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Renesas ISL6353CRTZ-T
- Part No.:
- ISL6353CRTZ-T
- Manufacturer:
- Renesas
- Category:
- Special Purpose Regulators
- Package:
- 40-VFQFN Exposed Pad
- Datasheet:
-
ISL6353CRTZ-T.pdf
- Description:
- IC REG CTRLR DDR 1OUT 40TQFN
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
ISL6353CRTZ-T from Renesas (formerly Intersil) is a three-phase VR12-compliant PWM buck regulator controller designed for DDR memory power delivery. It integrates two MOSFET drivers, supports DCR/resistor current sensing, delivers 5-mV VID voltage steps, and achieves fast transient response via Robust Ripple Regulator™ (R3) technology in applications such as DDR3/DDR4 memory subsystems.
For engineers reviewing the ISL6353CRTZ-T datasheet, ISL6353CRTZ-T pinout, ISL6353CRTZ-T application, or ISL6353CRTZ-T equivalent, this page provides verified technical context, phase-configurable operation modes, SVID bus interface details, thermal monitoring capability, and real-world design meaning of key specifications including R3 modulator behavior, IMON current monitoring, and VR_HOT# alert functionality.
Technical Context
The ISL6353CRTZ-T implements a multiphase R3 modulator architecture with master-slave clock distribution: a master clock generates synchronized, phase-shifted slave clocks (120° in 3-phase, 180° in 2-phase), while each phase uses its own ripple capacitor (Crs) charged/discharged by gm-amplified inductor voltage to determine PWM on/off timing. This eliminates phase jitter seen in conventional hysteretic controllers.
It operates under Intel VR12 specifications with full SVID bus compliance, enabling dynamic output voltage and power state (PS0/PS1/PS2) control from the CPU. The controller supports programmable 1-/2-/3-phase interleaving, adaptive body diode conduction time reduction, and differential remote voltage sensing with FB2-assisted transient enhancement during phase-dropping transitions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Regulator Type | Three-phase VR12 PWM buck controller with integrated high-/low-side gate drivers for DDR memory VDDQ/VDDP rails. |
| Output Voltage Range | 0.25 V to 2.155 V, programmable in 5-mV steps via SVID bus or pin-strapped VSET1/VSET2 logic inputs. |
| Switching Frequency | 200–500 kHz, resistor-programmable via VW-to-COMP network (18 kΩ ≈ 300 kHz); enables optimization of efficiency vs. size trade-offs. |
| Current Sensing | Dual-mode support: lossless DCR sensing with NTC-based temperature compensation or precision resistor sensing with ±0.1 mV input offset. |
| Protection Features | OCP (with way-overcurrent detection), OVP (145–200 mV over setpoint), thermal alert (VR_HOT#), PGOOD, and latchable OVP pin output. |
| Accuracy | ±0.5% system accuracy over 0.75–1.50 V VID range; ±8 mV over 0.5–0.7375 V; supports tight DDR voltage tolerance requirements. |
| Package | 40-lead 5 mm × 5 mm TQFN with exposed thermal pad; θJA = 32°C/W, θJC = 3°C/W for high-power density PCB layouts. |
Pinout & Package
ISL6353CRTZ-T is housed in a 40-lead 5 mm × 5 mm TQFN package with an exposed thermal pad (GND) on the bottom. Pin assignment follows standard top-view numbering (1–40), with dedicated pins for SVID bus (SDA, SCLK, ALERT#), phase control (PWM3, PROG1/2), current sensing (ISEN1–ISEN3), and dual gate drivers (UG1/LG1, UG2/LG2).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1,2,3 | SDA, ALERT#, SCLK | SVID serial bus interface: bidirectional data, open-drain alert, and synchronous clock for CPU-to-VR communication. |
| 4 | VR_ON | Enable input: logic-high (>0.8 V) activates regulation; internal 300 kΩ pull-down ensures safe default-off state. |
| 5 | PGOOD | Open-drain status output indicating regulated output is within ±10% window; requires external pull-up for system power sequencing. |
| 6 | IMON | Analog current monitor output: sourcing current proportional to total output load; sampled internally for digital IMON reporting over SVID. |
| 7 | VR_HOT# | Open-drain thermal overload indicator: asserted low when junction temperature exceeds programmed threshold (910 mV trip). |
| 13–15 | ISEN3, ISEN2, ISEN1 | Individual phase current sense inputs: support DCR or resistor sensing; ISEN2/ISEN3 can disable phases when pulled to VDD. |
| 23–24, 33–34 | BOOT1/UG1/PH1/LG1, BOOT2/UG2/PH2/LG2 | Phase 1 & 2 gate drive circuitry: UG/LG drive MOSFET gates; BOOT supplies high-side driver; PH is switching node return. |
| 28 | PWM3 | Phase 3 PWM output: pulled high to disable Phase 3; used for dynamic phase shedding in PS1/PS2 low-power states. |
| 35 | PROG2 | Multi-function programming pin: sets VBOOT voltage, droop enable/disable, and active phase count in PS1 mode via resistor ladder. |
Key Features
| Feature | Design Value |
|---|---|
| Robust Ripple Regulator™ (R3) Modulation | Variable-frequency PWM during transients + natural PFM at light load - achieves <20 µs 26-A step response and >94% peak efficiency at 1.5 V/60 A. |
| VR12 Serial VID (SVID) Compliance | Full register mapping for voltage, power state, thermal alerts, and IMON reporting - enables seamless integration with Intel CPUs without custom firmware. |
| Differential Remote Voltage Sensing | Separate VSEN/RTN pins with FB2-switched RC network in PS1/PS2 - maintains stability and improves transient recovery when dropping phases. |
| Programmable Multi-Phase Operation | Hardware-selectable 1-/2-/3-phase interleaving via PROG2 and PWM3 pin states - reduces input/output ripple and thermal stress across phases. |
| Adaptive Body Diode Conduction Control | Reduces reverse recovery losses in low-side MOSFETs during discontinuous conduction - improves light-load efficiency and EMI performance. |
Applications
| DDR Memory Power Regulation | Server Memory Subsystem |
|---|---|
Use Scenario: Delivering tightly regulated 1.2–1.5 V VDDQ to DDR4 DIMMs in enterprise servers with dynamic load steps up to 26 A. IC Role / Device Role / Timing Role: Primary VR12-compliant 3-phase controller managing voltage, phase shedding, and thermal alerts per Intel specification. Use Value: Enables compliant DDR4 operation with <20 µs transient response and 94% efficiency at full load - meeting JEDEC timing margin requirements. |
Use Scenario: Powering multi-rank RDIMM modules in dual-socket Xeon platforms where thermal density and phase balancing are critical. IC Role / Device Role / Timing Role: Three-phase buck controller with IMON current monitoring and VR_HOT# thermal alert for predictive thermal management. Use Value: Maintains ±0.5% output accuracy across 0–70°C ambient and supports PS1/PS2 power state transitions without voltage droop. |
| Workstation Graphics Memory | High-Performance Computing Node |
Use Scenario: Supplying stable 1.35 V VDDP to GDDR6 memory stacks in professional GPU workstations under bursty compute loads. IC Role / Device Role / Timing Role: VR12 controller configured in 2-phase mode with DCR current sensing and differential remote sensing. Use Value: Achieves superior noise immunity and <15 mV undershoot on 20-A load steps - preserving signal integrity for high-speed memory interfaces. |
Use Scenario: Regulating DDR5 memory rails in AI accelerator nodes requiring high-current, low-noise, and thermally robust power delivery. IC Role / Device Role / Timing Role: Multiphase controller using R3 modulation and programmable switching frequency (200–500 kHz) for EMI tuning. Use Value: Supports 3-phase operation with excellent dynamic current balance (<20 mV inter-phase imbalance) - minimizing hot-spot formation on PCB. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multiphase VR12 buck controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISL6353IRTZ | Wider operating temperature range (−40°C to +85°C) and higher junction limit (+125°C); identical pinout, electrical specs, and feature set. | Required for industrial or extended-temperature server deployments where ambient exceeds 70°C. | Select ISL6353IRTZ when board-level thermal environment exceeds 70°C ambient or requires automotive-grade reliability screening. |
| IR35201MTRPBF | Single-chip 3-phase VR12 controller with integrated MOSFET drivers; supports same SVID protocol but uses different R3 implementation and lacks FB2 transient enhancement. | Used in cost-sensitive client platforms; lower thermal performance and no differential remote sensing support. | Choose IR35201MTRPBF only if footprint and BOM count are prioritized over DDR4 server-grade transient response and thermal accuracy. |
Compared with ISL6353IRTZ, the ISL6353CRTZ-T offers identical functionality at lower cost for commercial-temperature environments, while IR35201MTRPBF trades off transient performance and sensing flexibility for integration density - making ISL6353CRTZ-T optimal for DDR memory regulators needing verified VR12 compliance and thermal margin.
Availability
ISL6353CRTZ-T is available at Aetrix Electronics and suitable for DDR memory power regulation, server memory subsystems, and high-performance computing nodes requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for ISL6353CRTZ-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics acquired Intersil in 2017 and continues to support its high-performance analog and power management portfolio, including VR12-compliant controllers for memory and CPU power delivery.
The ISL6353CRTZ-T belongs to Renesas' VR12 multiphase controller product line, engineered specifically for DDR3/DDR4 memory subsystems demanding fast transient response, precise voltage accuracy, and seamless SVID bus integration with Intel processors.
FAQ
What is the operating temperature range for the ISL6353CRTZ-T?
The ISL6353CRTZ-T is rated for 0°C to +70°C ambient operation, with a maximum junction temperature of +125°C. Its thermal resistance is θJA = 32°C/W and θJC = 3°C/W, enabling reliable performance in commercial-server memory applications when properly heatsinked via the exposed pad. This range distinguishes it from the ISL6353IRTZ variant, which extends to −40°C.
How does the R3 modulator in the ISL6353CRTZ-T improve transient response compared to fixed-frequency PWM?
The ISL6353CRTZ-T's R3 modulator dynamically increases switching frequency during load transients by shortening the master clock period when COMP voltage rises - achieving sub-20 µs response to 26-A steps. Unlike fixed-frequency PWM, it avoids output voltage deviation through variable on-time control, while maintaining 0.5% DC accuracy via its error amplifier - a hybrid advantage not possible with pure hysteretic or traditional PWM schemes.
Can the ISL6353CRTZ-T operate in single-phase mode, and how is it configured?
Yes, the ISL6353CRTZ-T supports 1-, 2-, or 3-phase operation. To configure single-phase mode, pull ISEN2 to 5 V VDD (disabling Phase 2) and leave ISEN3 open (disabling Phase 3); Phase 1 remains active. Alternatively, tie PWM3 to VDD and set PROG2 to select 1-phase operation in PS1 mode. All configurations retain full SVID communication and protection features.
What current sensing methods does the ISL6353CRTZ-T support, and how do they differ in implementation?
The ISL6353CRTZ-T supports both lossless DCR current sensing (using inductor DCR + NTC for temperature compensation) and precision resistor sensing. DCR mode requires external RC networks on ISEN1–ISEN3 and an NTC on the NTC pin; resistor mode uses low-value sense resistors with <0.1 mV input offset amplification. Both deliver accurate phase current measurement but DCR reduces power loss and BOM cost.
Does the ISL6353CRTZ-T provide remote voltage sensing, and how is it implemented?
Yes, the ISL6353CRTZ-T implements true differential remote voltage sensing via dedicated VSEN and RTN pins, referenced to the memory IC's actual VDDQ pin location. In PS1/PS2 power states, the FB2 pin switches in an RC network between VOUT and FB to enhance phase-margin and transient recovery during phase shedding - a feature absent in basic remote-sense controllers.
ISL6353CRTZ-T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 40-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Controller, DDR, Intel VR12
- Voltage - Input:
- 4.5V ~ 25V
- Number of Outputs:
- 1
- Voltage - Output:
- 0.25V ~ 1.52V
- Operating Temperature:
- 0°C ~ 70°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 40-TQFN (5x5)
ISL6353CRTZ-T FAQ
1.How can I place an order for ISL6353CRTZ-T through Aetrix?
Please submit a Request for Quotation (RFQ) for ISL6353CRTZ-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ISL6353CRTZ-T reliable?
The price and inventory of ISL6353CRTZ-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ISL6353CRTZ-T is usually 5 days.
3.What payment methods are accepted for ISL6353CRTZ-T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ISL6353CRTZ-T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ISL6353CRTZ-T?
ISL6353CRTZ-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ISL6353CRTZ-T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ISL6353CRTZ-T?
For technical support, including ISL6353CRTZ-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ISL6353CRTZ-T requirements.
6.How does Aetrix verify that ISL6353CRTZ-T is sourced from the original manufacturer or authorized distributors?
All ISL6353CRTZ-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ISL6353CRTZ-T meets industry standards.
7.What is the process for return or replacement of ISL6353CRTZ-T?
All ISL6353CRTZ-T units undergo pre-shipment inspection (PSI). If there is an issue with ISL6353CRTZ-T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ISL6353CRTZ-T part is unused and in its original packaging.
Return procedure for ISL6353CRTZ-T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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