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Renesas ISL62882HRTZ
- Part No.:
- ISL62882HRTZ
- Manufacturer:
- Renesas
- Category:
- Special Purpose Regulators
- Package:
- 40-VFQFN Exposed Pad
- Datasheet:
-
ISL62882HRTZ.pdf
- Description:
- IC REG CTRL IMVP-6.5 1OUT 40TQFN
- Quantity:
- Payment:
- Shipping:
Inventory:4,617
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Product details
Overview
ISL62882HRTZ from Renesas (formerly Intersil) is a 2-phase multiphase PWM buck regulator IC designed for IMVP-6.5™-compliant CPU and GPU core voltage regulation in notebook platforms. It delivers ±0.5% system accuracy over temperature, supports 7-bit VID input (0.3V–1.5V), integrates dual gate drivers, and operates across -10°C to +100°C ambient with junction up to +125°C. Its R3™ modulator enables fast transient response and adaptive light-load efficiency via diode emulation and period stretching.
For engineers reviewing the ISL62882HRTZ datasheet, ISL62882HRTZ pinout, ISL62882HRTZ application, or ISL62882HRTZ equivalent, key selection considerations include IMVP-6.5™ compliance, DCR/resistor current sensing flexibility, differential remote sensing capability, PSI#/DPRSLPVR dynamic phase control, and 40-pin 5×5 mm TQFN package thermal performance (θJA = 32°C/W).
Technical Context
The ISL62882HRTZ implements a patented Robust Ripple Regulator (R3™) modulator architecture that synthesizes noise-immune ripple signals for precise phase timing-enabling lower jitter than hysteretic or fixed-frequency PWM controllers. It uses a master-slave topology: one master clock circuit generates synchronized, interleaved 180°-out-of-phase clocks for two slave PWM stages, ensuring excellent dynamic current balance between phases.
It supports dual operational modes: programmable 1- or 2-phase CPU Vcore control (with FB2 optimization) or 1-phase GPU Vcore control. Phase management responds directly to PSI# and DPRSLPVR logic signals-adding/dropping Phase 2, adjusting OCP thresholds, and enabling/disabling diode emulation mode-while reporting real-time output current via the IMON analog current output.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Regulation Standard | Fully compliant with Intel IMVP-6.5™ specification for mobile CPU/GPU core power delivery. |
| Output Voltage Range | 0.300V to 1.500V via 7-bit VID input (12.5mV steps); supports on-the-fly VID changes. |
| System Accuracy | ±0.5% over temperature (−10°C to +125°C junction) for VID = 0.75V–1.50V; critical for stable microprocessor operation. |
| Switching Frequency | Nominal 300 kHz (adjustable 200–500 kHz via VW/COMP resistor); enables optimized EMI and component sizing. |
| Current Sensing | Supports lossless inductor DCR sensing or precision discrete resistor sensing with NTC thermal compensation. |
| Thermal Range | −10°C to +100°C ambient; +125°C max junction temperature; validated for notebook thermal envelopes. |
| Package | 40-lead 5×5 mm TQFN (L40.5x5); exposed GND pad improves thermal dissipation (θJC = 3°C/W). |
Pinout & Package
ISL62882HRTZ is housed in a 40-lead, 5 mm × 5 mm, 0.5 mm pitch TQFN package with an exposed thermal pad electrically connected to GND. The package supports high-density notebook PCB layouts and provides low thermal resistance (θJA = 32°C/W, θJC = 3°C/W) for sustained multi-phase operation.
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| 1 | PGOOD | Open-drain power-good indicator; asserts high when regulated output is within tolerance (10% of target for ≥7 ms). |
| 2 | PSI# | Active-low low-load indicator; triggers phase shedding and diode emulation mode entry for light-load efficiency. |
| 3 | RBIAS | Sets internal current reference (147kΩ or 47kΩ) to configure CPU/GPU mode and enable/disable overshoot reduction. |
| 4 | VR_TT# | Open-drain thermal overload flag; pulled low when NTC-sensed die temperature exceeds 1.20V threshold. |
| 5 | NTC | Thermistor bias input; supplies 53–67 µA current for thermal compensation of DCR current sensing. |
| 6 | VW | Voltage window programming pin; resistor to COMP sets switching frequency (e.g., 8 kΩ ≈ 300 kHz). |
| 7 | COMP | Error amplifier output; also sets overcurrent threshold via external resistor to GND. |
| 8 | FB | Inverting input of error amplifier; used with FB2 for 1-phase compensation tuning. |
| 9 | FB2 | 1-phase mode compensation node; switch connects FB2 to FB only in 2-phase mode. |
| 10 | ISEN2 | Phase 2 current sense input; pulling to 5V disables Phase 2 for GPU or light-load operation. |
| 11 | ISEN1 | Phase 1 current sense input; supports DCR or resistor-based sensing with droop compensation. |
| 12 | VSEN | Differential remote voltage sense input; connects directly to processor die for accurate core regulation. |
| 13 | RTN | Remote sense return; connects to processor die ground to close Kelvin sensing loop. |
| 14–15 | ISUM− / ISUM+ | Droop current sum inputs; generate load-line slope by sensing total inductor current imbalance. |
| 16 | VDD | +5V ±5% bias supply; powers internal logic and gate drivers; IVDD = 4.6 mA typical. |
| 17 | VIN | Battery input feed-forward path; accepts +4.5V to +25V; enables adaptive line regulation. |
| 18 | IMON | Analog current monitor output; 120 µA typical per 20 µA ISUM− current; enables real-time load telemetry. |
| 19 | BOOT1 | Phase 1 high-side gate driver bootstrap capacitor connection; requires MLCC to PHASE1. |
| 20 | UGATE1 | Phase 1 high-side MOSFET gate driver output; 2 A sink/source capability with 28 ns deadtime control. |
| 21 | PHASE1 | Phase 1 switching node; connects to HS-FET source, LS-FET drain, and output inductor. |
| 22 | VSSP1 | Phase 1 low-side gate driver return; low-impedance path to LS-FET source minimizes shoot-through risk. |
| 23 | LGATE1a | Always-active Phase 1 low-side gate driver; drives primary LS-FET in all operating modes. |
| 24 | LGATE1b | Conditional Phase 1 low-side gate driver; disabled during DPRSLPVR high for deeper sleep efficiency. |
| 25 | VCCP | +5V gate driver bias; decoupled to VSSP1/VSSP2; powers UGATE/LGATE drivers with <1.5 Ω pull-down. |
| 26 | LGATE2 | Phase 2 low-side gate driver output; complements UGATE2 for full 2-phase synchronous rectification. |
| 27 | VSSP2 | Phase 2 low-side gate driver return; dedicated return path ensures independent phase control. |
| 28 | PHASE2 | Phase 2 switching node; identical function to PHASE1 but for second power stage. |
| 29 | UGATE2 | Phase 2 high-side gate driver output; matched timing and drive strength to UGATE1. |
| 30 | BOOT2 | Phase 2 high-side gate driver bootstrap capacitor connection; symmetric design to BOOT1. |
| 31–37 | VID0–VID6 | 7-bit voltage identification bus; LSB = VID0, MSB = VID6; supports dynamic VID updates during operation. |
| 38 | VR_ON | Enable input; logic-high (>0.7 V) initiates soft-start; leakage <1 µA in disable state. |
| 39 | DPRSLPVR | Deeper sleep request signal; high level triggers LGATE1b disable and phase-dropping behavior. |
| 40 | CLK_EN# | Open-drain system PLL enable; goes low 13 switching cycles after Vcore reaches 90% of boot voltage. |
Key Features
| Feature | Design Value |
|---|---|
| Robust Ripple Regulator (R3™) Modulator | Variable-frequency response during transients (faster than fixed-PWM) + reduced light-load frequency (higher efficiency) without sacrificing ±0.5% accuracy. |
| Split LGATE1 Architecture | LGATE1a remains active for basic regulation; LGATE1b disables under DPRSLPVR to eliminate body diode conduction loss in deep sleep. |
| Adaptive Body Diode Conduction Time Reduction | Monitors phase-node voltage to turn off LGATE before reverse current flows-reducing conduction loss in diode emulation mode. |
| User-Selectable Overshoot Reduction | Configurable via RBIAS resistor choice to aggressively shrink output capacitance or disable for thermal-sensitive designs. |
| Differential Remote Voltage Sensing | VSEN/RTN pair compensates for PCB IR drop, enabling <±5 mV regulation error at the processor die under full load. |
| IMON Current Monitor Output | Linear 120 µA output per 20 µA ISUM− current enables real-time load monitoring without external ADC or shunt. |
Applications
| Notebook CPU Core VR | Notebook GPU Core VR |
|---|---|
|
Use Scenario: Power delivery to Intel Core i-series or AMD Ryzen mobile CPUs requiring dynamic voltage scaling and rapid load-step response. IC Role / Device Role / Timing Role: Primary IMVP-6.5™-compliant multiphase controller managing 2-phase buck conversion, VID decoding, and PSI#/DPRSLPVR-driven phase shedding. Use Value: Enables >90% peak efficiency at 30A+ loads while maintaining ±0.5% voltage accuracy and sub-10 µs transient recovery-critical for CPU turbo boost stability. |
Use Scenario: Core voltage regulation for NVIDIA GeForce MX or AMD Radeon RX Vega mobile GPUs with aggressive power gating. IC Role / Device Role / Timing Role: Configured in 1-phase mode with FB2 compensation; regulates GPU Vcore using VID input and differential remote sensing. Use Value: Delivers stable 0.8–1.2V output with <1% droop under 15A GPU load steps, leveraging R3™ modulation for minimal output capacitor count. |
| Mobile Thin-and-Light Platform VR | Thermally Constrained Ultrabook VR |
|
Use Scenario: Space-constrained ultraportable notebooks where PCB area and thermal headroom are severely limited. IC Role / Device Role / Timing Role: Dual-phase controller with integrated gate drivers eliminates need for external drivers, reducing BOM count and layout footprint. Use Value: 40-pin 5×5 mm TQFN package plus split LGATE and diode emulation cuts standby power by >40% versus legacy controllers-extending battery life. |
Use Scenario: Fanless or passive-cooled notebooks operating continuously at elevated ambient temperatures (up to +100°C). IC Role / Device Role / Timing Role: Thermal-aware controller using NTC-biased VR_TT# and thermally compensated DCR sensing to maintain regulation across temperature. Use Value: Maintains ±0.5% accuracy from −10°C to +125°C junction, preventing CPU throttling or GPU reset due to voltage drift under thermal stress. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multiphase CPU/GPU voltage regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISL62882IRTZ | Same silicon, wider −40°C to +100°C ambient rating; identical pinout and electrical specs except POR thresholds (0.75V VIH vs. 0.7V for HRTZ). | Required for industrial or extended-temperature notebook designs; not suitable for cost-sensitive consumer models with relaxed temp range. | Select ISL62882IRTZ only if operation below −10°C is required; otherwise ISL62882HRTZ offers optimal cost/performance for mainstream notebooks. |
| ISL62882BHRTZ | Different 48-lead 6×6 mm TQFN package (L48.6x6); same functionality but higher thermal performance (θJA = 29°C/W) and added NC pins. | Used where higher power density or improved thermal margin is needed; incompatible PCB footprint vs. ISL62882HRTZ. | Choose ISL62882BHRTZ only when thermal validation shows >5°C junction rise with ISL62882HRTZ; no pin compatibility. |
Compared with ISL62882IRTZ and ISL62882BHRTZ, the ISL62882HRTZ provides the best balance of cost, thermal performance (32°C/W), and qualification for standard notebook ambient ranges (−10°C to +100°C), making it the default choice for volume consumer laptop designs.
Availability
ISL62882HRTZ is available at Aetrix Electronics and suitable for notebook CPU core VR, notebook GPU core VR, and thermally constrained ultrabook voltage regulation requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for ISL62882HRTZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation acquired Intersil in 2017 and maintains its high-performance analog and power management portfolio, including IMVP-compliant VR controllers for computing applications.
The ISL62882HRTZ belongs to Renesas' multiphase PWM regulator product line, engineered specifically for Intel IMVP-6.5™-compliant mobile CPU and GPU core voltage regulation with emphasis on efficiency, accuracy, and thermal robustness.
FAQ
What is the operating temperature range for the ISL62882HRTZ?
The ISL62882HRTZ is rated for −10°C to +100°C ambient temperature operation, with a maximum junction temperature of +125°C. This range is validated per the datasheet's Recommended Operating Conditions and aligns with mainstream consumer notebook thermal profiles. The device uses internal thermal monitoring via the NTC and VR_TT# pins to protect against overheating under sustained load.
Does the ISL62882HRTZ support both CPU and GPU voltage regulation?
Yes, the ISL62882HRTZ supports both CPU and GPU core voltage regulation. It is configurable for 1- or 2-phase operation in CPU mode (with FB2 optimization) or fixed 1-phase operation in GPU mode. Mode selection is determined by the RBIAS resistor value and ISEN2 pin configuration, enabling a single BOM part to serve dual platform roles.
How does the ISL62882HRTZ achieve fast transient response?
The ISL62882HRTZ achieves fast transient response through its proprietary Robust Ripple Regulator (R3™) modulator, which dynamically increases switching frequency during load steps by shortening the master clock period as the COMP voltage rises. This yields higher control-loop bandwidth than fixed-frequency PWM controllers-enabling sub-10 µs recovery from 50% load steps without compromising steady-state accuracy.
Can the ISL62882HRTZ be used with inductor DCR current sensing?
Yes, the ISL62882HRTZ fully supports lossless inductor DCR current sensing. It includes dedicated ISEN1 and ISEN2 inputs, differential ISUM+/ISUM− droop sensing, and NTC biasing on the NTC pin to thermally compensate DCR variation. This eliminates the need for power-wasting sense resistors while maintaining tight current balance and load-line accuracy.
What is the purpose of the FB2 pin on the ISL62882HRTZ?
The FB2 pin on the ISL62882HRTZ provides dedicated compensation network access for 1-phase operation. An internal switch connects FB2 to FB only in 2-phase mode; in 1-phase mode, the switch opens, allowing separate RC networks on FB2 to optimize loop stability and transient response-ensuring optimal performance whether configured for CPU or GPU use cases.
ISL62882HRTZ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 40-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Obsolete
- Applications:
- Controller, Intel IMVP-6.5™
- Voltage - Input:
- 5V ~ 25V
- Number of Outputs:
- 1
- Voltage - Output:
- 0.013V ~ 1.5V
- Operating Temperature:
- -10°C ~ 100°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 40-TQFN (5x5)
ISL62882HRTZ FAQ
1.How can I place an order for ISL62882HRTZ through Aetrix?
Please submit a Request for Quotation (RFQ) for ISL62882HRTZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ISL62882HRTZ reliable?
The price and inventory of ISL62882HRTZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ISL62882HRTZ is usually 5 days.
3.What payment methods are accepted for ISL62882HRTZ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ISL62882HRTZ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ISL62882HRTZ?
ISL62882HRTZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ISL62882HRTZ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ISL62882HRTZ?
For technical support, including ISL62882HRTZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ISL62882HRTZ requirements.
6.How does Aetrix verify that ISL62882HRTZ is sourced from the original manufacturer or authorized distributors?
All ISL62882HRTZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ISL62882HRTZ meets industry standards.
7.What is the process for return or replacement of ISL62882HRTZ?
All ISL62882HRTZ units undergo pre-shipment inspection (PSI). If there is an issue with ISL62882HRTZ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ISL62882HRTZ part is unused and in its original packaging.
Return procedure for ISL62882HRTZ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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