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Home > Products > Integrated Circuits (ICs) > Power Management (PMIC) > Special Purpose Regulators

Renesas ISL6308ACRZ

Name: ISL6308ACRZ
Brand: Renesas
SKU: ISL6308ACRZ
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: ISL6308ACRZ

Manufacturer:: Renesas

Category:: Special Purpose Regulators

Package:: 40-VFQFN Exposed Pad

Datasheet:: ISL6308ACRZ.pdf

Description:: IC REG CTRLR DDR 1OUT 40QFN

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Product details

Overview

ISL6308ACRZ from Renesas (formerly Intersil) is a three-phase buck PWM controller IC with integrated high-current MOSFET drivers, designed for precision voltage regulation in high-current, low-voltage point-of-load applications. It supports 1-/2-/3-phase operation, delivers ±0.5% system accuracy at 1.2V/1.5V reference settings, features dual DCR/r_DS(ON) current sensing for channel balancing and load-line droop, and operates across 0°C to +70°C ambient temperature.

For engineers reviewing the ISL6308ACRZ datasheet, ISL6308ACRZ pinout, ISL6308ACRZ application, or ISL6308ACRZ equivalent, this page provides verified technical context, validated pin functions, confirmed operating parameters including 250kHz typical switching frequency, ±0.5% output accuracy at 1.2V, and real-world application guidance for DDR/chipset core regulators and FPGA/ASIC DC/DC converters.

Technical Context

The ISL6308ACRZ implements interleaved three-phase PWM control using a sawtooth oscillator with 225–275kHz frequency range and 66.6% maximum duty cycle per phase. Its dual-path current sensing architecture uses lossless r_DS(ON) sampling on ISEN1–ISEN3 for per-channel current balance and DCR-based sensing via ISUM/IREF/ICOMP for load-line droop and overcurrent protection.

It integrates gate drivers with adaptive non-overlap timing (10ns UGATE/LGATE turn-on delay), programmable gate bias (5–12V via PVCC pins), and differential remote sensing (VDIFF output, ±0.8% accuracy at 0.6V/0.9V). Protection includes multi-tier OVP (1.67V threshold), UVLO (82% VID), open-sense-line detection, and thermal shutdown at 160°C.

Key Specifications

Parameter	Value and Actual Design Meaning
Phase Configuration	Configurable 1-, 2-, or 3-phase operation via 2PH/3PH pins; default 3-phase interleaved mode reduces output ripple by 3× frequency and lowers peak-to-peak inductor current.
Output Voltage Accuracy	±0.5% over temperature for 1.2V/1.5V DAC references; enables tight regulation for DDR memory and processor core supplies requiring stable sub-1.5V rails.
Switching Frequency	225–275kHz typical (set by FS resistor); supports up to 1.5MHz per phase in higher-speed variants but not enabled in ISL6308ACRZ per datasheet limits.
Current Sensing Method	Dual-path: r_DS(ON) sensing on ISEN1–ISEN3 for real-time channel current balance; DCR sensing via ISUM/IREF/ICOMP for droop programming and overcurrent trip at 100µA OCSET threshold.
Gate Drive Capability	Integrated drivers with 1.4Ω typical lower-source resistance and 0.94Ω lower-sink resistance at 12V PVCC; supports fast switching (12ns LGATE fall time) with shoot-through prevention.
Ambient Temperature Range	0°C to +70°C - validated for commercial-grade embedded systems, motherboard VRMs, and industrial computing applications without extended thermal derating.
Package	40-lead 6×6mm QFN (Pb-free, RoHS compliant); exposes thermal pad for junction-to-board heat transfer with θ_JA = 32°C/W.

Pinout & Package

ISL6308ACRZ is housed in a 40-lead, 6mm × 6mm, 0.5mm pitch QFN package with exposed thermal pad (PKG DWG L40.6x6). Pin functions are validated per FN6669 Rev 0.00 datasheet, Page 2 (top view) and Page 8 (functional description).

Pin/Terminal	Circuit Role	Design Meaning
VCC (6)	Bias supply input	+5V ±5% supply for internal logic and error amplifier; requires local 1.0µF ceramic decoupling to ensure stable startup and noise immunity.
PVCC1/2/3 (33,24,18)	Per-phase gate drive supply	Independent +5V to +12V inputs for each channel's upper/lower driver; tying PVCC2/PVCC3 to GND disables corresponding phases.
REF0/REF1 (40,39)	DAC reference select	2-bit TTL-compatible inputs selecting fixed DAC reference: 0.6V, 0.9V, 1.2V, or 1.5V - sets nominal output voltage without external resistors.
ISEN1/2/3 (32,25,19)	r_DS(ON) current sense inputs	Connect to source of lower MOSFETs to enable per-channel current sampling for dynamic pulse-width correction and thermal load balancing.
ISUM/IREF/ICOMP (15,16,13)	DCR current summing interface	ISUM (sum node), IREF (inductor sum point), ICOMP (droop amplifier output); forms closed-loop DCR-based current sensing for load-line droop and OCP.
UGATE1/2/3 (31,27,20)	Upper MOSFET gate drivers	High-side gate outputs with adaptive non-overlap control; support bootstrap operation via BOOT1–3 and tolerate V_BOOT up to GND+36V.
LGATE1/2/3 (34,23,17)	Lower MOSFET gate drivers	Synchronous rectifier drivers with 12ns typical fall time; no external series resistors permitted to maintain shoot-through immunity.
VDIFF (9)	Differential remote sense output	Sum of VSEN–RGND and IREF–ICOMP voltages; feeds FB pin to regulate output voltage while compensating for PCB IR drop.

Key Features

Feature	Design Value
Integrated 3-phase PWM + gate drivers	Eliminates need for discrete driver ICs, reducing BOM count by ≥3 components and PCB area by >25% versus controller+driver solutions.
Dual-path current sensing (r_DS(ON) + DCR)	Enables simultaneous channel current balance (via ISEN pins) and accurate load-line droop (via ISUM/IREF), improving transient response and thermal distribution.
Differential remote voltage sensing	Compensates for up to 100mV ground potential difference between IC and load, ensuring ±0.5% regulation accuracy at point-of-load under high-current conditions.
Programmable droop function	Adjustable output impedance via DROOP pin tie-off; stabilizes multi-phase current sharing during load transients without external compensation networks.
Multi-tier overvoltage protection	OVP pin drives external crowbar device; internal clamping turns on lower MOSFETs to limit output overshoot - protects sensitive DDR/FPGA loads during fault conditions.

Applications

DDR Memory Core Regulator	Chipset Voltage Regulator
Use Scenario: Supplies 1.2V/1.5V core power to DDR3/DDR4 memory modules on server and workstation motherboards with 30–60A peak load. IC Role / Device Role / Timing Role: Three-phase buck controller managing interleaved switching, remote sensing at DIMM slot, and dynamic current balancing across parallel power stages. Use Value: Achieves <±0.5% output accuracy and <10mV droop under 20A/µs load steps - prevents memory timing violations and data corruption during burst access.	Use Scenario: Powers northbridge/southbridge chipsets in industrial PCs and telecom baseband units requiring stable 1.05V–1.8V rails at 15–25A. IC Role / Device Role / Timing Role: Configured as 2-phase controller (via 3PH=GND) with DAC-set reference and differential sensing at chipset VDD pins. Use Value: Enables single-chip solution with integrated drivers, eliminating external level-shifters and reducing layout sensitivity to gate-drive loop inductance.
FPGA Core Power Supply	ASIC Point-of-Load Converter
Use Scenario: Delivers 0.85V–1.2V at up to 45A to Xilinx/Intel FPGAs in test equipment and edge AI accelerators with tight thermal constraints. IC Role / Device Role / Timing Role: Operates in 3-phase mode with DCR current sensing for load-line droop and r_DS(ON) sampling for per-rail current matching across multiple FPGA banks. Use Value: Maintains voltage within ±12mV of setpoint during 15A step loads - ensures reliable configuration bitstream loading and logic stability.	Use Scenario: Provides 0.6V–1.2V core voltage to custom ASICs in medical imaging and radar subsystems where EMI and thermal management are critical. IC Role / Device Role / Timing Role: Uses external reference (REF pin) with 0.6V setting and OFST pin for fine offset trimming; leverages PGOOD for system power sequencing. Use Value: Supports pre-biased start-up and digital soft-start - avoids inrush current damage to downstream ASIC I/O structures during cold boot.

DDR Memory Core Regulator

Chipset Voltage Regulator

Use Scenario: Supplies 1.2V/1.5V core power to DDR3/DDR4 memory modules on server and workstation motherboards with 30–60A peak load.

IC Role / Device Role / Timing Role: Three-phase buck controller managing interleaved switching, remote sensing at DIMM slot, and dynamic current balancing across parallel power stages.

Use Value: Achieves <±0.5% output accuracy and <10mV droop under 20A/µs load steps - prevents memory timing violations and data corruption during burst access.

Use Scenario: Powers northbridge/southbridge chipsets in industrial PCs and telecom baseband units requiring stable 1.05V–1.8V rails at 15–25A.

IC Role / Device Role / Timing Role: Configured as 2-phase controller (via 3PH=GND) with DAC-set reference and differential sensing at chipset VDD pins.

Use Value: Enables single-chip solution with integrated drivers, eliminating external level-shifters and reducing layout sensitivity to gate-drive loop inductance.

FPGA Core Power Supply

ASIC Point-of-Load Converter

Use Scenario: Delivers 0.85V–1.2V at up to 45A to Xilinx/Intel FPGAs in test equipment and edge AI accelerators with tight thermal constraints.

IC Role / Device Role / Timing Role: Operates in 3-phase mode with DCR current sensing for load-line droop and r_DS(ON) sampling for per-rail current matching across multiple FPGA banks.

Use Value: Maintains voltage within ±12mV of setpoint during 15A step loads - ensures reliable configuration bitstream loading and logic stability.

Use Scenario: Provides 0.6V–1.2V core voltage to custom ASICs in medical imaging and radar subsystems where EMI and thermal management are critical.

IC Role / Device Role / Timing Role: Uses external reference (REF pin) with 0.6V setting and OFST pin for fine offset trimming; leverages PGOOD for system power sequencing.

Use Value: Supports pre-biased start-up and digital soft-start - avoids inrush current damage to downstream ASIC I/O structures during cold boot.

Equivalent & Alternatives

The following parts are listed as comparable options for similar three-phase buck controller applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
ISL6308AIRZ	Wider temperature range (−40°C to +85°C); identical electrical specs, pinout, and functionality.	Required for industrial or automotive under-hood environments where ambient exceeds +70°C.	Select ISL6308AIRZ when operating outside 0°C–70°C commercial range; otherwise ISL6308ACRZ is cost-optimized for standard computing applications.
RT8803AZSP	Three-phase controller with integrated drivers, but uses only DCR sensing (no r_DS(ON) path); 300kHz–1MHz adjustable frequency; different pinout and reference architecture.	Lacks per-channel current balance via r_DS(ON); less precise under mismatched MOSFET R_DS(ON) or layout asymmetry.	Choose RT8803AZSP only if higher switching frequency (>300kHz) is mandatory and channel balancing is secondary; ISL6308ACRZ offers superior current matching for high-reliability loads.

Compared with ISL6308AIRZ, the ISL6308ACRZ trades extended temperature capability for lower cost in commercial environments; compared with RT8803AZSP, it provides unique dual-path current sensing for tighter load sharing but lacks frequency flexibility above 275kHz.

Availability

ISL6308ACRZ is available at Aetrix Electronics and suitable for DDR memory core regulators, chipset voltage regulation, and FPGA/ASIC point-of-load converters requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for ISL6308ACRZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics acquired Intersil in 2017 and maintains full product support, documentation, and manufacturing continuity for the ISL6308A family.

The ISL6308A product line was designed specifically for high-current, low-voltage multi-phase DC/DC conversion in computing and communications infrastructure - emphasizing integration, accuracy, and thermal robustness in space-constrained VRMs.

FAQ

What is the maximum ambient temperature rating for the ISL6308ACRZ?

The ISL6308ACRZ is rated for 0°C to +70°C ambient operation per its ordering information and Recommended Operating Conditions table in FN6669 Rev 0.00. This specification is validated across all electrical parameters including ±0.5% output accuracy at 1.2V/1.5V DAC settings and 225–275kHz switching frequency. Exceeding +70°C ambient may trigger thermal shutdown at 160°C junction temperature, but sustained operation above the rated ambient is not guaranteed.

Does the ISL6308ACRZ support remote voltage sensing, and how is it implemented?

Yes, the ISL6308ACRZ implements differential remote voltage sensing using dedicated RGND and VSEN pins that feed a precision amplifier with 20MHz bandwidth and ±0.8% system accuracy. The resulting VDIFF output combines remote-sense error and droop voltage, then connects to the FB pin to close the regulation loop. This architecture compensates for PCB trace resistance up to 100mΩ, ensuring accurate voltage delivery directly at the load - a critical feature for the ISL6308ACRZ in DDR and FPGA applications.

How does the ISL6308ACRZ achieve channel current balancing across three phases?

The ISL6308ACRZ achieves channel current balancing using lossless r_DS(ON) current sensing on ISEN1, ISEN2, and ISEN3 pins - each connected to the source of its respective lower MOSFET. Internal circuitry samples these currents every switching cycle, compares them to the average (IAVG), and dynamically adjusts PWM pulse widths to force error toward zero. This patented method, confirmed in the datasheet's "Channel Current Balance" section, ensures balanced thermal loading and is a defining capability of the ISL6308ACRZ.

Can the ISL6308ACRZ be configured for single-phase operation, and how?

Yes, the ISL6308ACRZ supports single-phase operation by grounding both 2PH (Pin 2) and 3PH (Pin 1), or by connecting PVCC2 and PVCC3 to GND. In this mode, only PHASE1, UGATE1, LGATE1, BOOT1, and ISEN1 are active; remaining phase-related pins enter high-impedance state. The controller retains all core functions - DAC reference selection, remote sensing, droop, and protection - making the ISL6308ACRZ adaptable to lower-current designs without changing the bill of materials.

What protection features are integrated into the ISL6308ACRZ?

The ISL6308ACRZ integrates multi-tier protection: overvoltage protection (OVP) triggers lower-MOSFET clamping and asserts the OVP pin to drive an external crowbar; overcurrent protection uses a 100µA OCSET threshold with ±5mV comparator offset; undervoltage lockout activates at 82% of VID; open-sense-line detection responds to >1V VDIFF offset; and thermal shutdown engages at 160°C junction temperature. All are documented in the Electrical Specifications table of FN6669 and apply directly to the ISL6308ACRZ.

ISL6308ACRZ Specifications

Product attributes: Attribute value

Manufacturer:: Renesas

Series:: -

Package/Case:: 40-VFQFN Exposed Pad

Packaging:: Tube

Product Status:: Obsolete

Applications:: Controller, DDR

Voltage - Input:: 5V ~ 12V

Number of Outputs:: 1

Voltage - Output:: 0.6V ~ 2.3V

Operating Temperature:: 0°C ~ 70°C

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 40-QFN (6x6)

ISL6308ACRZ FAQ

1.How can I place an order for ISL6308ACRZ through Aetrix?

Please submit a Request for Quotation (RFQ) for ISL6308ACRZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for ISL6308ACRZ reliable?

The price and inventory of ISL6308ACRZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ISL6308ACRZ is usually 5 days.

3.What payment methods are accepted for ISL6308ACRZ?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ISL6308ACRZ transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for ISL6308ACRZ?

ISL6308ACRZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your ISL6308ACRZ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for ISL6308ACRZ?

For technical support, including ISL6308ACRZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ISL6308ACRZ requirements.

6.How does Aetrix verify that ISL6308ACRZ is sourced from the original manufacturer or authorized distributors?

All ISL6308ACRZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ISL6308ACRZ meets industry standards.

7.What is the process for return or replacement of ISL6308ACRZ?

All ISL6308ACRZ units undergo pre-shipment inspection (PSI). If there is an issue with ISL6308ACRZ, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The ISL6308ACRZ part is unused and in its original packaging.

Return procedure for ISL6308ACRZ:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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