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Renesas ISL6556BCBZ

Part No.:
ISL6556BCBZ
Manufacturer:
Renesas
Category:
Special Purpose Regulators
Package:
28-SOIC (0.295", 7.50mm Width)
Datasheet:
AetrixISL6556BCBZ.pdf
Description:
IC REG CTRLR INTEL 4OUT 28SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,367

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Product details

Overview

ISL6556BCBZ from Intersil is a multi-phase PWM controller for VR10.x microprocessor core voltage regulation, driving up to 4 synchronous-rectified buck channels with rDS(ON) current sensing, 6-bit VID input (0.8375V–1.600V in 12.5mV steps), programmable internal temperature compensation, and differential remote voltage sensing. It enables adaptive voltage positioning (droop) and channel-current balancing in high-current CPU power delivery systems.

For engineers reviewing the ISL6556BCBZ datasheet, ISL6556BCBZ pinout, ISL6556BCBZ application, or ISL6556BCBZ equivalent, this page delivers verified technical context, exact pin functions, real-world load-line design implications, thermal compensation behavior, and validated alternative options for VR10.x-compliant server and desktop CPU power stages.

Technical Context

The ISL6556BCBZ implements a 4-phase interleaved PWM architecture with phase spacing controlled via PWM3/PWM4 logic inputs, supporting 2-, 3-, or 4-phase operation up to 1.5MHz per phase. Its rDS(ON)-based current sensing feeds a shared IAVG calculation for real-time channel-current balancing and droop programming via FB resistor networks.

It integrates a 6-bit DAC decoding VID4–VID12.5 inputs into precise reference voltages, coupled with Dynamic VID™ for on-the-fly transitions, and uses a dedicated TCOMP pin to scale temperature-compensated droop current based on MOSFET rDS(ON) drift - all referenced to a ±0.5% system accuracy over temperature and life.

Key Specifications

Parameter Value and Actual Design Meaning
Voltage Range 0.8375V–1.600V in 12.5mV steps; sets microprocessor core VDD via 6-bit VID interface
Phase Support Configurable 2/3/4-phase operation; PWM3/PWM4 logic pins select topology without reprogramming
Switching Frequency 0.08–1.5MHz; set by external FS-to-ground resistor; enables optimization of inductor size and ripple
System Accuracy ±0.5% over temperature and life (VID = 1.2V–1.6V); includes DAC, remote sense, and error amp errors
rDS(ON) Sensing Lossless current sensing using lower-MOSFET on-resistance; eliminates discrete sense resistors and PCB area
Temperature Compensation Programmable via TCOMP pin; nullifies rDS(ON) drift across 0°C–105°C junction range for stable droop
Remote Sensing Differential VSEN/RGND inputs with 20MHz bandwidth; removes IR drop error between controller and CPU die

Pinout & Package

ISL6556BCBZ is housed in a 28-lead SOIC package (JEDEC MO-220 compliant), with 1.27mm pitch, 17.9mm × 7.5mm body, and exposed pad not present (unlike QFN variant). Thermal resistance θJA = 60°C/W.

Pin/Terminal Circuit Role Design Meaning
VCC Power supply input Accepts 5V ±5% or 12V via 300Ω limiting resistor; internal shunt regulator clamps at 6.2V max
EN Threshold-sensitive enable Active-high at 1.24V; coordinates startup timing with MOSFET drivers; fault reset at 1.14V
VID4–VID0, VID12.5 6-bit VID input bus Directly programs DAC output voltage; supports Dynamic VID™ transitions without interrupting regulation
ISEN1–ISEN4 Per-phase current sense inputs Virtual-ground inputs measuring rDS(ON) voltage drop; used for droop, balancing, and OCP
PWM1–PWM4 Phase control outputs CMOS-level PWM signals driving external MOSFET drivers; phase count configured by PWM3/PWM4 logic states
VDIFF, VSEN, RGND Remote-sense amplifier interface VSEN/RGND accept differential CPU sense points; VDIFF feeds error amp for accurate load-point regulation
OFS Offset current programming Generates fixed DC offset current (485–515mV or 2.91–3.09V) injected into FB to adjust droop baseline
TCOMP Temperature compensation scaling Resistor-to-ground sets transconductance (1μA/V/°C); adjusts droop current vs. MOSFET junction temperature

Key Features

Feature Design Value
Adaptive Voltage Positioning (AVP) Implemented via FB resistor network and rDS(ON) current sensing; provides precise load-line slope without external op-amps
Dynamic VID™ Technology Enables seamless, glitch-free VID changes during operation; critical for CPU frequency/voltage scaling (e.g., SpeedStep)
Integrated Temperature Compensation Nullifies rDS(ON) thermal drift in real time; maintains ±0.5% system accuracy across full operating temperature range
Differential Remote Voltage Sensing Eliminates PCB trace IR drop error between controller and CPU; ensures regulation at actual die voltage, not local board node
Lossless Current Sensing Uses intrinsic MOSFET rDS(ON) instead of shunt resistors; reduces BOM cost, board space, and power loss
Configurable Multi-Phase Topology 2/3/4-phase selection via simple logic tie-offs (PWM3/PWM4); avoids firmware or register programming overhead

Applications

Server CPU Power Delivery Desktop Core Voltage Regulation

Use Scenario: High-current (>60A), low-voltage (≤1.3V) core supply for dual-socket Xeon platforms requiring tight transient response and thermal management.

IC Role / Device Role / Timing Role: Primary multi-phase PWM controller coordinating up to four buck stages, managing AVP, current balancing, and VID updates synchronized to CPU P-states.

Use Value: Enables stable 0.5% output accuracy under dynamic load steps while distributing heat across multiple phases and eliminating sense resistor losses.

Use Scenario: Compact ATX motherboard VRM delivering 1.0–1.5V to Intel Pentium 4/Core 2 processors with VR10.x compliance.

IC Role / Device Role / Timing Role: Central voltage regulator IC interfacing directly with CPU VID pins, driving HIP6601B MOSFET drivers, and implementing remote sensing at CPU socket.

Use Value: Reduces component count via rDS(ON) sensing and integrated shunt regulator, lowering BOM cost and improving layout efficiency in space-constrained consumer boards.

Workstation GPU Core Supply High-Performance Embedded CPU Module

Use Scenario: 3-phase core rail for professional GPU modules (e.g., NVIDIA Quadro) demanding <40A at 1.05V with strict voltage tolerance.

IC Role / Device Role / Timing Role: Multi-phase controller providing precise droop-based load-line control and overvoltage protection triggered via OVP pin to crowbar circuitry.

Use Value: Achieves <200mV overvoltage trip threshold referenced to VID, enabling fast shutdown before GPU damage occurs during transient faults.

Use Scenario: Ruggedized COM Express or ETX module powering ARM or x86 embedded CPUs in industrial automation controllers.

IC Role / Device Role / Timing Role: VR10.x-compliant controller supporting wide-temp operation (0°C–70°C ambient), remote sensing over long flex cables, and robust sequencing via EN/ENLL logic.

Use Value: Maintains ±0.5% regulation accuracy across temperature swings using internal TCOMP scaling, reducing need for external calibration.

Equivalent & Alternatives

The following parts are listed as comparable options for similar multi-phase PWM controller applications.

Alternative Part Technical Difference Application Difference Selection Advice
ISL6556BCRZ 32-lead 5×5mm QFN package; adds ENLL logic-enable pin and OFSOUT output; θJA = 32°C/W vs. 60°C/W for SOIC Preferred for thermally constrained layouts or designs requiring separate logic-level enable control Select ISL6556BCRZ when board space or thermal performance outweighs SOIC's ease of prototyping and rework.
IR35201MTRPBF 8-phase capable, digital PWM controller with PMBus interface; no analog VID support; requires external MCU for configuration Suitable for next-gen VR12.x/IMVP8 systems needing telemetry, margining, and programmable loop response Choose IR35201MTRPBF only if digital control, telemetry, or >4-phase scalability is required - not a drop-in replacement.

Compared with ISL6556BCBZ, ISL6556BCRZ offers superior thermal performance and added enable flexibility in QFN form, while IR35201MTRPBF shifts to digital architecture with expanded phase count but sacrifices analog VID compatibility and increases system complexity.

Availability

ISL6556BCBZ is available at Aetrix Electronics and suitable for server CPU power delivery, desktop VRM design, and high-performance embedded computing applications requiring stable component supply, long-lifecycle support, and RoHS-compliant sourcing.

Supply support for ISL6556BCBZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Intersil Corporation (now part of Renesas Electronics) is a U.S.-based analog and power management IC designer known for high-performance voltage regulators, PWM controllers, and precision analog products.

The ISL6556B product line was engineered specifically for VR10.x-compliant microprocessor core power delivery, emphasizing analog simplicity, thermal stability, and seamless integration with synchronous buck topologies in high-current computing platforms.

FAQ

What is the maximum supported switching frequency for ISL6556BCBZ?

The ISL6556BCBZ supports up to 1.5MHz per phase, adjustable via an external resistor from the FS pin to ground. This upper limit enables compact magnetics and reduced output capacitance in high-density CPU VRMs, while maintaining stable current sensing and PWM timing integrity across the full 0.08–1.5MHz range specified in the datasheet.

Does ISL6556BCBZ support Dynamic VID™, and how does it work?

Yes, ISL6556BCBZ implements Dynamic VID™ technology, allowing real-time, glitch-free changes to the output voltage during operation by updating the 6-bit VID input code. The internal DAC and sample-and-hold circuitry ensure smooth transitions without regulation interruption - essential for CPU P-state transitions in Intel VR10.x platforms.

How does the ISL6556BCBZ implement temperature compensation for rDS(ON) sensing?

The ISL6556BCBZ uses the TCOMP pin to accept a resistor-to-ground that sets a transconductance of 1μA/V/°C. This scales an internal temperature-dependent current injected into the droop path, counteracting rDS(ON) drift in the lower MOSFETs and preserving ±0.5% system accuracy across 0°C–105°C junction temperature - confirmed in Electrical Specifications Table on page 7.

Can ISL6556BCBZ be used in 2-phase or 3-phase configurations, or is it limited to 4-phase?

ISL6556BCBZ supports 2-, 3-, or 4-phase operation. Phase count is selected by logic states on PWM3 and PWM4 pins: tie PWM3 to VCC for 2-phase, PWM4 to VCC for 3-phase, or leave both floating for default 4-phase. This hardware-configurable flexibility avoids firmware dependencies and simplifies board-level design reuse.

What is the purpose of the OFS pin on ISL6556BCBZ, and how is it used?

The OFS pin on ISL6556BCBZ generates a precision DC offset current (485–515mV or 2.91–3.09V depending on resistor connection) injected into the FB node to adjust the droop baseline independently of VID setting. This allows fine-tuning of the load-line slope without altering the DAC reference, supporting custom AVP curves required by specific CPU specifications.

ISL6556BCBZ Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
28-SOIC (0.295", 7.50mm Width)
Packaging:
Tube
Product Status:
Obsolete
Applications:
Controller, Intel VR10X
Voltage - Input:
3V ~ 12V
Number of Outputs:
4
Voltage - Output:
0.84V ~ 1.6V
Operating Temperature:
0°C ~ 70°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
28-SOIC

ISL6556BCBZ FAQ

1.How can I place an order for ISL6556BCBZ through Aetrix?

Please submit a Request for Quotation (RFQ) for ISL6556BCBZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for ISL6556BCBZ reliable?

The price and inventory of ISL6556BCBZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ISL6556BCBZ is usually 5 days.

3.What payment methods are accepted for ISL6556BCBZ?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ISL6556BCBZ transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for ISL6556BCBZ?

ISL6556BCBZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your ISL6556BCBZ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for ISL6556BCBZ?

For technical support, including ISL6556BCBZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ISL6556BCBZ requirements.

6.How does Aetrix verify that ISL6556BCBZ is sourced from the original manufacturer or authorized distributors?

All ISL6556BCBZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ISL6556BCBZ meets industry standards.

7.What is the process for return or replacement of ISL6556BCBZ?

All ISL6556BCBZ units undergo pre-shipment inspection (PSI). If there is an issue with ISL6556BCBZ, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The ISL6556BCBZ part is unused and in its original packaging.

Return procedure for ISL6556BCBZ:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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