Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Power Management (PMIC) > Special Purpose Regulators

Renesas ISL6308AIRZ-T

Name: ISL6308AIRZ-T
Brand: Renesas
SKU: ISL6308AIRZ-T
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: ISL6308AIRZ-T

Manufacturer:: Renesas

Category:: Special Purpose Regulators

Package:: 40-VFQFN Exposed Pad

Datasheet:: ISL6308AIRZ-T.pdf

Description:: IC REG CTRLR DDR 1OUT 40QFN

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:1,632

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

ISL6308AIRZ-T from Renesas Electronics (formerly Intersil) is a three-phase buck PWM controller with integrated high-current MOSFET drivers, designed for precision voltage regulation in high-current, low-voltage point-of-load applications. It supports 1-/2-/3-phase operation, delivers ±0.5% system accuracy at 1.2V/1.5V reference settings, features dual DCR/r_DS(ON) current sensing for channel balancing and load-line droop, and operates across –40°C to +85°C in a 40-lead 6×6 QFN package.

For engineers reviewing the ISL6308AIRZ-T datasheet, ISL6308AIRZ-T pinout, ISL6308AIRZ-T application, or ISL6308AIRZ-T equivalent, key selection considerations include its integrated gate drivers (5–12V bias), programmable DAC reference (0.6V/0.9V/1.2V/1.5V), differential remote sensing, droop control via DROOP pin, and multi-tier overvoltage/overcurrent protection with OVP output for crowbar implementation.

Technical Context

The ISL6308AIRZ-T implements interleaved three-phase PWM control using a shared sawtooth oscillator and phase-shifted termination signals-PWM2 lags PWM1 by 1/3 cycle, PWM3 lags PWM2 by 1/3 cycle-enabling 3× ripple frequency multiplication and reduced per-phase inductor current ripple. Its control loop integrates a unity-gain differential amplifier for remote VSEN/RGND sensing and an error amplifier (96 dB DC gain, 20 MHz GBW) with external Type II/III compensation via COMP/FB pins.

Current management combines lossless r_DS(ON) sampling on ISEN1–ISEN3 for real-time channel-current balance and continuous DCR-based sensing on ISUM/IREF/ICOMP for load-line droop and overcurrent protection. The OCSET pin sets trip threshold at 100 µA, while ENLL enables/disables operation at ~0.66 V with 35 mV hysteresis.

Key Specifications

Parameter	Value and Actual Design Meaning
Operating Temp Range	–40°C to +85°C - qualified for industrial embedded and server power delivery environments.
Switching Frequency	225–275 kHz (typical 250 kHz) - set by FS-to-GND resistor; supports up to 1.5 MHz per phase in higher-speed variants but not this part.
Reference Accuracy	±0.5% over temperature (for 1.2V/1.5V DAC settings) - ensures tight output regulation under thermal stress without external trimming.
Gate Drive Capability	Upper drive: 2.0 Ω source / 1.6 Ω sink; Lower drive: 1.4 Ω source / 0.94 Ω sink - drives high-side/lower-side MOSFETs directly with <30 ns rise/fall times at 12 V PVCC.
Overcurrent Threshold	100 µA at OCSET pin - sets precise current limit via external resistor; accuracy ±5 mV offset between ISUM and OCSET.
Droop Control	Enabled by tying DROOP to ICOMP - implements programmable load-line response using DCR sensing; disabled by tying DROOP to IREF.
Remote Sensing	Differential VSEN/RGND inputs with 20 MHz bandwidth and 8 V/µs slew rate - compensates PCB IR drop up to several hundred mV at load.

Pinout & Package

Package: 40-lead, 6 mm × 6 mm, 0.5 mm pitch QFN (Pb-free, RoHS compliant); exposed thermal pad (pin 41 = GND) for enhanced thermal dissipation; θ_JA = 32°C/W, θ_JC = 3.5°C/W.

Pin/Terminal	Circuit Role	Design Meaning
VCC (6)	Bias supply input	+5 V ±5% supply for internal logic and error amp; requires local 1 µF ceramic decoupling.
PVCC1/2/3 (33/24/18)	Phase gate-drive supplies	Independent +5–12 V inputs per channel; grounding PVCC2 or PVCC3 disables corresponding phase.
REF0/REF1 (40/39)	DAC reference select	2-bit TTL inputs selecting 0.6V/0.9V/1.2V/1.5V internal DAC reference; internally pulled high (~1.2 V).
ISEN1/2/3 (32/25/19)	r_DS(ON) current sense inputs	Connect to phase node via sense resistor; enable per-channel current sampling for dynamic balance.
UGATE1/2/3 (31/27/20)	High-side gate drivers	Direct drive outputs for upper N-MOSFET gates; include adaptive shoot-through protection.
LGATE1/2/3 (34/23/17)	Low-side gate drivers	Direct drive outputs for synchronous rectifier gates; no external series resistors permitted.
ISUM/IREF/ICOMP (15/16/13)	DCR current sensing nodes	ISUM = sum of DCR voltages; IREF = inductor sum point; ICOMP = droop amplifier output.
DROOP (14)	Droop enable/disable	Tie to ICOMP to enable load-line droop; tie to IREF to disable - no external components required.

Key Features

Feature	Design Value
Integrated 3-phase gate drivers	Eliminates need for external driver ICs; reduces BOM count and layout area while enabling <30 ns switching transitions.
Dual-mode current sensing	Simultaneous r_DS(ON) (channel balance) and DCR (droop + OCP) sensing - avoids trade-offs between accuracy and lossless measurement.
Programmable DAC reference	Four factory-trimmed reference voltages (0.6V/0.9V/1.2V/1.5V) selected via REF0/REF1 logic; supports DDR, FPGA, and ASIC core rails.
Differential remote voltage sensing	VSEN/RGND inputs with ±0.8% accuracy over temp (0.6V/0.9V) - maintains regulation at load despite PCB trace resistance up to ~50 mΩ.
Multi-tier overvoltage protection	OVP pin asserts high to trigger external SCR/MOSFET crowbar; internal clamp turns on lower MOSFETs to limit overshoot during transients.

Applications

High-Current DDR Memory Regulators	Server CPU Core Voltage Supplies
Use Scenario: Regulating 1.2 V/30 A+ DDR4/DDR5 memory VDDQ rails in enterprise servers with strict transient response requirements. IC Role / Device Role / Timing Role: Three-phase PWM controller managing parallel buck stages; provides synchronized phase interleaving and per-phase current balancing. Use Value: Reduces output capacitor count by 3× vs. single-phase design and lowers RMS input ripple current from 13.3 A to 6.1 A at 36 A load.	Use Scenario: Delivering tightly regulated 0.8–1.5 V core voltage to multi-core Xeon or EPYC processors under dynamic load steps up to 100 A/µs. IC Role / Device Role / Timing Role: Primary voltage regulation IC implementing load-line droop (via DROOP pin), remote sensing (VSEN/RGND), and digital soft-start. Use Value: Achieves ±0.5% system accuracy over –40°C to +85°C and supports pre-biased start-up without output voltage reversal.
FPGA/ASIC Point-of-Load Converters	Industrial High-Density DC/DC Modules
Use Scenario: Powering 0.6–1.5 V I/O or core rails in large-scale FPGAs (e.g., Xilinx Versal, Intel Stratix) where thermal distribution and board space are constrained. IC Role / Device Role / Timing Role: Integrated controller + driver solution enabling compact 3-phase layout with minimal external components (no driver ICs, no external current-sense amplifiers). Use Value: Enables <10 mm² per-phase footprint and eliminates discrete driver propagation delays that degrade current balance.	Use Scenario: Embedded power module design for industrial PLCs or medical imaging systems requiring long-term supply continuity and extended temperature operation. IC Role / Device Role / Timing Role: Industrial-grade PWM controller supporting –40°C to +85°C ambient and featuring open-sense-line protection (VDIFF + 1 V threshold) and thermal shutdown at 160°C. Use Value: Provides fail-safe operation under sensor fault conditions and ensures reliability in unventilated enclosures with limited airflow.

High-Current DDR Memory Regulators

Server CPU Core Voltage Supplies

Use Scenario: Regulating 1.2 V/30 A+ DDR4/DDR5 memory VDDQ rails in enterprise servers with strict transient response requirements.

IC Role / Device Role / Timing Role: Three-phase PWM controller managing parallel buck stages; provides synchronized phase interleaving and per-phase current balancing.

Use Value: Reduces output capacitor count by 3× vs. single-phase design and lowers RMS input ripple current from 13.3 A to 6.1 A at 36 A load.

Use Scenario: Delivering tightly regulated 0.8–1.5 V core voltage to multi-core Xeon or EPYC processors under dynamic load steps up to 100 A/µs.

IC Role / Device Role / Timing Role: Primary voltage regulation IC implementing load-line droop (via DROOP pin), remote sensing (VSEN/RGND), and digital soft-start.

Use Value: Achieves ±0.5% system accuracy over –40°C to +85°C and supports pre-biased start-up without output voltage reversal.

FPGA/ASIC Point-of-Load Converters

Industrial High-Density DC/DC Modules

Use Scenario: Powering 0.6–1.5 V I/O or core rails in large-scale FPGAs (e.g., Xilinx Versal, Intel Stratix) where thermal distribution and board space are constrained.

IC Role / Device Role / Timing Role: Integrated controller + driver solution enabling compact 3-phase layout with minimal external components (no driver ICs, no external current-sense amplifiers).

Use Value: Enables <10 mm² per-phase footprint and eliminates discrete driver propagation delays that degrade current balance.

Use Scenario: Embedded power module design for industrial PLCs or medical imaging systems requiring long-term supply continuity and extended temperature operation.

IC Role / Device Role / Timing Role: Industrial-grade PWM controller supporting –40°C to +85°C ambient and featuring open-sense-line protection (VDIFF + 1 V threshold) and thermal shutdown at 160°C.

Use Value: Provides fail-safe operation under sensor fault conditions and ensures reliability in unventilated enclosures with limited airflow.

Equivalent & Alternatives

The following parts are listed as comparable options for similar three-phase buck controller applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
IR35201MTRPBF	Supports up to 6 phases; includes PMBus interface and digital telemetry; requires external gate drivers.	Used in digitally managed server VRMs with telemetry and dynamic VID updates; lacks integrated drivers.	Select when digital control, phase extension beyond 3, or telemetry logging are required - not a pin-compatible replacement.
TPS53679RSAT	Integrated drivers; supports 3/4/5/6-phase operation; uses analog current sensing only (no r_DS(ON) mode); 40-pin QFN same footprint.	Targeted at high-end client/server VRMs with tighter transient specs; lacks DCR+r_DS(ON) dual sensing.	Consider for new designs needing higher phase count scalability and TI's Fusion Digital Power ecosystem - not drop-in compatible due to different pin mapping and control logic.

Compared with IR35201MTRPBF and TPS53679RSAT, the ISL6308AIRZ-T uniquely combines integrated gate drivers, dual DCR/r_DS(ON) current sensing, and simple 2-bit DAC reference selection in a cost-optimized analog architecture - making it ideal for fixed-function, high-reliability industrial and embedded power delivery where digital overhead is unnecessary.

Availability

ISL6308AIRZ-T is available at Aetrix Electronics and suitable for high-current DDR memory regulators, server CPU core supplies, and FPGA/ASIC point-of-load converters requiring stable component supply across industrial temperature ranges and long production lifecycles.

Supply support for ISL6308AIRZ-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader formed through the merger of Renesas Technology and NEC Electronics, specializing in microcontrollers, analog, power management, and timing solutions.

The ISL6308AIRZ-T belongs to Renesas' legacy Intersil power management portfolio, engineered specifically for high-efficiency, multi-phase DC/DC conversion in computing and communications infrastructure where integration, thermal performance, and analog precision are critical.

FAQ

What is the maximum operating junction temperature for the ISL6308AIRZ-T?

The ISL6308AIRZ-T has a maximum junction temperature of +150°C, with thermal shutdown activated at 160°C (setpoint) and recovery at 135°C. Its QFN package delivers θ_JA = 32°C/W and θ_JC = 3.5°C/W, enabling reliable operation in thermally constrained industrial environments when mounted on 2 oz copper with thermal vias to inner ground planes.

Does the ISL6308AIRZ-T support pre-biased start-up?

Yes, the ISL6308AIRZ-T supports start-up into a pre-biased output. This capability prevents reverse current flow during power sequencing in systems where downstream rails may be powered before the ISL6308AIRZ-T initiates regulation. The internal soft-start circuitry ramps the reference voltage gradually, ensuring controlled turn-on even when VOUT is initially non-zero.

How is the switching frequency set on the ISL6308AIRZ-T?

The switching frequency of the ISL6308AIRZ-T is set by an external resistor connected from the FS pin (36) to GND. Per Equation 43 in the datasheet, a typical 250 kHz frequency requires a 49.9 kΩ resistor. Frequency range is 225–275 kHz (typical), and the oscillator ramp amplitude is 1.5 V peak-to-peak with 66.6% max duty cycle per phase.

Can the ISL6308AIRZ-T operate in single-phase mode?

Yes, the ISL6308AIRZ-T supports 1-, 2-, or 3-phase operation. To configure single-phase mode, tie both 3PH (1) and 2PH (2) pins to GND, or alternatively ground PVCC2 and PVCC3. In this configuration, only PHASE1, UGATE1, LGATE1, BOOT1, and ISEN1 are active; remaining channels are disabled automatically by internal logic.

What is the purpose of the OFST pin on the ISL6308AIRZ-T?

The OFST pin (5) on the ISL6308AIRZ-T generates a precision DC offset current (±50 µA typical) to introduce a programmable voltage offset between FB and VDIFF. Connecting an external resistor from OFST to GND yields negative offset; connecting to VCC yields positive offset. This allows fine-tuning of output voltage without modifying the DAC reference or feedback divider, useful for margining or calibration.

ISL6308AIRZ-T Specifications

Product attributes: Attribute value

Manufacturer:: Renesas

Series:: -

Package/Case:: 40-VFQFN Exposed Pad

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

Applications:: Controller, DDR

Voltage - Input:: 5V ~ 12V

Number of Outputs:: 1

Voltage - Output:: 0.6V ~ 2.3V

Operating Temperature:: -40°C ~ 85°C

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 40-QFN (6x6)

ISL6308AIRZ-T FAQ

1.How can I place an order for ISL6308AIRZ-T through Aetrix?

Please submit a Request for Quotation (RFQ) for ISL6308AIRZ-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for ISL6308AIRZ-T reliable?

The price and inventory of ISL6308AIRZ-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ISL6308AIRZ-T is usually 5 days.

3.What payment methods are accepted for ISL6308AIRZ-T?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ISL6308AIRZ-T transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for ISL6308AIRZ-T?

ISL6308AIRZ-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your ISL6308AIRZ-T order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for ISL6308AIRZ-T?

For technical support, including ISL6308AIRZ-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ISL6308AIRZ-T requirements.

6.How does Aetrix verify that ISL6308AIRZ-T is sourced from the original manufacturer or authorized distributors?

All ISL6308AIRZ-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ISL6308AIRZ-T meets industry standards.

7.What is the process for return or replacement of ISL6308AIRZ-T?

All ISL6308AIRZ-T units undergo pre-shipment inspection (PSI). If there is an issue with ISL6308AIRZ-T, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The ISL6308AIRZ-T part is unused and in its original packaging.

Return procedure for ISL6308AIRZ-T:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-07 TTL vs CMOS Logic Levels: 74HC and 74HCT Compatibility Explained

TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.

2026-09-04 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-02 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…