Renesas ISL6277AHRZ-T
- Part No.:
- ISL6277AHRZ-T
- Manufacturer:
- Renesas
- Category:
- Special Purpose Regulators
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
ISL6277AHRZ-T.pdf
- Description:
- IC REG CTRLR MULTIPH 2OUT 48QFN
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
ISL6277AHRZ-T from Renesas is a dual-output multiphase PWM controller compliant with AMD SVI 2.0, designed for core and Northbridge power delivery in AMD Fusion mobile CPUs. It supports 1–3-phase Core VR and 1–2-phase Northbridge VR, integrates three gate drivers, enables DCR/resistor current sensing, and delivers 0.5% system voltage accuracy over temperature.
For engineers reviewing the ISL6277AHRZ-T datasheet, ISL6277AHRZ-T pinout, ISL6277AHRZ-T application, or ISL6277AHRZ-T equivalent, this page provides verified technical context, validated pin functions, confirmed SVI 2.0 interface timing (100kHz–25MHz), R3™ modulator transient response behavior, and real-world phase configuration constraints for notebook CPU/GPU power design.
Technical Context
The ISL6277AHRZ-T implements two independent VR modulators-Core VR (R3™ Robust Ripple Regulator) and Northbridge VR-sharing a single AMD SVI 2.0 serial bus for VID programming and telemetry. Each VR uses differential remote sensing (FB/FB2, VSEN/RTN), programmable load line droop, and adaptive body diode conduction time reduction.
It supports flexible phase assignment via FCCM_NB resistor selection: PWM_Y and floating driver (BOOTX/UGATEX/PHASEX/LGATEX) configure either Core Phase 3 or Northbridge Phase 1. Current sensing is implemented via ISUMP/ISUMN (Core) and ISUMP_NB/ISUMN_NB (Northbridge) transconductance amplifier inputs with NTC-based thermal compensation on both outputs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| SVI 2.0 Interface | Serial VID clock range 100kHz–25MHz; bidirectional SVD, clock SVC, telemetry SVT; enables dynamic VID-on-the-fly slew rate control. |
| Output Voltage Range | 0.5V–1.55V in 6.25mV steps; supports precise AMD CPU core/Northbridge rail requirements with 0.5% system accuracy over temperature. |
| Phase Configuration | Core VR: 1-, 2-, or 3-phase; Northbridge VR: 1- or 2-phase; configured via ISEN1/ISEN2/ISEN3 and ISEN1_NB/ISEN2_NB logic levels. |
| Current Sensing | Lossless DCR sensing (inductor-based) or precision resistor sensing; supported on both outputs with dedicated ISUMP/ISUMN and ISUMP_NB/ISUMN_NB inputs. |
| Protection Features | OCP/WOC, OVP, UVP, PGOOD, thermal monitor (NTC/NTC_NB), fault recovery with VR_HOT_L open-drain thermal indicator. |
| Package | 48-lead 6×6 mm QFN (RoHS-compliant, Pb-free); thermal pad exposed on bottom for enhanced heat dissipation in high-power notebook applications. |
| Switching Frequency | Programmable per VR; CCM mode enabled via external RT resistor; supports optimized efficiency across light-to-heavy loads using R3™ frequency adaptation. |
Pinout & Package
ISL6277AHRZ-T is housed in a 48-lead 6×6 mm QFN package with exposed thermal pad (PKG DWG L48.6x6B). Pin functions are validated per Renesas FN8322 Rev.3.00 datasheet, Page 9–11.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| ISEN1 / ISEN2 / ISEN3 | Core VR phase enable/disable inputs | Pulling to +5V disables corresponding Core phase; ISEN1 tied high shuts down entire Core VR. |
| ISEN1_NB / ISEN2_NB | Northbridge VR phase enable/disable inputs | Pulling ISEN2_NB high disables NB Phase 2; enables 1+1 or 2+1 configurations. |
| UGATE1 / LGATE1 / PHASE1 / BOOT1 | Core VR Phase 1 gate drive interface | Direct connection to high-/low-side MOSFET gates and switching node; BOOT1 charges via internal diode from VDDP. |
| UGATE2 / LGATE2 / PHASE2 / BOOT2 | Core VR Phase 2 gate drive interface | Same topology as Phase 1; supports 2-phase Core operation without external drivers. |
| UGATEX / LGATEX / PHASEX / BOOTX | Floating driver for Core Phase 3 or NB Phase 1 | Configured by FCCM_NB resistor value; eliminates need for external driver in 3+1 or 2+2 topologies. |
| SVC / SVD / SVT / PWROK | AMD SVI 2.0 serial interface | PWROK must be low before PGOOD assertion; SVT carries telemetry data and VID transition completion signal. |
| VSEN / RTN / FB / FB2 / COMP | Core VR feedback and compensation | Differential remote sense (VSEN/RTN); FB2 switch enables 1-phase compensation tuning; COMP sets offset via resistor-to-GND. |
| VSEN_NB / FB_NB / COMP_NB | Northbridge VR feedback and compensation | Independent error amplifier path; COMP_NB sets NB offset; VSEN_NB connects to NB die sense point. |
Key Features
| Feature | Design Value |
|---|---|
| R3™ Robust Ripple Regulator modulator | Automatically adjusts switching frequency during load transients to reduce settling time and improve light-load efficiency-no external compensation required. |
| Dual VR architecture with shared SVI 2.0 bus | Reduces BOM count and PCB area vs. dual-controller solutions; enables synchronized VID updates and coordinated telemetry reporting. |
| Programmable VID slew rate and droop | Per-VR slew rate set via FCCM_NB resistor; load line slope trim allows precise voltage positioning under dynamic current demand. |
| Adaptive body diode conduction time reduction | Minimizes reverse recovery losses in synchronous rectifiers, improving efficiency at medium-to-heavy loads without external circuitry. |
| Integrated thermal monitoring with NTC inputs | Dedicated NTC and NTC_NB pins feed independent VR_HOT_L signals; enables per-rail thermal throttling per AMD guidelines. |
| Output current and voltage telemetry | IMON and IMON_NB provide analog current monitor outputs; Core/NB voltages digitized internally and reported via SVT line. |
Applications
| AMD Notebook CPU Core Power | AMD Notebook GPU/Northbridge Power |
|---|---|
Use Scenario: High-efficiency, dynamically scaled core voltage regulation for AMD Fusion APUs in ultrabooks and thin-and-light notebooks. IC Role / Device Role / Timing Role: Dual-output multiphase PWM controller managing up to 3-phase Core VR and 2-phase Northbridge VR via shared SVI 2.0 interface. Use Value: Enables precise 0.5% voltage accuracy across temperature, fast transient response via R3™ modulation, and reduced board area versus discrete dual-controller designs. |
Use Scenario: Independent, thermally monitored power delivery to integrated GPU and memory controller in AMD mobile platforms. IC Role / Device Role / Timing Role: Northbridge VR subsystem with dedicated current sensing (ISEN1_NB/ISEN2_NB), thermal monitoring (NTC_NB), and PGOOD_NB signaling. Use Value: Supports 1- or 2-phase NB operation with programmable load line and telemetry, meeting AMD SVI 2.0 thermal and voltage positioning requirements. |
| Mid-Power Mobile CPU [2+1] | Low-Power Mobile CPU [1+1] |
Use Scenario: Cost-optimized power solution for mainstream notebooks using 2-phase Core VR and 1-phase Northbridge VR. IC Role / Device Role / Timing Role: Configured via ISEN3 tied high and ISEN2_NB pulled to +5V; uses internal drivers for Core Phases 1–2 and floating driver (PWM_Y/UGATEX) for NB Phase 1. Use Value: Eliminates need for external gate drivers while maintaining full SVI 2.0 compliance, telemetry, and protection features in space-constrained layouts. |
Use Scenario: Entry-level mobile platform requiring minimal component count and thermal headroom for fanless or passive-cooled designs. IC Role / Device Role / Timing Role: Core VR operates in 1-phase mode (ISEN2/ISEN3 tied high); Northbridge VR runs 1-phase (ISEN2_NB high); both use DCR sensing and shared SVI bus. Use Value: Delivers full AMD SVI 2.0 functionality-including VID-on-the-fly, telemetry, and thermal monitoring-at lowest possible gate count and footprint. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multiphase VR controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISL6277AIRZ-T | Extended temperature range (–40°C to +100°C) vs. ISL6277AHRZ-T (–10°C to +100°C); identical electrical specs and pinout. | Required for industrial or extended-ambient notebook designs; not needed for standard commercial thermal environments. | Select ISL6277AIRZ-T only if operating below –10°C is specified; otherwise ISL6277AHRZ-T meets all AMD Fusion mobile requirements. |
| RTQ2136B-QA | Single-output, 6-phase controller with I²C interface; no SVI 2.0 support; different pinout and telemetry architecture. | Not compatible with AMD platforms; intended for generic x86 or ARM SoC core power with I²C host control. | Only consider for non-AMD designs requiring higher phase count; not a functional or drop-in alternative for ISL6277AHRZ-T in SVI 2.0 systems. |
Compared with ISL6277AIRZ-T, the ISL6277AHRZ-T offers identical performance at lower cost for commercial-temperature notebooks; compared with RTQ2136B-QA, it provides mandatory AMD SVI 2.0 compliance, dual-VR integration, and validated thermal management for Fusion APU platforms.
Availability
ISL6277AHRZ-T is available at Aetrix Electronics and suitable for notebook computer power design, AMD Fusion APU core/Northbridge regulation, and mobile embedded systems requiring stable component supply, RoHS-compliant packaging, and long-term lifecycle support.
Supply support for ISL6277AHRZ-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader delivering microcontrollers, analog power, and mixed-signal solutions for automotive, industrial, and computing markets.
The ISL6277AHRZ-T belongs to Renesas' high-performance power management IC portfolio, specifically engineered for AMD mobile CPU/GPU core power delivery with SVI 2.0 compliance, multiphase flexibility, and thermal-aware regulation.
FAQ
What is the operating temperature range of the ISL6277AHRZ-T?
The ISL6277AHRZ-T is rated for ambient temperatures from –10°C to +100°C, as specified in the Renesas FN8322 datasheet ordering information table. This range supports standard commercial notebook applications but excludes extended-temperature industrial use cases, for which the ISL6277AIRZ-T variant is recommended. The ISL6277AHRZ-T maintains 0.5% voltage accuracy across this full range.
Does the ISL6277AHRZ-T support both DCR and resistor current sensing?
Yes, the ISL6277AHRZ-T supports both lossless inductor DCR current sensing and precision resistor current sensing on both its Core and Northbridge VR outputs. Dedicated ISUMP/ISUMN and ISUMP_NB/ISUMN_NB inputs allow direct connection of DCR networks or sense resistors, with NTC-based temperature compensation applied independently to each channel.
How is phase configuration controlled on the ISL6277AHRZ-T?
Phase configuration is controlled via logic levels on ISEN1/ISEN2/ISEN3 (Core) and ISEN1_NB/ISEN2_NB (Northbridge). Pulling ISEN2 high disables Core Phase 2; pulling ISEN3 high configures Core for 2-phase operation. Similarly, ISEN2_NB high disables Northbridge Phase 2. The FCCM_NB resistor selects whether PWM_Y and the floating driver support Core Phase 3 or Northbridge Phase 1.
What is the function of the FB2 pin on the ISL6277AHRZ-T?
The FB2 pin on the ISL6277AHRZ-T is part of a switch network that connects to FB in 2- or 3-phase Core VR modes and disconnects in 1-phase mode. External compensation components tied to FB2 optimize loop stability and transient response specifically for 1-phase operation, while FB remains active for all configurations as the primary feedback input to the error amplifier.
Is the ISL6277AHRZ-T pin-compatible with other members of the ISL6277A family?
Yes, the ISL6277AHRZ-T shares identical pinout, package (48 Ld 6×6 QFN), and electrical specifications with ISL6277AIRZ-T and ISL6277AHRZ. The only difference is temperature grade and tape-and-reel packaging (4k units for -T suffix variants). All share the same footprint, thermal pad layout, and PCB routing requirements per Renesas Package Outline Drawing L48.6x6B.
ISL6277AHRZ-T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- Robust Ripple Regulator™ (R3)
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Controller, AMD Fusion™ SVI 2.0 CPU GPU
- Voltage - Input:
- 4.5V ~ 25V
- Number of Outputs:
- 2
- Voltage - Output:
- 0.006V ~ 1.55V
- Operating Temperature:
- -10°C ~ 100°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-QFN (6x6)
ISL6277AHRZ-T FAQ
1.How can I place an order for ISL6277AHRZ-T through Aetrix?
Please submit a Request for Quotation (RFQ) for ISL6277AHRZ-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ISL6277AHRZ-T reliable?
The price and inventory of ISL6277AHRZ-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ISL6277AHRZ-T is usually 5 days.
3.What payment methods are accepted for ISL6277AHRZ-T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ISL6277AHRZ-T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ISL6277AHRZ-T?
ISL6277AHRZ-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ISL6277AHRZ-T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ISL6277AHRZ-T?
For technical support, including ISL6277AHRZ-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ISL6277AHRZ-T requirements.
6.How does Aetrix verify that ISL6277AHRZ-T is sourced from the original manufacturer or authorized distributors?
All ISL6277AHRZ-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ISL6277AHRZ-T meets industry standards.
7.What is the process for return or replacement of ISL6277AHRZ-T?
All ISL6277AHRZ-T units undergo pre-shipment inspection (PSI). If there is an issue with ISL6277AHRZ-T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ISL6277AHRZ-T part is unused and in its original packaging.
Return procedure for ISL6277AHRZ-T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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