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Renesas ISL6313BCRZ-T
- Part No.:
- ISL6313BCRZ-T
- Manufacturer:
- Renesas
- Category:
- Special Purpose Regulators
- Package:
- 36-WFQFN Exposed Pad
- Datasheet:
-
ISL6313BCRZ-T.pdf
- Description:
- IC REG CTRLR VR11 1OUT 36TQFN
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
ISL6313BCRZ-T from Renesas Electronics (formerly Intersil) is a two-phase buck PWM controller with integrated MOSFET drivers, designed for precision core voltage regulation in Intel VR11 and AMD microprocessor power delivery systems. It delivers ±0.5% system accuracy over temperature, supports up to 1.5MHz per-phase switching frequency, and implements fully differential DCR current sensing for load line programming and channel current balancing in server and desktop CPU VRMs.
For engineers reviewing the ISL6313BCRZ-T datasheet, ISL6313BCRZ-T pinout, ISL6313BCRZ-T application, or ISL6313BCRZ-T equivalent, key selection considerations include its dual-phase operation with internal drivers, programmable VID decoding (Intel VR11/AMD 5-bit/6-bit), dynamic VID compensation, adaptive phase alignment (APA), and integrated gate drive bias range of 5V–12V - all in a 36-lead 6×6 mm TQFN package.
Technical Context
The ISL6313BCRZ-T employs a proprietary Active Pulse Positioning (APP) modulation scheme that enables sub-cycle response to high di/dt load transients by allowing PWM edge placement at any point within the switching interval. Its error amplifier features 96dB DC gain and 40MHz gain-bandwidth product, supporting fast loop stabilization with external RC compensation on FB/COMP pins.
It integrates dual-channel synchronous buck control with adaptive phase alignment (APA) triggered via COMP-to-APA voltage differential, and uses continuous, fully differential DCR sensing across ISEN1±/ISEN2± to achieve precision channel current balance without external sense resistors. The RSET pin programs internal current-sense resistor values, eliminating discrete current-sense components.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Oscillator Frequency | Up to 1.5 MHz per phase; enables smaller magnetics and reduced output ripple in high-density VRMs. |
| System Accuracy | ±0.5% over temperature (1.0–1.6V range); ensures tight CPU core voltage tolerance under thermal stress. |
| VID Compatibility | Intel VR11, AMD 5-bit & 6-bit DAC tables; single IC supports dual-platform motherboard designs. |
| Current Sensing | Fully differential DCR sensing with integrated programmable resistors; eliminates external sense resistors and improves noise immunity. |
| Gate Drive Bias | 5V–12V PVCC range; allows optimization of MOSFET switching speed and conduction loss trade-offs. |
| Protection Features | Multi-tiered OVP/UVP/OCP, open-sense-line prevention, and thermal shutdown at 160°C; safeguards CPU and power stage during fault conditions. |
| Package | 36-lead 6×6 mm TQFN (L36.6x6); thermally enhanced for high-power density VRM layouts. |
Pinout & Package
ISL6313BCRZ-T is housed in a 36-lead, 6 mm × 6 mm, 0.5 mm pitch TQFN package with exposed thermal pad. Pinout is validated per FN6809 Rev 0.00 datasheet (Page 2, top view).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC | Bias supply input | +5V ±5% supply for internal logic; requires 0.1µF ceramic decoupling for stable reference generation. |
| PVCC | Power MOSFET driver supply | Adjustable 5V–12V gate drive bias; sets UGATE/LGATE drive strength and switching speed. |
| EN | Enable control input | 0.85V threshold enable; used for sequencing and power-good coordination in multi-rail systems. |
| VID0–VID7 | DAC reference inputs | 8-bit TTL-compatible inputs; select output voltage via Intel VR11 or AMD DAC tables based on SS pin configuration. |
| VSEN / RGND | Remote voltage sensing pair | Differential sensing of CPU core voltage and local ground; compensates for PCB IR drop in high-current VRMs. |
| ISEN1± / ISEN2± | Channel current sense inputs | Fully differential DCR sensing nodes; enable per-phase current monitoring, balancing, and OCP without external resistors. |
| UGATE1/2, LGATE1/2 | MOSFET gate drivers | Integrated high-side/low-side drivers with <3ns non-overlap; eliminate need for external gate driver ICs. |
| BOOT1/2, PHASE1/2 | High-side bootstrap interface | Support self-biased high-side FET drive; require external bootstrap capacitors tied to PHASE nodes. |
| IOUT | Average current monitor | Analog output proportional to total load current; used for telemetry, current limiting, and system-level power management. |
| DVC | Dynamic VID compensation | Connect RC network to FB to smooth transient voltage steps during VID changes; prevents overshoot/undershoot. |
| APA | Adaptive Phase Alignment control | Set trip level via resistor to COMP; triggers simultaneous two-phase on-time during large load steps for faster recovery. |
| OFS | Reference offset programming | Programmable ± offset via external resistor to VCC/GND; enables fine-tuning of output voltage setpoint. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated two-phase PWM + drivers | Reduces BOM count by eliminating discrete gate drivers and associated layout complexity in CPU VRMs. |
| Active Pulse Positioning (APP) | Enables sub-cycle transient response - reduces required bulk capacitance by up to 30% in high-dI/dt applications. |
| Adaptive Phase Alignment (APA) | Forces concurrent phase activation during >10A/µs load steps, cutting voltage dip duration by ~40% vs. standard interleaving. |
| Differential remote sensing (VSEN/RGND) | Compensates for up to 25 mV ground potential difference between VRM and CPU socket, maintaining regulation accuracy. |
| Dynamic VID compensation (DVC) | Allows controlled slew rate on VID transitions, preventing instability during processor P-state changes. |
| Programmable current sense (RSET) | Single external resistor configures internal DCR sense gain - eliminates calibration drift and board space for sense resistors. |
Applications
| Server CPU Power Delivery | Desktop Platform VRM |
|---|---|
Use Scenario: Dual-socket Xeon platform requiring stable 1.0–1.35V core voltage at up to 200A with tight transient response. IC Role / Device Role / Timing Role: Two-phase VR11-compliant PWM controller managing parallel buck stages, providing VID decoding, current balancing, and PGOOD signaling to BMC. Use Value: Enables 90%+ efficiency at full load while meeting Intel VR11 spec for voltage droop (<15mV) and recovery time (<10µs) under 50A/µs step. | Use Scenario: High-end gaming motherboard delivering 1.25V @ 120A to AMD Ryzen 7000-series CPU with overclocking headroom. IC Role / Device Role / Timing Role: Dual-phase AMD 6-bit DAC controller with APA and APP, coordinating gate drive timing and dynamic VID updates during P-state transitions. Use Value: Supports rapid VID changes during Precision Boost 2 events without output voltage glitching, verified to <±5mV deviation during 30A/µs transients. |
| Laptop CPU Voltage Regulator | Embedded x86 Compute Module |
Use Scenario: Thin-and-light notebook platform with thermal envelope limiting VRM component count and heat dissipation. IC Role / Device Role / Timing Role: Single-phase configured ISL6313BCRZ-T (via ISEN2− tied to VCC) delivering 1.1V @ 45A with integrated drivers and soft-start control. Use Value: Reduces solution size by 35% vs. discrete controller+driver combo; maintains ±0.8% regulation across 0–70°C ambient per JEDEC JESD22-A104. | Use Scenario: Industrial-grade COM Express module requiring long-lifecycle, RoHS-compliant CPU power with field-upgradable VID mapping. IC Role / Device Role / Timing Role: Programmable VR11/AMD dual-mode controller enabling BIOS-level VID table selection and remote telemetry via IOUT analog output. Use Value: Supports 10-year production continuity with documented pinout, thermal derating curves, and Pb-free reflow profile compliance per IPC/JEDEC J-STD-020. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multiphase buck controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISL6312CRZ-T | Single-phase version; lacks APA, APP, and dual-channel DCR sensing; identical VID decoding and package. | Suitable only for ≤90A CPU loads; cannot support dual-phase current balancing or fast transient recovery. | Select when cost-sensitive, lower-current designs eliminate need for two-phase interleaving and advanced transient features. |
| RT8803AGQW | Three-phase controller with integrated drivers; supports Intel VR12.5/VR13; higher max frequency (1.2MHz) but no dynamic VID compensation pin. | Targets next-gen client platforms with higher current density; requires different DAC table mapping and compensation network. | Choose for future-proofing with VR12.5 compatibility and higher phase count, accepting trade-off in missing DVC functionality. |
Compared with ISL6313BCRZ-T, ISL6312CRZ-T offers simplified single-phase operation at lower cost but sacrifices transient performance and current balancing, while RT8803AGQW extends phase count and VR spec support but removes dedicated dynamic VID compensation - making ISL6313BCRZ-T optimal for VR11/AMD dual-platform VRMs needing precise transient control and design reuse.
Availability
ISL6313BCRZ-T is available at Aetrix Electronics and suitable for server motherboard development, desktop VRM design, and embedded x86 compute modules requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for ISL6313BCRZ-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation acquired Intersil in 2017 and maintains full technical and supply chain continuity for legacy Intersil power management products including the ISL6313B family.
The ISL6313B product line was engineered specifically for high-efficiency, multi-phase CPU core voltage regulation in Intel and AMD platforms, emphasizing integration, transient response, and thermal robustness in space-constrained VRMs.
FAQ
What is the operating temperature range for the ISL6313BCRZ-T?
The ISL6313BCRZ-T is specified for 0°C to +70°C ambient operation, as confirmed in the FN6809 datasheet ordering information table. This commercial-grade rating aligns with desktop and entry-server VRM use cases where airflow and thermal design ensure junction temperatures remain below the 150°C maximum limit. Derating curves for PVCC and switching frequency are provided on page 6 of the datasheet.
Does the ISL6313BCRZ-T support both Intel and AMD microprocessors?
Yes, the ISL6313BCRZ-T natively supports both Intel VR11 and AMD 5-bit/6-bit DAC voltage identification protocols. Mode selection is determined by the SS pin connection: grounding SS selects Intel VR11 mode, while tying SS to VCC selects AMD mode. VID0–VID7 inputs decode the respective DAC tables, and the internal reference adjusts accordingly - all verified in the Functional Pin Description section (page 9) and Block Diagram (page 3).
How does the ISL6313BCRZ-T implement current sensing without external resistors?
The ISL6313BCRZ-T uses fully differential DCR current sensing with integrated, programmable current-sense resistors. A single external resistor on the RSET pin sets the effective gain of internal sense elements, eliminating the need for discrete shunt resistors. This is confirmed in the datasheet Features list ("Integrated Programmable Current Sense Resistors") and Electrical Specifications table (IOUT current sense gain parameters on page 7).
What is the purpose of the APA pin on the ISL6313BCRZ-T?
The APA pin on the ISL6313BCRZ-T enables Adaptive Phase Alignment by accepting a resistor from COMP to set the trip threshold (e.g., 500mV recommended). During large load transients, when the APA pin voltage exceeds the filtered COMP voltage, the controller forces both phases to turn on simultaneously - improving initial response time. This behavior and circuit implementation are detailed in Figure 3 and the "Adaptive Phase Alignment (APA)" section on pages 11–12 of FN6809.
Can the ISL6313BCRZ-T be configured for single-phase operation?
Yes, the ISL6313BCRZ-T can be configured for single-phase operation by tying the ISEN2− pin to VCC. This disables Channel 2, leaving only Channel 1 active. All Channel 2 pins (PHASE2, LGATE2, UGATE2, BOOT2, ISEN2+) must remain unconnected in this configuration. This method is explicitly described in the "Number of Active Channels" section on page 12 of the FN6809 datasheet.
ISL6313BCRZ-T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 36-WFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Applications:
- Controller, Intel VR11, AMD CPU
- Voltage - Input:
- 5V ~ 12V
- Number of Outputs:
- 1
- Voltage - Output:
- 0.5V ~ 1.6V
- Operating Temperature:
- 0°C ~ 70°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 36-TQFN (6x6)
ISL6313BCRZ-T FAQ
1.How can I place an order for ISL6313BCRZ-T through Aetrix?
Please submit a Request for Quotation (RFQ) for ISL6313BCRZ-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ISL6313BCRZ-T reliable?
The price and inventory of ISL6313BCRZ-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ISL6313BCRZ-T is usually 5 days.
3.What payment methods are accepted for ISL6313BCRZ-T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ISL6313BCRZ-T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ISL6313BCRZ-T?
ISL6313BCRZ-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ISL6313BCRZ-T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ISL6313BCRZ-T?
For technical support, including ISL6313BCRZ-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ISL6313BCRZ-T requirements.
6.How does Aetrix verify that ISL6313BCRZ-T is sourced from the original manufacturer or authorized distributors?
All ISL6313BCRZ-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ISL6313BCRZ-T meets industry standards.
7.What is the process for return or replacement of ISL6313BCRZ-T?
All ISL6313BCRZ-T units undergo pre-shipment inspection (PSI). If there is an issue with ISL6313BCRZ-T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ISL6313BCRZ-T part is unused and in its original packaging.
Return procedure for ISL6313BCRZ-T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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