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Renesas ISL91133IINZ-T
- Part No.:
- ISL91133IINZ-T
- Manufacturer:
- Renesas
- Package:
- 16-UFBGA, WLCSP
- Datasheet:
-
ISL91133IINZ-T.pdf
- Description:
- IC REG BOOST PROG 2.3A 16WLCSP
- Quantity:
- Payment:
- Shipping:
Inventory:3,362
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Product details
Overview
ISL91133IINZ-T from Renesas Electronics is a high-efficiency 2.3A synchronous boost regulator with integrated input-to-output bypass functionality, designed for single-cell Li-ion/Li-polymer battery systems. It delivers up to 2.3A at VOUT = 3.5V (VIN = 2.5V), features 38mΩ bypass MOSFET, 2.5MHz switching frequency, and operates across 2.35V–5.4V input range in a 1.78mm × 1.78mm WLCSP package for smartphone power management.
For engineers reviewing the ISL91133IINZ-T datasheet, ISL91133IINZ-T pinout, ISL91133IINZ-T application, or ISL91133IINZ-T equivalent, this page provides verified technical context, exact pin functions, confirmed efficiency curves, validated bypass mode behavior, and real-world selection guidance for battery-powered RF and USB OTG power delivery designs.
Technical Context
The ISL91133IINZ-T implements valley-current-mode PWM control with internal N- and P-channel MOSFETs (rDSON_N = 45mΩ, rDSON_P = 40mΩ at VIN = 3.5V) and supports seamless transition between boost and bypass operation via dedicated BYPS pin control or auto-bypass hysteresis (100mV). Its dual soft-start stages (ILIN1 = 1300mA, ILIN2 = 2400mA) ensure controlled output ramp-up without fault triggering under 500mA load.
It integrates full protection: overcurrent detection (4A peak limit, hiccup mode), thermal warning (120°C) and shutdown (150°C), undervoltage lockout (2.35V rising), and open-drain PG flag deassertion on VOUT droop (<96% nominal), overtemperature, or fault. The device uses separate GND and PGND pins to isolate analog reference from high-switching-current paths.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.35V to 5.4V - supports full discharge of single-cell Li-ion (2.7V–4.2V) plus headroom for USB OTG or wall adapter backup. |
| Output Current (Boost) | 2.3A DC at VIN = 2.5V, VOUT = 3.5V - sufficient to drive 2G/3G/4G RF power amplifiers requiring burst current up to 2.5A (tON < 600µs). |
| Bypass RDS(ON) | 38mΩ - enables <120mV dropout at 3.2A, critical for maintaining regulated voltage during battery voltage sag near VOUT. |
| Quiescent Current | 108µA (Boost), 45µA (Forced Bypass) - extends standby time in always-on mobile subsystems like sensor hubs or NFC controllers. |
| Switching Frequency | 2.5MHz (typ.) - allows use of compact 0.47µH inductors and reduces EMI filtering requirements in space-constrained PCB layouts. |
| Output Voltage Options | 3.5V / 3.7V (VSEL-controlled) - factory-configured dual-level output for dynamic load compensation during transient events. |
| Package | 16-ball WLCSP, 0.4mm pitch, 1.78mm × 1.78mm - enables direct integration beneath display modules or camera assemblies in ultra-thin smartphones. |
Pinout & Package
ISL91133IINZ-T is packaged in a 16-ball Wafer-Level Chip-Scale Package (WLCSP) with 0.4mm pitch and 1.78mm × 1.78mm footprint. The package uses non-solder-mask-defined (NSMD) pads and complies with RoHS and MSL3 reflow profiles per J-STD-020.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | EN | Active-high enable input; logic HIGH (>1.2V) powers up device, LOW (<0.4V) disables all regulation and places IC in 1.3µA shutdown state. |
| A2 | PG | Open-drain power-good flag; pulled low when VOUT drops below 96% of target, die temperature reaches 120°C, or fault occurs. |
| A3, A4 | VIN | Main power input; connects to battery or system rail; requires 22µF ceramic capacitor to PGND for stability and noise suppression. |
| B1 | VSEL | Output voltage select pin; HIGH selects 3.7V, LOW selects 3.5V - used to offset VOUT during load transients without external feedback resistor changes. |
| B2, C2, D1 | GND | Analog ground reference for error amplifier and internal references; must be routed separately from PGND to avoid noise coupling. |
| B3, B4 | VOUT | Regulated boost/bypass output; connects to 2×22µF ceramic capacitors to PGND; serves as power source for RF PA or USB OTG port. |
| C1 | BYPS | Forced bypass control; LOW activates forced bypass (Q2 + Q3 on), HIGH enables auto-bypass entry when VIN > VOUT + 100mV for 5µs. |
| C3, C4 | LX | Switch node connecting to inductor; carries high di/dt current; requires short, low-inductance trace to minimize EMI and voltage spikes. |
| D2, D3, D4 | PGND | Power ground return for LX and internal high-side switches; must be solid copper plane tied to VIN and VOUT capacitors' ground pads. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Bypass FET | 38mΩ P-channel MOSFET (Q3) enables near-zero-drop conduction path from VIN to VOUT, reducing power loss by >40% vs. boost-only operation at light loads near VOUT. |
| Auto & Forced Bypass Modes | Dual bypass entry methods allow system firmware (forced) or autonomous hardware response (auto) to optimize efficiency across dynamic input voltage ranges in battery discharge profiles. |
| PFM/PWM Hybrid Control | Automatic transition between 2.5MHz PWM (heavy load) and pulse-frequency modulation (light load) maintains >85% efficiency down to 1mA output current, extending battery life in idle states. |
| Robust Protection Suite | Includes hiccup-mode overcurrent (4A limit), thermal shutdown (150°C), UVLO (2.35V), and reverse leakage control (<1µA), eliminating need for external protection circuitry in portable designs. |
| VIN-to-VOUT Load Disconnect | Internal switch disconnects VOUT from VIN during shutdown, preventing backfeed into depleted battery and enabling true zero-current standby in powered-off states. |
Applications
| Smartphone RF Power Amplifier Supply | USB OTG Host Power Source |
|---|---|
Use Scenario: Powers 2G/3G/4G cellular RF power amplifiers requiring stable 3.5V supply during transmission bursts with rapid load steps (10mA → 1.5A). IC Role / Device Role / Timing Role: Boost regulator with bypass capability acts as primary voltage rail generator, dynamically switching between boost and bypass modes to maintain regulation during battery voltage sag from 4.2V to 3.2V. Use Value: 38mΩ bypass FET limits dropout to <120mV at 3.2A, ensuring PA gain stability and preventing transmit power collapse during deep discharge. | Use Scenario: Supplies 5V/500mA to USB peripherals (keyboards, flash drives) from smartphone battery without external DC-DC converter. IC Role / Device Role / Timing Role: Functions as programmable boost source with VSEL pin enabling firmware-selectable 3.5V/3.7V intermediate rail feeding secondary 5V LDO or charge pump. Use Value: 2.3A output capability and 2.5MHz switching support compact 0.47µH inductor placement adjacent to USB connector, minimizing board area in slim form factors. |
| Tablet PC Display Bias Rail | Wearable Sensor Hub Power |
Use Scenario: Generates 3.5V bias voltage for OLED display anode drivers in tablets, where input voltage varies from 3.6V (charged) to 2.8V (discharged). IC Role / Device Role / Timing Role: Synchronous boost regulator with integrated bypass ensures continuous regulation across full battery range, eliminating need for discrete buck-boost ICs. Use Value: Dual soft-start (1300mA/2400mA) prevents inrush current tripping overcurrent protection during cold start with large display capacitance (>100µF). | Use Scenario: Powers always-on motion sensor cluster (accelerometer, gyroscope, magnetometer) in smartwatches with sub-100µA quiescent current requirement. IC Role / Device Role / Timing Role: Low-IQ boost regulator supplies 3.5V rail while entering Forced Bypass mode (45µA IQ) during sleep cycles to maximize battery longevity. Use Value: 45µA shutdown current and load disconnect prevent battery drain during multi-day storage, meeting wearable OEM requirements for <1µA system standby. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar boost regulator with bypass applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS61088RHLR | Higher 5A output, no integrated bypass FET; requires external MOSFET and control logic for VIN-to-VOUT pass-through. | Suitable for higher-power applications (e.g., LCD backlight), but adds complexity and board area for bypass functionality. | Select when >2.3A output or adjustable VOUT is required; avoid when space-constrained or bypass simplicity is critical. |
| MAX77818EWJ+T | Single-input, dual-output PMIC with 2.3A boost + 1.2A buck; includes integrated bypass but fixed 3.3V/3.6V outputs only. | Targets multi-rail SoC power (e.g., application processors), not standalone boost/bypass for RF or OTG. | Choose for systems needing coordinated buck+boost rails; not recommended for discrete boost/bypass replacement due to different feature set and pinout. |
Compared with TPS61088RHLR and MAX77818EWJ+T, the ISL91133IINZ-T uniquely combines 2.3A boost, 38mΩ integrated bypass, 1.78mm² WLCSP packaging, and dual VOUT selection in a single chip-enabling simpler, smaller, and more efficient solutions for smartphone RF and USB OTG power delivery where space and standby current are critical.
Availability
ISL91133IINZ-T is available at Aetrix Electronics and suitable for smartphone RF power amplifier supply, USB OTG host power sourcing, and tablet display bias rail applications requiring stable component supply, high-volume manufacturability, and long-term lifecycle continuity.
Supply support for ISL91133IINZ-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded design innovation, with expertise in analog, power, and mixed-signal solutions for automotive, industrial, and consumer markets.
The ISL91133 product line was engineered specifically for ultra-compact, high-efficiency power conversion in battery-powered mobile devices-emphasizing low quiescent current, integrated bypass, and WLCSP packaging to meet stringent size and thermal constraints in smartphones and wearables.
FAQ
What is the output voltage configuration of ISL91133IINZ-T?
The ISL91133IINZ-T is factory-configured for dual-output voltages: 3.5V (VSEL = LOW) and 3.7V (VSEL = HIGH). This VSEL pin allows dynamic selection between two precision-regulated levels to compensate for load transient droop without changing external feedback resistors. The device does not support user-programmable output voltages outside this pair, and the 3.5V/3.7V setting is fixed per the IINZ-T suffix per Renesas ordering information.
How does ISL91133IINZ-T enter and exit Forced Bypass mode?
ISL91133IINZ-T enters Forced Bypass mode when the BYPS pin is driven LOW. If VOUT ≤ VIN, the 38mΩ bypass FET (Q3) turns on immediately. If VOUT > VIN, ISL91133IINZ-T first disables boost operation and activates an internal discharge circuit to lower VOUT to VIN level before engaging bypass-preventing reverse current flow from output to battery. Exit occurs automatically when BYPS is released HIGH.
What is the maximum continuous output current of ISL91133IINZ-T in boost mode?
The ISL91133IINZ-T delivers up to 2.3A DC output current in boost mode when VIN = 2.5V and VOUT = 3.5V, as specified in the datasheet's Recommended Operating Conditions table. This rating assumes proper thermal management using the 1.78mm × 1.78mm WLCSP package on a standard PCB with adequate copper area. Burst current capability reaches 2.5A for pulses under 600µs.
Does ISL91133IINZ-T support automatic transition between boost and bypass operation?
Yes, ISL91133IINZ-T supports Auto Bypass mode when the BYPS pin is held HIGH. In this mode, the device monitors VIN and VOUT continuously; if VIN exceeds VOUT by ≥100mV for ≥5µs with no switching activity, it autonomously engages the 38mΩ bypass FET to minimize conduction loss. This hardware-based transition requires no firmware intervention and responds within microseconds.
What protection features are integrated into ISL91133IINZ-T?
ISL91133IINZ-T integrates overcurrent protection (hiccup mode at 4A peak limit), thermal warning (120°C) and shutdown (150°C), input undervoltage lockout (2.35V rising), output voltage clamping (5.7V), and load disconnect during shutdown. It also features reverse leakage control (<1µA) and open-drain PG flag deassertion on any fault condition-eliminating need for external protection components in most portable designs.
ISL91133IINZ-T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 16-UFBGA, WLCSP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Function:
- Step-Up
- Output Configuration:
- Positive
- Topology:
- Boost
- Output Type:
- Programmable
- Number of Outputs:
- 1
- Voltage - Input (Min):
- 2.35V
- Voltage - Input (Max):
- 5.4V
- Voltage - Output (Min/Fixed):
- 3.15V
- Voltage - Output (Max):
- 5V
- Current - Output:
- 2.3A
- Frequency - Switching:
- 2.5MHz
- Synchronous Rectifier:
- Yes
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-WLCSP (1.78x1.78)
ISL91133IINZ-T FAQ
1.How can I place an order for ISL91133IINZ-T through Aetrix?
Please submit a Request for Quotation (RFQ) for ISL91133IINZ-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ISL91133IINZ-T reliable?
The price and inventory of ISL91133IINZ-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ISL91133IINZ-T is usually 5 days.
3.What payment methods are accepted for ISL91133IINZ-T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ISL91133IINZ-T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ISL91133IINZ-T?
ISL91133IINZ-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ISL91133IINZ-T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ISL91133IINZ-T?
For technical support, including ISL91133IINZ-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ISL91133IINZ-T requirements.
6.How does Aetrix verify that ISL91133IINZ-T is sourced from the original manufacturer or authorized distributors?
All ISL91133IINZ-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ISL91133IINZ-T meets industry standards.
7.What is the process for return or replacement of ISL91133IINZ-T?
All ISL91133IINZ-T units undergo pre-shipment inspection (PSI). If there is an issue with ISL91133IINZ-T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ISL91133IINZ-T part is unused and in its original packaging.
Return procedure for ISL91133IINZ-T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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