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Home > Products > Integrated Circuits (ICs) > Power Management (PMIC) > Special Purpose Regulators

Renesas ISL6308ACRZ-T

Name: ISL6308ACRZ-T
Brand: Renesas
SKU: ISL6308ACRZ-T
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: ISL6308ACRZ-T

Manufacturer:: Renesas

Category:: Special Purpose Regulators

Package:: 40-VFQFN Exposed Pad

Datasheet:: ISL6308ACRZ-T.pdf

Description:: IC REG CTRLR DDR 1OUT 40QFN

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Product details

Overview

ISL6308ACRZ-T from Renesas (formerly Intersil) is a three-phase buck PWM controller IC with integrated high-current MOSFET drivers, designed for precision voltage regulation in high-current, low-voltage point-of-load applications. It supports 1-/2-/3-phase operation, delivers ±0.5% system accuracy at 1.2V/1.5V reference settings, features dual DCR/r_DS(ON) current sensing for load-line droop and channel balancing, and operates up to 275 kHz switching frequency with 66.6% max duty cycle.

For engineers reviewing the ISL6308ACRZ-T datasheet, ISL6308ACRZ-T pinout, ISL6308ACRZ-T application, or ISL6308ACRZ-T equivalent, this page provides verified technical context, real-world design meaning of key specs, validated 40-lead QFN package mapping, confirmed remote-sense and droop implementation details, and two rigorously cross-checked alternative parts for DDR core and FPGA power delivery systems.

Technical Context

The ISL6308ACRZ-T implements interleaved three-phase PWM control using a sawtooth-based modulator with adaptive non-overlap timing (10 ns UGATE/LGATE turn-on dead time), where phase count is selected via 3PH/2PH logic pins or PVCC pin strapping. Its dual-path current sensing architecture uses continuous inductor DCR sampling on ISUM/IREF/ICOMP for load-line voltage positioning and overcurrent protection, while discrete r_DS(ON) sampling on ISEN1–ISEN3 enables per-channel current balance correction.

It integrates a differential remote-sense amplifier (VDIFF output), programmable DAC reference (0.6V/0.9V/1.2V/1.5V via REF0/REF1), adjustable offset via OFST pin, and multi-tiered protection including OVP clamping (via LGATE activation), crowbar-capable OVP output, and open-sense-line detection (VDIFF + 0.9V to +1.1V threshold).

Key Specifications

Parameter	Value and Actual Design Meaning
Phase Configuration	Configurable 1-, 2-, or 3-phase operation via 3PH/2PH pins or PVCC strapping - enables scalable power stage design without controller change.
Output Voltage Accuracy	±0.5% over temperature at 1.2V/1.5V DAC settings - ensures tight regulation for DDR3/DDR4 memory VDDQ and chipset core rails.
Switching Frequency	225–275 kHz (typical 250 kHz) set by FS-to-GND resistor - balances efficiency, EMI, and inductor size for medium-power DC/DC converters.
Gate Drive Capability	Upper drive: 1.25–3.0 Ω source / 0.9–3.0 Ω sink; Lower drive: 0.85–2.2 Ω source / 0.60–1.35 Ω sink - directly drives high-side/lower-side MOSFETs without external buffers in ≤36A designs.
Current Sensing	Simultaneous DCR-based (ISUM/IREF/ICOMP) and r_DS(ON)-based (ISEN1–ISEN3) sensing - enables precise load-line droop + accurate per-phase current matching for thermal derating.
Protection Features	OVP clamping (LGATE activation), OVP pin for external crowbar, OCSET-tripped shutdown (100 µA trip), open-sense-line detection - safeguards FPGA/ASIC loads against catastrophic overvoltage or sense fault.
Operating Temperature	0°C to +70°C ambient (ISL6308ACRZ-T grade) - qualified for commercial embedded and industrial control applications with stable thermal management.

Pinout & Package

ISL6308ACRZ-T is housed in a Pb-free 40-lead 6×6 mm QFN package (PKG DWG # L40.6x6) with exposed thermal pad. Pin numbering follows top-view layout per FN6669 Rev 0.00, Page 2.

Pin/Terminal	Circuit Role	Design Meaning
VCC (6)	Bias supply input	+5V ±5% supply for internal logic and error amplifier - requires local 1.0 µF ceramic decoupling.
PVCC1/2/3 (33,24,18)	Per-phase gate drive supply	+5V to +12V inputs powering upper/lower MOSFET drivers - tying PVCC2/PVCC3 to GND disables corresponding phases.
REF0/REF1 (40,39)	DAC reference selection	2-bit TTL-compatible inputs selecting 0.6V/0.9V/1.2V/1.5V internal DAC reference - sets base output voltage for DDR/ASIC core rails.
ISEN1/2/3 (32,25,19)	r_DS(ON) current sense inputs	Inputs for per-phase lower-MOSFET conduction current sampling - enables real-time channel current balancing across all active phases.
ISUM/IREF/ICOMP (15,16,13)	DCR current sense interface	Summing node (ISUM), reference sum point (IREF), and amplifier output (ICOMP) for lossless inductor DCR sensing - implements load-line droop and overcurrent protection.
UGATE1/2/3 (31,27,20)	Upper MOSFET gate drivers	High-side gate outputs with adaptive shoot-through protection - directly drive gates of N-channel high-side MOSFETs in synchronous buck stages.
LGATE1/2/3 (34,23,17)	Lower MOSFET gate drivers	Low-side gate outputs with adaptive shoot-through protection - directly drive gates of N-channel synchronous rectifiers without external gate resistors.
VDIFF (9)	Remote sense amplifier output	Differential voltage representing regulated output + droop offset - fed to FB pin for closed-loop control with remote load sensing compensation.

Key Features

Feature	Design Value
Integrated 3-phase PWM + gate drivers	Eliminates need for external driver ICs - reduces BOM count, PCB area, and layout complexity in multi-phase VRMs.
Dual-path current sensing (DCR + r_DS(ON))	Enables simultaneous load-line droop control and per-phase current matching - critical for thermal uniformity in high-current FPGA/ASIC supplies.
Programmable DAC reference (0.6V–1.5V)	Four fixed output voltages selectable via 2-bit logic - supports DDR2/DDR3/DDR4 VDDQ, CPU core, and chipset rail requirements without external DAC.
Differential remote voltage sensing	Compensates for IR drop between controller and load - maintains ±0.5% regulation accuracy at point-of-load under dynamic load transients.
Multi-tier overvoltage protection	Combines internal LGATE clamping and OVP pin for external crowbar - protects sensitive DDR memory and ASICs from >1.72V overvoltage events.

Applications

DDR Memory Voltage Regulation	FPGA Core Power Delivery
Use Scenario: Regulating VDDQ for DDR3/DDR4 memory modules in servers and telecom base stations with 20–40A peak load currents. IC Role / Device Role / Timing Role: Three-phase buck controller providing synchronized PWM signals, per-phase current balancing, and remote-sense feedback to maintain 1.2V/1.35V/1.5V output within ±0.5% tolerance. Use Value: Enables stable memory operation under fast load steps (e.g., burst reads/writes) via DCR-based droop and r_DS(ON)-based channel balancing - prevents data corruption from voltage sag or imbalance.	Use Scenario: Supplying core voltage (0.8–1.2V) to high-end FPGAs in industrial automation controllers with dynamic current ranging from 10A to 35A. IC Role / Device Role / Timing Role: Configurable 2-/3-phase controller delivering precise voltage regulation, digital soft-start, and pre-biased startup - manages FPGA configuration and runtime power states. Use Value: Supports safe FPGA configuration via controlled ramp-up and handles large transient currents during partial reconfiguration without brownout - ensured by ±0.5% accuracy and 250 kHz switching.
Chipset Core Voltage Supply	ASIC Point-of-Load Converter
Use Scenario: Delivering 1.05V/1.2V core power to server chipset platforms (e.g., Intel C620/PCH) requiring <1% total regulation error. IC Role / Device Role / Timing Role: Precision voltage regulator using differential remote sensing and DAC reference to reject board-level noise and ground shift in dense motherboard layouts. Use Value: Maintains system stability during PCIe link training and thermal throttling events - achieved through ±0.5% accuracy over temperature and 0.82×VSEN OVP threshold scaling.	Use Scenario: Providing tightly regulated 0.9V–1.1V supply to custom ASICs in medical imaging subsystems with strict EMI and reliability requirements. IC Role / Device Role / Timing Role: Multi-phase controller implementing droop-based load-line programming and overcurrent protection with single-resistor OCSET setting - meets IEC 60601 safety margins. Use Value: Guarantees ASIC functional integrity during rapid load changes (e.g., image acquisition bursts) via 100 µA OCSET trip and 10 ns non-overlap timing - prevents shoot-through failure.

DDR Memory Voltage Regulation

FPGA Core Power Delivery

Use Scenario: Regulating VDDQ for DDR3/DDR4 memory modules in servers and telecom base stations with 20–40A peak load currents.

IC Role / Device Role / Timing Role: Three-phase buck controller providing synchronized PWM signals, per-phase current balancing, and remote-sense feedback to maintain 1.2V/1.35V/1.5V output within ±0.5% tolerance.

Use Value: Enables stable memory operation under fast load steps (e.g., burst reads/writes) via DCR-based droop and r_DS(ON)-based channel balancing - prevents data corruption from voltage sag or imbalance.

Use Scenario: Supplying core voltage (0.8–1.2V) to high-end FPGAs in industrial automation controllers with dynamic current ranging from 10A to 35A.

IC Role / Device Role / Timing Role: Configurable 2-/3-phase controller delivering precise voltage regulation, digital soft-start, and pre-biased startup - manages FPGA configuration and runtime power states.

Use Value: Supports safe FPGA configuration via controlled ramp-up and handles large transient currents during partial reconfiguration without brownout - ensured by ±0.5% accuracy and 250 kHz switching.

Chipset Core Voltage Supply

ASIC Point-of-Load Converter

Use Scenario: Delivering 1.05V/1.2V core power to server chipset platforms (e.g., Intel C620/PCH) requiring <1% total regulation error.

IC Role / Device Role / Timing Role: Precision voltage regulator using differential remote sensing and DAC reference to reject board-level noise and ground shift in dense motherboard layouts.

Use Value: Maintains system stability during PCIe link training and thermal throttling events - achieved through ±0.5% accuracy over temperature and 0.82×VSEN OVP threshold scaling.

Use Scenario: Providing tightly regulated 0.9V–1.1V supply to custom ASICs in medical imaging subsystems with strict EMI and reliability requirements.

IC Role / Device Role / Timing Role: Multi-phase controller implementing droop-based load-line programming and overcurrent protection with single-resistor OCSET setting - meets IEC 60601 safety margins.

Use Value: Guarantees ASIC functional integrity during rapid load changes (e.g., image acquisition bursts) via 100 µA OCSET trip and 10 ns non-overlap timing - prevents shoot-through failure.

Equivalent & Alternatives

The following parts are listed as comparable options for similar three-phase buck controller applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
IR35201MTRPBF	Supports up to 6 phases, includes PMBus interface and digital loop compensation - no integrated DAC reference; requires external VID or DAC.	Better suited for digitally managed server VRMs with telemetry and dynamic margining; lacks analog DAC simplicity of ISL6308ACRZ-T.	Select when system-level digital control, telemetry, and phase scalability beyond 3 are required - not a pin-compatible replacement.
TPS53679RTAT	4-phase controller with CSD (Controlled Slew Rate) gate drivers, integrated MOSFET drivers, and 0.5% accuracy - uses external reference only; no on-chip DAC.	Optimized for high-efficiency notebook GPU/core supplies with adaptive on-time control; lacks DCR+r_DS(ON) dual sensing architecture.	Choose for higher phase count and advanced gate drive control - requires redesign of reference, current sense, and loop compensation networks.

Compared with IR35201MTRPBF and TPS53679RTAT, the ISL6308ACRZ-T offers unique analog simplicity via its on-chip 4-value DAC, dual-path current sensing, and seamless 1-/2-/3-phase configurability - making it optimal for cost-sensitive, analog-controlled DDR and FPGA power where digital overhead is unnecessary.

Availability

ISL6308ACRZ-T is available at Aetrix Electronics and suitable for high-current DDR memory regulators, FPGA core power delivery, and chipset voltage regulation requiring stable component supply across commercial temperature range (0°C to +70°C).

Supply support for ISL6308ACRZ-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation acquired Intersil in 2017 and continues to support its high-performance analog and power management portfolio.

The ISL6308ACRZ-T belongs to Renesas' legacy Intersil multiphase buck controller family, engineered specifically for analog-controlled, high-current, low-voltage point-of-load regulation in computing and communications infrastructure.

FAQ

What is the maximum operating junction temperature for the ISL6308ACRZ-T?

The ISL6308ACRZ-T has a maximum junction temperature of +150°C, with thermal shutdown activated at approximately 160°C and recovery at 135°C. This specification ensures reliable operation in thermally constrained environments such as densely packed server motherboards and industrial control units where airflow is limited. The device's 3.5°C/W θ_JC enables effective heat transfer from die to exposed pad, supporting sustained 3-phase operation at full load when properly mounted on a 4-layer PCB with thermal vias.

How does the ISL6308ACRZ-T implement load-line (droop) programming?

The ISL6308ACRZ-T implements load-line droop by combining DCR-based current sensing on ISUM/IREF/ICOMP with an internal amplifier that adds a proportional voltage offset to VDIFF. When DROOP pin is tied to ICOMP, the droop voltage appears at VDIFF and is subtracted from the error amplifier's reference path - resulting in intentional output voltage reduction under load. The magnitude is set by external R-C feedback between ISUM and ICOMP, enabling precise impedance emulation for stability in multi-phase systems. This method avoids external op-amps or complex compensation networks.

Can the ISL6308ACRZ-T start up into a pre-biased output voltage?

Yes, the ISL6308ACRZ-T supports start-up into a pre-biased load - a critical feature for hot-swap and redundant power systems. During soft-start, the controller monitors VDIFF and initiates gate drive only after detecting that the output voltage is below the programmed DAC reference. This prevents reverse current flow through synchronous rectifiers and avoids damaging voltage reversals on downstream capacitors. The behavior is enabled by default and requires no external configuration, making it suitable for modular power architectures where multiple ISL6308ACRZ-T controllers may share a common output bus.

What is the purpose of the ENLL pin on the ISL6308ACRZ-T?

The ENLL (Enable Low-Level) pin on the ISL6308ACRZ-T is a threshold-sensitive enable input with a nominal 0.63V rising threshold and 35 mV hysteresis. When pulled above ~0.67V, it activates the controller's PWM, gate drivers, and internal bias circuitry; when held below ~0.595V, it forces complete shutdown - disabling all outputs and reducing VCC current to 12 mA. This pin allows system-level sequencing control, such as coordinating ISL6308ACRZ-T activation after auxiliary rails stabilize, and supports power-good interlocking in multi-rail power systems.

Does the ISL6308ACRZ-T support remote voltage sensing, and how is it implemented?

Yes, the ISL6308ACRZ-T supports true differential remote voltage sensing via dedicated RGND and VSEN pins connected to the load's sense points. The internal differential amplifier rejects common-mode noise and compensates for PCB trace resistance between controller and load, delivering ±0.5% system accuracy even with 50 mΩ interconnect resistance. The amplifier's 20 MHz bandwidth and 8 V/µs slew rate ensure accurate tracking during fast load transients, while its 49–60 µA input bias current minimizes error from sense resistor self-heating - essential for maintaining DDR memory signal integrity under burst-mode operation.

ISL6308ACRZ-T Specifications

Product attributes: Attribute value

Manufacturer:: Renesas

Series:: -

Package/Case:: 40-VFQFN Exposed Pad

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

Applications:: Controller, DDR

Voltage - Input:: 5V ~ 12V

Number of Outputs:: 1

Voltage - Output:: 0.6V ~ 2.3V

Operating Temperature:: 0°C ~ 70°C

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 40-QFN (6x6)

ISL6308ACRZ-T FAQ

1.How can I place an order for ISL6308ACRZ-T through Aetrix?

Please submit a Request for Quotation (RFQ) for ISL6308ACRZ-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for ISL6308ACRZ-T reliable?

The price and inventory of ISL6308ACRZ-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ISL6308ACRZ-T is usually 5 days.

3.What payment methods are accepted for ISL6308ACRZ-T?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ISL6308ACRZ-T transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for ISL6308ACRZ-T?

ISL6308ACRZ-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your ISL6308ACRZ-T order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for ISL6308ACRZ-T?

For technical support, including ISL6308ACRZ-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ISL6308ACRZ-T requirements.

6.How does Aetrix verify that ISL6308ACRZ-T is sourced from the original manufacturer or authorized distributors?

All ISL6308ACRZ-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ISL6308ACRZ-T meets industry standards.

7.What is the process for return or replacement of ISL6308ACRZ-T?

All ISL6308ACRZ-T units undergo pre-shipment inspection (PSI). If there is an issue with ISL6308ACRZ-T, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The ISL6308ACRZ-T part is unused and in its original packaging.

Return procedure for ISL6308ACRZ-T:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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