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Renesas ISL6277AIRZ
- Part No.:
- ISL6277AIRZ
- Manufacturer:
- Renesas
- Category:
- Special Purpose Regulators
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
ISL6277AIRZ.pdf
- Description:
- IC REG CTRLR MULTIPH 2OUT 48QFN
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
ISL6277AIRZ from Renesas is a dual-output multiphase PWM controller IC compliant with AMD SVI 2.0, designed for core and Northbridge power delivery in AMD Fusion mobile CPUs. It supports 1–3-phase Core VR and 1–2-phase Northbridge VR, integrates three gate drivers, enables DCR/resistor current sensing, and delivers 0.5% system voltage accuracy over temperature.
For engineers reviewing the ISL6277AIRZ datasheet, ISL6277AIRZ pinout, ISL6277AIRZ application, or ISL6277AIRZ equivalent, this page provides verified technical context, validated pin functions, confirmed phase configuration flexibility, real-world telemetry and protection features, and two documented alternative controllers for AMD SVI 2.0 notebook CPU power designs.
Technical Context
The ISL6277AIRZ implements Renesas' Robust Ripple Regulator R3™ modulator architecture, enabling automatic switching frequency adjustment during load transients to improve settling time and light-load efficiency. Its dual-VR architecture shares a single serial control bus (SVC/SVD/SVT) with the AMD CPU, reducing component count versus discrete dual-controller solutions.
It supports differential remote voltage sensing on both outputs, programmable VID offset/droop, adaptive body diode conduction time reduction, and independent current balancing across phases. Thermal monitoring uses dual NTC inputs (NTC and NTC_NB), and fault reporting includes open-drain PGOOD and VR_HOT_L signals compliant with AMD SVI 2.0 timing requirements.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| SVI 2.0 Interface | Serial VID clock range 100kHz–25MHz; bidirectional SVD, clock SVC, telemetry SVT - enables dynamic voltage scaling and real-time current/voltage telemetry per AMD spec. |
| Core VR Phases | Configurable 1-, 2-, or 3-phase operation via ISEN1/ISEN2/ISEN3 pin states - supports high-power (3φ), mid-power (2φ), and low-power (1φ) CPU cores without hardware change. |
| Northbridge VR Phases | Configurable 1- or 2-phase operation via ISEN1_NB/ISEN2_NB pin states - matches GPU/NB load profiles while sharing control bus. |
| Voltage Accuracy | ±0.5% system accuracy over temperature - ensures stable core voltage under thermal stress, critical for mobile CPU reliability. |
| Output Voltage Range | 0.5V–1.55V in 6.25mV steps - covers full AMD Fusion CPU core and Northbridge VDDP/VDDNB operating ranges. |
| Package | 48-pin 6×6 mm QFN, RoHS-compliant, -40°C to +100°C ambient - optimized for compact notebook motherboard layouts with thermal pad for dissipation. |
| Protection Features | OCP/WOC, OVP, UVP, thermal monitor (NTC/NTC_NB), PGOOD, VR_HOT_L - meets AMD platform-level safety and sequencing requirements. |
Pinout & Package
ISL6277AIRZ is housed in a 48-lead 6×6 mm QFN package with exposed thermal pad (RoHS-compliant, -40°C to +100°C operating range). Pin functions are validated per Renesas FN8322 Rev.3.00 datasheet.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| ISEN1 / ISEN2 / ISEN3 | Core VR channel enable/disable inputs | Pull to +5V disables corresponding phase - enables flexible 1/2/3-phase Core VR configuration without external logic. |
| ISEN1_NB / ISEN2_NB | Northbridge VR channel enable/disable inputs | Pull to +5V disables corresponding NB phase - allows 1/2-phase NB VR matching GPU load profile. |
| UGATE1 / LGATE1 / PHASE1 / BOOT1 | Phase 1 gate driver interface | Drives high-/low-side MOSFETs for Core VR Phase 1; BOOT1 charges via internal diode from VDDP - eliminates external bootstrap diode. |
| UGATEX / LGATEX / PHASEX / BOOTX | Programmable floating driver interface | Configured via FCCM_NB resistor as either Core Phase 3 or NB Phase 1 - maximizes gate driver reuse across configurations. |
| SVC / SVD / SVT | AMD SVI 2.0 serial interface | SVC clocks bidirectional SVD; SVT reports telemetry - enables closed-loop CPU-controlled voltage regulation and thermal management. |
| PGOOD / PGOOD_NB | Open-drain power-good indicators | Asserted after output regulation and sequencing compliance - required for AMD platform boot validation and OS power-state coordination. |
Key Features
| Feature | Design Value |
|---|---|
| R3™ Modulator Architecture | Auto-adjusting switching frequency improves transient response by >30% vs fixed-frequency PWM and boosts light-load efficiency by reducing switching losses. |
| Dual DCR/Resistor Current Sensing | Supports lossless inductor DCR sensing or precision shunt resistor sensing on both VRs - eliminates need for separate current-sense amplifiers and reduces BOM cost. |
| Programmable Load Line & Droop | Independent VID offset and droop programming on Core and NB outputs - enables precise adaptive voltage positioning (AVP) per AMD specification. |
| Differential Remote Sensing | FB/FB2 and VSEN/RTN pairs reject PCB IR drop - maintains ±0.5% regulation at CPU die despite trace resistance up to 20 mΩ. |
| Telemetry & Thermal Monitoring | IMON/IMON_NB analog current monitors + dual NTC inputs (NTC/NTC_NB) feed VR_HOT_L signal - provides real-time thermal feedback to CPU for dynamic throttling. |
Applications
| AMD Notebook CPU Core Power | AMD Notebook GPU/Northbridge Power |
|---|---|
Use Scenario: High-performance ultrabook requiring dynamic voltage scaling for AMD A-series or E-series Fusion APUs with integrated CPU/GPU. IC Role / Device Role / Timing Role: Dual-output multiphase controller managing Core VR (3φ) and Northbridge VR (2φ) simultaneously via shared SVI 2.0 bus. Use Value: Reduces board area and component count versus dual-chip solutions while meeting AMD's ±0.5% voltage accuracy and fast transient response requirements. | Use Scenario: Thin-and-light notebook with thermally constrained chassis needing coordinated CPU/GPU power delivery and thermal management. IC Role / Device Role / Timing Role: Provides synchronized Core and NB VR sequencing, differential remote sensing, and VR_HOT_L thermal signaling to AMD CPU. Use Value: Enables CPU-driven thermal throttling and AVP-based load-line compensation - improving system stability under sustained GPU compute loads. |
| Mid-Power Mobile CPU Platform | Low-Power Entry-Level Notebook |
Use Scenario: Business-class notebook using AMD mobile CPU with 2+1 phase configuration (2φ Core + 1φ NB) for balanced performance and battery life. IC Role / Device Role / Timing Role: Configured via ISEN pin strapping to operate Core VR in 2-phase mode and NB VR in 1-phase mode. Use Value: Eliminates need for external phase-config logic; supports scalable power design across product tiers using same ISL6277AIRZ footprint. | Use Scenario: Entry-level education or value notebook with AMD low-power APU requiring minimal phase count and simplified layout. IC Role / Device Role / Timing Role: Operates Core VR in 1-phase mode (ISEN2/ISEN3 pulled high) and NB VR in 1-phase mode (ISEN2_NB pulled high). Use Value: Achieves full AMD SVI 2.0 compliance with only 2 active gate drivers - lowers gate drive losses and simplifies thermal design. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-output multiphase VR controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISL6277AHRZ | Same silicon, -10°C to +100°C temp range vs -40°C to +100°C for ISL6277AIRZ - lacks extended industrial temperature support. | Restricted to commercial-temperature notebooks; not qualified for wide-temp industrial or automotive-adjacent use cases. | Select ISL6277AHRZ only if ambient operating temperature remains above -10°C and cost sensitivity outweighs thermal margin needs. |
| RTQ2136GSP-QA | Single-output 6-phase controller with integrated drivers; no native SVI 2.0 interface - requires external level-shifting and protocol translation for AMD platforms. | Cannot replace ISL6277AIRZ in AMD SVI 2.0 systems without redesigning serial interface and telemetry path. | Consider RTQ2136GSP-QA only for non-AMD platforms or custom firmware implementations where SVI 2.0 is not required. |
Compared with ISL6277AIRZ, ISL6277AHRZ offers identical functionality but narrower temperature qualification, while RTQ2136GSP-QA provides higher phase count per output but lacks native AMD interface support - making ISL6277AIRZ the only drop-in solution for certified AMD Fusion notebook designs.
Availability
ISL6277AIRZ is available at Aetrix Electronics and suitable for AMD notebook CPU core power, GPU/Northbridge power, mid-power mobile CPU platforms, and low-power entry-level notebook applications requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for ISL6277AIRZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader delivering microcontrollers, analog, power, and SoC solutions for automotive, industrial, infrastructure, and IoT markets.
The ISL6277A product line was engineered specifically for AMD Fusion mobile CPU power delivery, targeting high-efficiency, multi-phase VR control with native SVI 2.0 compliance and thermal-aware telemetry for thin-client and ultrabook platforms.
FAQ
What is the operating temperature range of the ISL6277AIRZ?
The ISL6277AIRZ is rated for -40°C to +100°C ambient operating temperature, validated per Renesas FN8322 Rev.3.00 datasheet. This extended industrial range supports deployment in thermally demanding notebook environments where CPU/GPU junction temperatures exceed commercial-grade limits, ensuring reliable ISL6277AIRZ operation across full platform thermal profiles.
Does the ISL6277AIRZ support both DCR and resistor-based current sensing?
Yes, the ISL6277AIRZ supports both lossless inductor DCR current sensing and precision resistor current sensing on both Core and Northbridge VR outputs. The ISUMP/ISUMN pins interface with DCR networks, while dedicated ISENx pins accept shunt resistor signals - allowing designers to select the optimal sensing method based on cost, accuracy, and board space constraints without changing the ISL6277AIRZ part.
How does the ISL6277AIRZ implement AMD SVI 2.0 compliance?
The ISL6277AIRZ implements AMD SVI 2.0 compliance through dedicated SVC (clock), SVD (bidirectional data), and SVT (telemetry) pins, supporting 100kHz–25MHz serial clock rates and full VID-on-the-fly slew rate control. It meets all timing, voltage, and protocol requirements in the AMD SVI 2.0 Controller Guidelines, including pre-PWROK metal VID, dynamic offset trim, and VR_HOT_L thermal signaling - all verified in the ISL6277AIRZ datasheet.
Can the ISL6277AIRZ be configured for single-phase operation on both outputs?
Yes, the ISL6277AIRZ can be configured for 1-phase Core VR and 1-phase Northbridge VR simultaneously. Tie ISEN2 and ISEN3 to +5V to disable Core Phases 2 and 3, and tie ISEN2_NB to +5V to disable NB Phase 2. This configuration uses only UGATE1/LGATE1 and UGATEX/LGATEX (or PWM2_NB), enabling minimal-phase operation while retaining full ISL6277AIRZ functionality including telemetry and protection.
What package type and pin count does the ISL6277AIRZ use?
The ISL6277AIRZ uses a 48-lead 6×6 mm QFN package with exposed thermal pad (Renesas pkg drawing L48.6x6B), RoHS-compliant and Pb-free. All 48 pins are electrically defined in the datasheet, including three integrated gate driver sets (UGATE1/LGATE1/PHASE1/BOOT1, UGATE2/LGATE2/PHASE2/BOOT2, and UGATEX/LGATEX/PHASEX/BOOTX), SVI 2.0 interface pins, and dual thermal monitor inputs (NTC/NTC_NB).
ISL6277AIRZ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- Robust Ripple Regulator™ (R3)
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tube
- Product Status:
- Active
- Applications:
- Controller, AMD Fusion™ SVI 2.0 CPU GPU
- Voltage - Input:
- 4.5V ~ 25V
- Number of Outputs:
- 2
- Voltage - Output:
- 0.006V ~ 1.55V
- Operating Temperature:
- -40°C ~ 100°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-QFN (6x6)
ISL6277AIRZ FAQ
1.How can I place an order for ISL6277AIRZ through Aetrix?
Please submit a Request for Quotation (RFQ) for ISL6277AIRZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ISL6277AIRZ reliable?
The price and inventory of ISL6277AIRZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ISL6277AIRZ is usually 5 days.
3.What payment methods are accepted for ISL6277AIRZ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ISL6277AIRZ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ISL6277AIRZ?
ISL6277AIRZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ISL6277AIRZ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ISL6277AIRZ?
For technical support, including ISL6277AIRZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ISL6277AIRZ requirements.
6.How does Aetrix verify that ISL6277AIRZ is sourced from the original manufacturer or authorized distributors?
All ISL6277AIRZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ISL6277AIRZ meets industry standards.
7.What is the process for return or replacement of ISL6277AIRZ?
All ISL6277AIRZ units undergo pre-shipment inspection (PSI). If there is an issue with ISL6277AIRZ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ISL6277AIRZ part is unused and in its original packaging.
Return procedure for ISL6277AIRZ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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