows this exact configuration using DCR sensing, with appropriate resistor termination on unused ISEN pins.
What protection features are integrated into the ISL62773AIRZ-T?
The ISL62773AIRZ-T integrates overvoltage protection (OVP), undervoltage protection (UVP), overcurrent protection (OCP/WOC), thermal monitoring with NTC inputs, current imbalance detection, and open-drain PGOOD/PGOOD_NB signaling. All protections trigger hardware-level responses without firmware intervention, ensuring robustness in unattended mobile operation.
ISL62773AIRZ-T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- Robust Ripple Regulator™ (R3)
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Controller, AMD Fusion™ SVI 2.0 CPU GPU
- Voltage - Input:
- 4.5V ~ 25V
- Number of Outputs:
- 2
- Voltage - Output:
- 0.006V ~ 1.55V
- Operating Temperature:
- -40°C ~ 100°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-QFN (6x6)
ISL62773AIRZ-T FAQ
1.How can I place an order for ISL62773AIRZ-T through Aetrix?
Please submit a Request for Quotation (RFQ) for ISL62773AIRZ-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ISL62773AIRZ-T reliable?
The price and inventory of ISL62773AIRZ-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ISL62773AIRZ-T is usually 5 days.
3.What payment methods are accepted for ISL62773AIRZ-T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ISL62773AIRZ-T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ISL62773AIRZ-T?
ISL62773AIRZ-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ISL62773AIRZ-T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ISL62773AIRZ-T?
For technical support, including ISL62773AIRZ-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ISL62773AIRZ-T requirements.
6.How does Aetrix verify that ISL62773AIRZ-T is sourced from the original manufacturer or authorized distributors?
All ISL62773AIRZ-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ISL62773AIRZ-T meets industry standards.
7.What is the process for return or replacement of ISL62773AIRZ-T?
All ISL62773AIRZ-T units undergo pre-shipment inspection (PSI). If there is an issue with ISL62773AIRZ-T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ISL62773AIRZ-T part is unused and in its original packaging.
Return procedure for ISL62773AIRZ-T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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