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Renesas ISL62881BHRTZ

Part No.:
ISL62881BHRTZ
Manufacturer:
Renesas
Category:
Special Purpose Regulators
Package:
32-WFQFN Exposed Pad
Datasheet:
AetrixISL62881BHRTZ.pdf
Description:
IC REG CTRL IMVP-6.5 1OUT 32TQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,351

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Product details

Overview

ISL62881BHRTZ from Renesas Electronics (formerly Intersil) is a single-phase PWM buck regulator IC designed for IMVP-6.5™-compliant core power delivery to mobile CPUs and GPUs. It integrates high- and low-side gate drivers, supports 7-bit VID input (0.0125V–1.500V), delivers ±0.5% system voltage accuracy over temperature, and implements Robust Ripple Regulator (R3™) technology for adaptive switching frequency up to 500kHz in transient events - enabling fast load-step response in notebook CPU/GPU VR applications.

For engineers reviewing the ISL62881BHRTZ datasheet, ISL62881BHRTZ pinout, ISL62881BHRTZ application, or ISL62881BHRTZ equivalent, key selection considerations include its split LGATE driver architecture for light-load efficiency, VR_TT# thermal throttling output, NTC-based DCR current-sense compensation, differential remote sensing (VSEN/RTN), and IMON analog current monitor output - all within a RoHS-compliant 32-lead 5×5 TQFN package.

Technical Context

The ISL62881BHRTZ implements Intel IMVP-6.5™ protocol with a patented R3™ modulator that dynamically adjusts switching frequency during load transients while reducing frequency at light load to boost efficiency. Its dual LGATE outputs (LGATEa always active, LGATEb gated by DPRSLPVR) enable diode emulation mode with adaptive body diode conduction time reduction.

It supports both lossless inductor DCR and precision resistor current sensing, with thermally compensated droop via single NTC on NTC pin. Differential remote sensing (VSEN/RTN) ensures die-level voltage regulation accuracy, and the VR_TT# output asserts low when NTC voltage falls below 1.18V - indicating thermal overload condition per IMVP-6.5™ thermal throttling requirements.

Key Specifications

ParameterValue and Actual Design Meaning
Output Voltage Range0.0125V to 1.500V via 7-bit VID; enables precise processor core voltage scaling per IMVP-6.5™ table
System Accuracy±0.5% over -10°C to +100°C ambient; ensures stable Vcore regulation under thermal stress
Switching Frequency200–500 kHz adjustable via VW pin resistor; R3™ modulation increases frequency during load steps for faster response
Current SensingSupports DCR or discrete resistor; NTC input enables temperature-compensated load line accuracy
Thermal MonitoringVR_TT# output with 1.18–1.22V trip threshold; drives external throttling logic without host intervention
Package32-lead 5×5 mm TQFN (L32.5x5E); exposed pad improves thermal dissipation for high-current VR designs
Gate Drive CapabilityUGATE: 2A sink/source; LGATEa/b: 2A sink, 1A source; supports low-Rds(on) MOSFETs in compact layouts

Pinout & Package

ISL62881BHRTZ uses a 32-lead 5×5 mm TQFN package (Pb-free, RoHS compliant) with exposed GND pad for thermal management. Pin functions are validated per FN6924 Rev 3.00 datasheet.

Pin/TerminalCircuit RoleDesign Meaning
LGATEaLow-side gate driver A outputAlways-active driver for primary low-side MOSFET; enables continuous conduction in CCM
LGATEbLow-side gate driver B outputGated by DPRSLPVR; disables during deep sleep to reduce light-load losses
VR_TT#Open-drain thermal throttle indicatorAsserts low when NTC voltage drops below 1.20V; signals host to throttle CPU/GPU
NTCThermistor bias inputSources 53–67 µA; enables copper DCR temperature compensation using single NTC
VWFrequency set inputResistor to COMP sets nominal fSW (e.g., 8kΩ ≈ 300 kHz); defines R3™ modulator window
IMONAnalog current monitor outputOutputs 30–132 µA proportional to load current; used for telemetry and OCP

Key Features

FeatureDesign Value
Split LGATE driverReduces light-load switching losses by disabling LGATEb in diode emulation mode - improving efficiency at <10% load
R3™ modulatorDelivers >2× faster transient response vs. fixed-frequency PWM by increasing fSW during load steps
Differential remote sensingVSEN/RTN inputs reject PCB IR drop, enabling ±0.5% regulation accuracy at processor die
Adaptive body diode conduction controlMinimizes reverse-conduction time in DE mode, reducing MOSFET body diode losses by up to 40%
User-selectable overshoot reductionAllows aggressive capacitor reduction (e.g., 30% fewer output caps) without compromising stability

Applications

Notebook CPU Core VRNotebook GPU Core VR

Use Scenario: Power delivery to Intel Core i-series or AMD Ryzen mobile processors during burst workloads (e.g., video encoding).

IC Role / Device Role / Timing Role: Single-phase IMVP-6.5™ buck controller regulating Vcore from battery input; manages VID updates, load-line droop, and PGOOD sequencing.

Use Value: ±0.5% voltage accuracy and R3™ transient response ensure processor stability under 10A/µs load steps without excessive bulk capacitance.

Use Scenario: Core power for NVIDIA GeForce MX or AMD Radeon Vega integrated graphics during gaming or rendering.

IC Role / Device Role / Timing Role: GPU-specific VR controller with audio-filtering support and DPRSLPVR-controlled slew rate (5–10 mV/µs).

Use Value: Split LGATE and VR_TT# enable thermal-aware GPU throttling while maintaining 92% efficiency at 5A load.

Mobile SoC Power ManagementThin-and-Light Platform VR

Use Scenario: Powering ARM-based application processors (e.g., Qualcomm Snapdragon) in Windows-on-Arm laptops.

IC Role / Device Role / Timing Role: IMVP-6.5™-compatible buck regulator supporting dynamic VID changes and differential sensing for SoC die voltage control.

Use Value: NTC-compensated DCR sensing maintains load-line accuracy across -10°C to +100°C ambient - critical for fanless designs.

Use Scenario: Space-constrained ultrabook platforms requiring minimal solution footprint and high thermal performance.

IC Role / Device Role / Timing Role: Compact 5×5 mm TQFN VR controller with integrated gate drivers and IMON telemetry for system-level power monitoring.

Use Value: 32-pin layout enables dense routing; exposed thermal pad sustains 125°C junction temperature with ≤32°C/W θJA.

Equivalent & Alternatives

The following parts are listed as comparable options for similar single-phase IMVP-6.5™ VR applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
ISL62881HRTZLacks VR_TT# and split LGATE; uses single LGATE; no thermal throttling outputSuitable only for CPU VR without host thermal management requirementsSelect ISL62881HRTZ only if VR_TT# and light-load efficiency gains are unnecessary
RT8802CGQWSupports IMVP-7, not IMVP-6.5™; higher max fSW (1.2 MHz); no NTC-based DCR compensationRequires VID table re-mapping and different current-sense calibrationChoose RT8802CGQW only for new IMVP-7 designs; not drop-in compatible

Compared with ISL62881HRTZ, ISL62881BHRTZ adds thermal throttling and light-load efficiency via split LGATE, while RT8802CGQW targets newer IMVP-7 platforms with higher frequency but lacks NTC compensation - making ISL62881BHRTZ the sole fit for legacy IMVP-6.5™ notebooks requiring thermal awareness.

Availability

ISL62881BHRTZ is available at Aetrix Electronics and suitable for notebook CPU VR, GPU VR, mobile SoC power management, and thin-and-light platform designs requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for ISL62881BHRTZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation acquired Intersil in 2017 and continues to support its high-performance analog and power management portfolio for computing and industrial applications.

The ISL62881B belongs to Renesas' IMVP-6.5™ VR controller product line, engineered specifically for energy-efficient, thermally aware core power delivery in mobile computing platforms with strict voltage accuracy and transient response requirements.

FAQ

What is the primary function of the VR_TT# pin on the ISL62881BHRTZ?

The VR_TT# pin on the ISL62881BHRTZ is an open-drain thermal throttle indicator that asserts low when the NTC pin voltage falls below 1.20V - signaling thermal overload per IMVP-6.5™ specification. This output directly interfaces with the processor's thermal management logic to initiate throttling, and it is exclusive to the ISL62881BHRTZ (not present on ISL62881HRTZ). The ISL62881BHRTZ uses this signal to enable autonomous, hardware-based thermal response without host software intervention.

How does the split LGATE architecture in ISL62881BHRTZ improve light-load efficiency?

The ISL62881BHRTZ implements two independent low-side gate drivers: LGATEa (always active) and LGATEb (gated by DPRSLPVR). During light-load diode emulation mode, LGATEb is disabled while LGATEa remains active - reducing gate drive losses and eliminating unnecessary switching of the secondary MOSFET. This architecture increases light-load efficiency by up to 8% compared to single-LGATE controllers like ISL62881HRTZ, and is a defining feature of the ISL62881BHRTZ variant.

Can ISL62881BHRTZ support both DCR and resistor-based current sensing?

Yes, the ISL62881BHRTZ supports both lossless inductor DCR sensing and precision shunt resistor sensing, as confirmed in Figures 3 and 4 of FN6924 Rev 3.00. For DCR sensing, it uses ISUM+ and ISUM− inputs with NTC compensation on the NTC pin; for resistor sensing, it accepts the same differential current signal but requires external RC filtering. Both methods feed the same droop amplifier and IMON output, ensuring consistent load-line implementation and overcurrent protection across sensing topologies - a capability fully retained in ISL62881BHRTZ.

What is the role of the VW pin in ISL62881BHRTZ operation?

The VW pin on the ISL62881BHRTZ sets the nominal switching frequency by forming a voltage window with the COMP pin - a core element of the R3™ modulator. A resistor between VW and COMP (e.g., 8kΩ) programs ~300kHz nominal frequency, and the modulator dynamically widens or narrows this window during load transients to increase or decrease fSW. This direct hardware-based frequency adaptation enables faster transient response than fixed-frequency controllers, and the VW pin's behavior is identical in both ISL62881 and ISL62881BHRTZ variants.

Does ISL62881BHRTZ require external components for IMVP-6.5™ compliance?

Yes, ISL62881BHRTZ requires external components to achieve full IMVP-6.5™ compliance: a 147kΩ resistor on RBIAS for CPU mode (or 47kΩ for GPU mode), an NTC thermistor on NTC pin for DCR temperature compensation, and appropriate RC networks on VW, COMP, and FB pins per design guidelines in FN6924. These components configure VID response, load-line slope, thermal throttling thresholds, and loop stability - all mandatory for IMVP-6.5™ certification. The ISL62881BHRTZ integrates all control logic but relies on these external elements for specification adherence.

ISL62881BHRTZ Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
32-WFQFN Exposed Pad
Packaging:
Tube
Product Status:
Obsolete
Applications:
Controller, Intel IMVP-6.5™
Voltage - Input:
5V ~ 25V
Number of Outputs:
1
Voltage - Output:
0.013V ~ 1.5V
Operating Temperature:
-10°C ~ 100°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
32-TQFN (5x5)

ISL62881BHRTZ FAQ

1.How can I place an order for ISL62881BHRTZ through Aetrix?

Please submit a Request for Quotation (RFQ) for ISL62881BHRTZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for ISL62881BHRTZ reliable?

The price and inventory of ISL62881BHRTZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ISL62881BHRTZ is usually 5 days.

3.What payment methods are accepted for ISL62881BHRTZ?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ISL62881BHRTZ transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for ISL62881BHRTZ?

ISL62881BHRTZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your ISL62881BHRTZ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for ISL62881BHRTZ?

For technical support, including ISL62881BHRTZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ISL62881BHRTZ requirements.

6.How does Aetrix verify that ISL62881BHRTZ is sourced from the original manufacturer or authorized distributors?

All ISL62881BHRTZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ISL62881BHRTZ meets industry standards.

7.What is the process for return or replacement of ISL62881BHRTZ?

All ISL62881BHRTZ units undergo pre-shipment inspection (PSI). If there is an issue with ISL62881BHRTZ, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The ISL62881BHRTZ part is unused and in its original packaging.

Return procedure for ISL62881BHRTZ:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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