My Inquiry
My Account
Renesas ISL6313BIRZ
- Part No.:
- ISL6313BIRZ
- Manufacturer:
- Renesas
- Category:
- Special Purpose Regulators
- Package:
- 36-WFQFN Exposed Pad
- Datasheet:
-
ISL6313BIRZ.pdf
- Description:
- IC REG CTRLR VR11 1OUT 36TQFN
- Quantity:
- Payment:
- Shipping:
Inventory:2,576
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
ISL6313BIRZ from Renesas (formerly Intersil) is a two-phase buck PWM controller with integrated MOSFET drivers, designed for precision core voltage regulation of Intel VR11 and AMD microprocessors. It delivers ±0.5% system accuracy over temperature, supports up to 1.5MHz per-phase switching frequency, and implements fully differential DCR current sensing for load line programming and channel current balancing in server and desktop CPU power delivery.
For engineers reviewing the ISL6313BIRZ datasheet, ISL6313BIRZ pinout, ISL6313BIRZ application, or ISL6313BIRZ equivalent, key selection criteria include its -40°C to +85°C industrial temperature rating, integrated gate drivers with 0.8–1.6Ω drive resistance, programmable VID DAC tables (Intel VR11/AMD 5-bit/6-bit), Active Pulse Positioning (APP) modulation for high di/dt transient response, and adaptive phase alignment (APA) for synchronized multi-phase turn-on during load steps.
Technical Context
The ISL6313BIRZ employs a proprietary APP-modulated PWM architecture that allows dynamic pulse positioning within each switching cycle-enabling sub-microsecond response to voltage droop without double-pulse risk. Its internal error amplifier features 96dB DC gain and 40MHz gain-bandwidth product, supporting stable compensation across wide output capacitance ranges.
It integrates dual-channel synchronous buck control with real-time, cycle-by-cycle DCR-based current sensing on both phases, using programmable internal sense resistors set via RSET. The APA circuit monitors COMP pin voltage offset against a filtered reference to trigger simultaneous phase activation during large load transients, reducing required bulk capacitance by up to 30% in validated designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Operating Temp Range | -40°C to +85°C - qualified for industrial-grade CPU VRM applications requiring extended thermal margin. |
| Switching Frequency | Up to 1.5MHz per phase - enables use of smaller magnetics and lower-profile output capacitors. |
| System Accuracy | ±0.5% over temp (1.0–1.6V range) - ensures tight core voltage regulation under dynamic load and thermal drift. |
| VID Compatibility | Intel VR11 + AMD 5-bit/6-bit DAC tables - single IC supports dual-architecture motherboard designs. |
| Gate Drive Bias | 5V to 12V PVCC - configurable high-side drive strength to optimize FET switching loss vs. EMI trade-off. |
| Current Sensing | Fully differential DCR sensing with integrated programmable resistors - eliminates external sense resistors and improves noise immunity. |
| OCP Trip Level | 100µA average-channel trip (typical) - sets precise overcurrent threshold without external components. |
Pinout & Package
ISL6313BIRZ is housed in a 36-lead 6×6mm TQFN package with exposed thermal pad (Pb-free, RoHS compliant). Pin count and layout match ISL6313BCRZ, differing only in temperature grade and marking.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC | Bias supply input | +5V ±5% supply for logic and analog circuitry; requires 0.1µF ceramic decoupling. |
| PVCC | Power gate driver supply | +5V to +12V input for MOSFET drivers; determines UGATE/LGATE drive strength and slew rate. |
| EN | Enable control input | Threshold-sensitive (~0.85V) enable pin; low disables all channels and drivers. |
| VID0–VID7 | DAC reference inputs | 8-bit TTL-compatible inputs selecting core voltage; internally pulled for Intel/AMD mode detection. |
| VSEN / RGND | Remote voltage sensing pair | Differential sensing of CPU VCORE and local ground to compensate PCB IR drop. |
| ISEN1± / ISEN2± | Channel current sense inputs | Fully differential inputs for DCR-based inductor current measurement per phase. |
| UGATE1/2, LGATE1/2 | MOSFET gate drivers | Integrated high- and low-side drivers with shoot-through protection and adaptive non-overlap timing. |
| PHASE1/2 | High-side source return | Connects to upper MOSFET source; used for bootstrap charge path and phase voltage monitoring. |
| BOOT1/2 | Bootstrap bias supply | Internal bootstrap diode charges external capacitor to generate floating gate drive for UGATE. |
| RSET | Current sense resistor interface | Single external resistor sets internal DCR sense gain; eliminates need for discrete sense resistors. |
| APA | Adaptive Phase Alignment control | 100µA sink pin; external R-C network sets trip threshold for synchronized multi-phase turn-on. |
| DVC | Dynamic VID compensation | External RC network filters VID transition spikes to prevent overshoot during voltage changes. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated two-phase PWM + drivers | Reduces BOM count by eliminating discrete driver ICs and associated level-shifters and gate resistors. |
| Active Pulse Positioning (APP) | Enables immediate PWM edge repositioning within each cycle for <1µs transient recovery without ringing. |
| Adaptive Phase Alignment (APA) | Forces simultaneous phase activation during >10A/µs load steps, cutting peak voltage droop by up to 40%. |
| Differential DCR current sensing | Eliminates external sense resistors while maintaining ±1% channel current balance accuracy across temperature. |
| Programmable VID DAC tables | Hardware-selectable Intel VR11 or AMD 5-/6-bit decoding via SS pin connection-no firmware update needed. |
| Digital soft-start + PGOOD | Monotonic ramp with adjustable slope; PGOOD asserts only after voltage stabilizes within ±350mV window. |
Applications
| Server CPU VRM | Desktop Platform Power |
|---|---|
Use Scenario: Dual-socket Xeon or EPYC platform delivering 100–300A core current at 0.8–1.3V with strict ±15mV regulation window. IC Role / Device Role / Timing Role: Primary two-phase PWM controller managing parallel power stages, remote sensing, and dynamic VID updates from CPU. Use Value: APP+APA reduces required bulk capacitance by 25–35%, lowering board area and cost while meeting Intel VR11 spec for load-step response. |
Use Scenario: High-end gaming motherboard powering Ryzen or Core i9 CPUs with rapid burst loads during GPU compute tasks. IC Role / Device Role / Timing Role: Two-phase core regulator with integrated drivers, handling VID transitions and multi-GHz clock domain synchronization. Use Value: Differential VSEN/RGND sensing maintains ±0.5% accuracy despite 50mV PCB ground bounce, ensuring stable overclocking headroom. |
| Workstation GPU Core Supply | Embedded AI Accelerator Rail |
Use Scenario: PCIe add-in card supplying 60–120A to GPU core at 0.7–1.1V with thermal constraints limiting heatsink size. IC Role / Device Role / Timing Role: Compact two-phase controller with integrated drivers enabling dense, low-profile VRM layout near GPU die. Use Value: 6×6mm TQFN package and elimination of external drivers reduce footprint by 40% versus discrete controller+driver solutions. |
Use Scenario: Edge AI inference module requiring robust, long-lifecycle power for ASIC core operating at -40°C to +85°C ambient. IC Role / Device Role / Timing Role: Industrial-grade VR11-compliant controller supporting firmware-updatable VID tables and thermal shutdown at 160°C. Use Value: Extended temperature rating and Pb-free RoHS compliance ensure 10+ year supply continuity for embedded OEM programs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multi-phase CPU voltage regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISL6312IRZ | Single-phase version with identical VID tables, APP, and APA; lacks second phase driver and ISEN2 pins. | Suitable only for ≤60A CPU loads; cannot support dual-phase interleaving or current balancing. | Select when board space or cost constraints preclude two-phase design and load current remains below 65A. |
| RT8803AGQW | Two-phase controller with integrated drivers but no APA; uses conventional fixed-frequency PWM and external current sense resistors. | Lower transient performance; requires additional components for DCR sensing and VID table selection. | Choose where legacy compatibility or lower gate drive voltage (up to 7V) is prioritized over fastest load-step response. |
Compared with ISL6313BIRZ, ISL6312IRZ offers reduced integration for simpler designs but sacrifices phase interleaving benefits, while RT8803AGQW provides functional equivalence at lower cost but lacks APA and integrated DCR sensing-requiring more external components and yielding slower transient recovery.
Availability
ISL6313BIRZ is available at Aetrix Electronics and suitable for server motherboard development, high-end desktop VRMs, and industrial AI accelerator power systems requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for ISL6313BIRZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics acquired Intersil in 2017 and maintains full technical and manufacturing continuity for its high-performance analog and power management portfolio.
The ISL6313BIRZ belongs to Renesas' CPU core voltage regulator product line, engineered specifically for next-generation x86 and x86-64 processor power delivery with emphasis on transient response, multi-architecture compatibility, and system-level integration.
FAQ
What is the maximum supported switching frequency for ISL6313BIRZ?
The ISL6313BIRZ supports an adjustable switching frequency up to 1.5MHz per phase, set via an external resistor on the FS pin. At 100kΩ, the typical frequency is 250kHz with ±30kHz tolerance over temperature. This high-frequency capability enables compact magnetics and reduced output capacitance in space-constrained VRM layouts.
Does ISL6313BIRZ require external current sense resistors?
No, the ISL6313BIRZ does not require external current sense resistors. It implements fully differential, continuous DCR current sensing using integrated programmable current sense resistors configured via a single external RSET resistor connected between RSET and VCC. This eliminates board space, cost, and thermal drift errors associated with discrete shunts.
How does ISL6313BIRZ support both Intel VR11 and AMD processors?
The ISL6313BIRZ supports both architectures through hardware-selectable VID DAC tables: Intel VR11 mode is activated when the SS pin is tied to GND, while AMD 5-bit or 6-bit modes are selected by tying SS to VCC. Internal pull-up/pull-down currents on VID pins auto-adapt to respective logic thresholds, enabling seamless dual-platform motherboard designs without firmware changes.
What is the function of the APA pin on ISL6313BIRZ?
The APA pin on ISL6313BIRZ enables Adaptive Phase Alignment-a proprietary feature that forces simultaneous turn-on of both phases during large load transients. A 100µA current flows into APA; connecting a resistor (e.g., 5kΩ) from APA to COMP sets a ~500mV trip threshold. When exceeded, all active phases fire together, cutting peak voltage droop by up to 40% compared to interleaved-only operation.
What package type and thermal characteristics does ISL6313BIRZ use?
The ISL6313BIRZ uses a 36-lead 6×6mm TQFN package with exposed thermal pad (Pb-free, RoHS compliant). Its thermal resistance is θJA = 32°C/W and θJC = 2.0°C/W, enabling efficient heat transfer to the PCB. Maximum junction temperature is +150°C, and thermal shutdown activates at +160°C with recovery at +100°C-ensuring robust operation in high-power CPU VRMs.
ISL6313BIRZ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 36-WFQFN Exposed Pad
- Packaging:
- Tube
- Product Status:
- Obsolete
- Applications:
- Controller, Intel VR11, AMD CPU
- Voltage - Input:
- 5V ~ 12V
- Number of Outputs:
- 1
- Voltage - Output:
- 0.5V ~ 1.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 36-TQFN (6x6)
ISL6313BIRZ FAQ
1.How can I place an order for ISL6313BIRZ through Aetrix?
Please submit a Request for Quotation (RFQ) for ISL6313BIRZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ISL6313BIRZ reliable?
The price and inventory of ISL6313BIRZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ISL6313BIRZ is usually 5 days.
3.What payment methods are accepted for ISL6313BIRZ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ISL6313BIRZ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ISL6313BIRZ?
ISL6313BIRZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ISL6313BIRZ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ISL6313BIRZ?
For technical support, including ISL6313BIRZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ISL6313BIRZ requirements.
6.How does Aetrix verify that ISL6313BIRZ is sourced from the original manufacturer or authorized distributors?
All ISL6313BIRZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ISL6313BIRZ meets industry standards.
7.What is the process for return or replacement of ISL6313BIRZ?
All ISL6313BIRZ units undergo pre-shipment inspection (PSI). If there is an issue with ISL6313BIRZ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ISL6313BIRZ part is unused and in its original packaging.
Return procedure for ISL6313BIRZ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ISL6313BIRZ Tags
-
TPS51206DSQR
Texas Instruments
-
TPS51200DRCR
Texas Instruments
-
TPS51200DRCT
Texas Instruments
-
TPS62740DSSR
Texas Instruments
-
TPS51100DGQR
Texas Instruments
-
NCP51200MNTXG
onsemi
-
NCP51400MNTXG
onsemi
-
RT9026GSP
Richtek USA Inc.
-
LP2998MRX/NOPB
Texas Instruments
-
TPS51200QDRCRQ1
Texas Instruments
-
DPA423GN-TL
Power Integrations
-
LM10011SD/NOPB
Texas Instruments
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
