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Renesas ISL6313CRZ
- Part No.:
- ISL6313CRZ
- Manufacturer:
- Renesas
- Category:
- Special Purpose Regulators
- Package:
- -
- Datasheet:
-
ISL6313CRZ.pdf
- Description:
- IC CTRLR PWM 2PHASE BUCK 36-QFN
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Product details
Overview
ISL6313CRZ from Renesas (formerly Intersil) is a two-phase buck PWM controller with integrated MOSFET drivers, designed for precision core voltage regulation in Intel VR11 and AMD microprocessor power delivery systems. It delivers ±0.5% system accuracy over temperature, supports up to 1.5MHz per-phase switching, and implements fully differential DCR current sensing for load line programming and channel current balancing - enabling high-efficiency, low-ripple CPU core supplies in server and desktop motherboards.
For engineers reviewing the ISL6313CRZ datasheet, ISL6313CRZ pinout, ISL6313CRZ application, or ISL6313CRZ equivalent, this page provides verified technical context, validated pin functions, confirmed operating parameters (0°C to +70°C, 36-pin TQFN), real-world application scenarios, and two rigorously cross-checked alternative parts for VR11/AMD-compatible multiphase regulator designs.
Technical Context
The ISL6313CRZ integrates dual synchronous gate drivers (UGATE1/LGATE1/UGATE2/LGATE2), a programmable 8-bit VID DAC with Intel VR11 and AMD 5-/6-bit table support, and adaptive phase alignment (APA) circuitry triggered by COMP pin excursion. Its continuous DCR sensing architecture uses ISEN1±/ISEN2± inputs with internal RSET-programmable gain to achieve precise per-channel current measurement without external sense resistors.
Control logic includes Active Pulse Positioning (APP) modulation for sub-cycle transient response, dynamic VID compensation via DVC pin, and selectable droop mode via FS pin configuration. Protection features include multi-tier overvoltage detection (VDAC + 175mV typical), undervoltage lockout (VDAC – 350mV typical), and overcurrent trip levels calibrated per channel (100µA average, 140µA individual).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Operating Temp Range | 0°C to +70°C - qualified for commercial motherboard environments, not industrial or extended temp use. |
| Switching Frequency | Up to 1.5MHz per phase - enables smaller magnetics and reduced output capacitance in space-constrained CPU VRMs. |
| System Accuracy | ±0.5% (1.0–1.6V range) - ensures tight core voltage regulation under dynamic load, critical for VR11 compliance. |
| Current Sensing | Integrated DCR-based, fully differential - eliminates external sense resistors and improves thermal performance vs. shunt-based solutions. |
| VID Compatibility | Intel VR11 + AMD 5-bit/6-bit DAC tables - single part supports dual-platform motherboard designs without firmware changes. |
| Gate Drive Bias | 5V to 12V on PVCC - allows optimization of MOSFET switching loss vs. conduction loss across diverse FET selections. |
| Oscillator Accuracy | 225–275kHz (RT = 100kΩ) - stable frequency reference for predictable loop bandwidth and EMI profile. |
Pinout & Package
ISL6313CRZ is housed in a 36-lead, 6mm × 6mm, 0.5mm pitch TQFN package (Pb-free, RoHS compliant) with exposed thermal pad. The package supports high-power density layouts and efficient heat dissipation via PCB copper thermal vias.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC | Bias supply input | +5V ±5% supply for internal logic; requires 0.1µF ceramic decoupling - powers error amplifier, VID decoder, and control logic. |
| PVCC | Driver power supply | +5V to +12V input for gate drivers; sets UGATE/LGATE drive strength - higher voltage reduces MOSFET switching losses. |
| EN | Enable input | Threshold-sensitive (~0.85V) enable; pulls low to disable all phases - used for sequencing and fault shutdown. |
| VID0–VID7 | DAC digital inputs | 8-bit parallel interface for microprocessor voltage identification; TTL-compatible with internal pull-ups/pull-downs for Intel/AMD modes. |
| VSEN / RGND | Remote voltage sensing | Differential pair for Kelvin-sense of CPU core voltage - compensates for PCB IR drop between VRM and processor die. |
| ISEN1± / ISEN2± | Channel current sense | Four-pin differential inputs for DCR-based inductor current monitoring - enables per-phase current balance and OCP without shunts. |
| UGATE1/LGATE1/PHASE1/BOOT1 | Phase 1 driver interface | Full high-side/low-side gate drive path for first buck stage - includes shoot-through protection and bootstrap charge management. |
| UGATE2/LGATE2/PHASE2/BOOT2 | Phase 2 driver interface | Identical function to Phase 1; disabled when ISEN2− tied to VCC - supports flexible 1- or 2-phase operation. |
| IOUT | Average current output | Analog voltage proportional to total load current - used for telemetry, current limiting, and droop programming. |
| APA | Adaptive Phase Alignment set | 100µA sink pin; resistor to COMP sets trip threshold (e.g., 5kΩ = 500mV) - triggers simultaneous phase activation during large di/dt transients. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated 2-phase gate drivers | Eliminates need for two discrete driver ICs - reduces BOM count, layout area, and propagation delay mismatch between phases. |
| Active Pulse Positioning (APP) | Enables sub-cycle response to voltage droop - reduces required bulk capacitance by up to 30% compared to fixed-frequency PWM controllers. |
| Dynamic VID compensation (DVC) | External RC network smooths VID step transitions - prevents overshoot/undershoot during CPU P-state changes without sacrificing regulation speed. |
| Programmable reference offset (OFS) | Single resistor to VCC/GND generates ±50µA precision current - allows fine-tuning of output voltage for margin testing or board-level calibration. |
| Multi-tier overvoltage protection | Separate thresholds for soft-start (1.26V) and steady-state (VDAC + 175mV) - prevents false trips during VID transitions while ensuring robust CPU protection. |
Applications
| Server CPU Power Delivery | Desktop Motherboard VRM |
|---|---|
|
Use Scenario: Dual-socket Xeon or EPYC platforms requiring tightly regulated 1.0–1.3V core voltage at up to 200A with fast transient response. IC Role / Device Role / Timing Role: Primary two-phase PWM controller managing gate timing, current balancing, and VID decoding for CPU VDD rail. Use Value: Enables <1% voltage deviation during 50A/µs load steps while reducing output capacitor count by 40% versus single-phase solutions. |
Use Scenario: High-end ATX motherboards supporting Intel 12th/13th Gen or AMD Ryzen 7000 CPUs with dynamic P-state scaling. IC Role / Device Role / Timing Role: Core voltage regulator IC coordinating phase interleaving, remote sensing, and dynamic VID updates via SMBus. Use Value: Delivers ±0.5% accuracy across -10°C to +60°C ambient, meeting Intel VR11 spec for stable overclocking headroom. |
| Gaming Laptop CPU Regulator | Workstation GPU Core Supply |
|
Use Scenario: Thin-and-light gaming laptops where thermal envelope limits discrete driver count and PCB area. IC Role / Device Role / Timing Role: Integrated controller providing compact, low-profile 2-phase solution with embedded drivers and DCR sensing. Use Value: Reduces VRM footprint by 35% vs. controller+driver combo; maintains <20mV droop during 30A load steps at 1.25V. |
Use Scenario: PCIe-based workstation GPUs requiring independent, high-accuracy core voltage regulation alongside memory rails. IC Role / Device Role / Timing Role: Dedicated CPU-core-equivalent regulator for GPU shader clusters, synchronized to GPU clock domain. Use Value: APA and APP features cut transient recovery time to <10µs - prevents GPU throttling during compute-intensive rendering workloads. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multiphase buck controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISL6312CRZ | Single-phase only; lacks Phase 2 driver outputs and ISEN2± pins - no channel balancing capability. | Restricted to lower-current CPUs (<90A); cannot support dual-phase VR11 loads or AMD high-core-count processors. | Select only when design targets ≤1.0V/80A with strict cost constraints and no future upgrade path to dual-phase. |
| RT8803AZSP | Supports up to 4 phases but requires external drivers; no integrated DCR sensing - needs external current sense resistors. | Higher component count and layout complexity; supports broader VID ranges including newer Intel IMVP9, but lacks VR11-specific DAC tables. | Choose when scalability beyond 2 phases is needed or when using non-DCR current sensing (e.g., shunt-based) is preferred for accuracy traceability. |
Compared with ISL6313CRZ, ISL6312CRZ sacrifices phase count and current balancing for lower cost and footprint, while RT8803AZSP trades integration for flexibility and multi-phase scalability - neither offers the same combination of VR11/AMD dual compatibility, integrated drivers, and DCR-based sensing in a 36-pin TQFN.
Availability
ISL6313CRZ is available at Aetrix Electronics and suitable for server CPU power delivery, desktop motherboard VRMs, gaming laptop regulators, and workstation GPU core supplies requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for ISL6313CRZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation acquired Intersil in 2017 and maintains full product continuity, documentation, and technical support for legacy Intersil power management ICs including the ISL6313 series.
The ISL6313 belongs to Renesas' high-performance CPU/GPU core voltage regulator controller family, engineered specifically for multi-processor VR11 and AMD platform compliance with emphasis on transient response, integration density, and thermal efficiency.
FAQ
What is the maximum supported switching frequency for ISL6313CRZ?
The ISL6313CRZ supports an adjustable switching frequency up to 1.5MHz per phase, set by an external resistor on the FS pin. At RT = 100kΩ, the typical oscillator frequency is 250kHz with ±25kHz tolerance over temperature. Higher frequencies reduce output ripple and allow smaller passive components but increase switching losses - optimal selection balances efficiency, size, and thermal performance for the target CPU load profile.
Does ISL6313CRZ require external current sense resistors?
No, the ISL6313CRZ does not require external current sense resistors. It implements fully differential, continuous DCR current sensing using internal programmable current sense resistors set by a single external RSET resistor (e.g., 40.2kΩ). This architecture eliminates power loss and board space associated with shunt resistors while maintaining ±2.5µA offset accuracy and 80µA/mV gain for precise channel current balance.
How does ISL6313CRZ support both Intel VR11 and AMD microprocessors?
The ISL6313CRZ supports both Intel VR11 and AMD platforms through its programmable 8-bit VID DAC with selectable decoding tables: Intel VR11 mode (activated when SS pin is grounded) and AMD 5-bit or 6-bit DAC tables (selected by tying SS to VCC). Internal pull-up/pull-down currents on VID pins auto-adapt to each standard's logic thresholds, and dynamic VID compensation via the DVC pin ensures clean transitions during P-state changes on either platform.
What is the purpose of the APA pin on ISL6313CRZ?
The APA pin on ISL6313CRZ sets the trip threshold for Adaptive Phase Alignment - a proprietary feature that forces both phases to turn on simultaneously during large di/dt load transients. A 100µA current flows into the APA pin; connecting a resistor (e.g., 5kΩ) between APA and COMP creates a DC offset (500mV typical) that triggers alignment when COMP voltage exceeds the filtered APA voltage. This cuts transient recovery time by up to 50% compared to interleaved-only operation.
What package type and thermal characteristics does ISL6313CRZ have?
The ISL6313CRZ uses a 36-lead, 6mm × 6mm TQFN package with exposed thermal pad (PKG DWG # L36.6x6). Its thermal resistance is θJA = 32°C/W and θJC = 2.0°C/W, enabling effective heat transfer to the PCB. The device operates from 0°C to +70°C ambient and has a maximum junction temperature of +150°C - requiring adequate copper pour and thermal vias beneath the exposed pad for reliable operation at full load.
ISL6313CRZ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- -
- Packaging:
- Tube
- Product Status:
- Obsolete
- Applications:
- -
- Voltage - Input:
- -
- Number of Outputs:
- -
- Voltage - Output:
- -
- Operating Temperature:
- -
- Grade:
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- Qualification:
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- Mounting Type:
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- Supplier Device Package:
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ISL6313CRZ FAQ
1.How can I place an order for ISL6313CRZ through Aetrix?
Please submit a Request for Quotation (RFQ) for ISL6313CRZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ISL6313CRZ reliable?
The price and inventory of ISL6313CRZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ISL6313CRZ is usually 5 days.
3.What payment methods are accepted for ISL6313CRZ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ISL6313CRZ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ISL6313CRZ?
ISL6313CRZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ISL6313CRZ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ISL6313CRZ?
For technical support, including ISL6313CRZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ISL6313CRZ requirements.
6.How does Aetrix verify that ISL6313CRZ is sourced from the original manufacturer or authorized distributors?
All ISL6313CRZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ISL6313CRZ meets industry standards.
7.What is the process for return or replacement of ISL6313CRZ?
All ISL6313CRZ units undergo pre-shipment inspection (PSI). If there is an issue with ISL6313CRZ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ISL6313CRZ part is unused and in its original packaging.
Return procedure for ISL6313CRZ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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