STMicroelectronics ISO8200BQ

Overview

ISO8200BQ from STMicroelectronics is a galvanically isolated octal high-side smart power solid-state relay with 8 independent channels, VCC operating range 10.5–36 V, R_DS(on) = 0.12 Ω (TYP), per-channel current limit of 0.7 A (MIN), and integrated thermal shutdown with channel-level independence. It drives inductive, resistive, and capacitive loads in industrial PLC I/O modules.

For engineers reviewing the ISO8200BQ datasheet, ISO8200BQ pinout, ISO8200BQ application, or ISO8200BQ equivalent, key selection considerations include its dual-isolated supply architecture (VCC/VDD), synchronous vs. direct control modes, open-drain FAULT reporting, and compliance with IEC 61000-4-x immunity standards for harsh industrial environments.

Technical Context

The ISO8200BQ implements two galvanically isolated voltage domains: VCC/GNDCC powers the process-side high-side switches, while VDD/GNDDD supplies the logic-side interface and control circuitry. Each channel features independent over-temperature protection (TJSD = 150–170 °C) and short-circuit current limiting (ILIM = 0.7–1.9 A).

It supports two operational modes: Direct Control Mode (DCM), where INx directly drives OUTx when SYNC and LOAD are tied low; and Synchronous Control Mode (SCM), using separate LOAD and SYNC signals to minimize output jitter (tjitter(SCM) = 6 µs) and enable coordinated multi-device switching.

Key Specifications

Pinout & Package

ISO8200BQ uses a TFQFPN32 (5 × 5 mm, 0.5 mm pitch) package with dual exposed thermal pads: one internally connected to VCC (TAB(VCC)), the other to GNDCC (TAB(GNDCC)). This dual-tab layout enables independent thermal management for logic and power domains.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-side isolated driver applications.

Compared with STISO8200BQTR, the ISO8200BQ offers identical performance in tube packaging for prototyping; versus BTS724G, it eliminates external isolation components and provides certified reinforced insulation, reducing design complexity and improving EMC robustness in noisy factory environments.

Availability

ISO8200BQ is available at Aetrix Electronics and suitable for programmable logic control, industrial PC peripheral I/O, and numerical control machines requiring stable component supply, long-term lifecycle support, and certified safety isolation.

Supply support for ISO8200BQ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, specializing in automotive, industrial, and power management ICs with broad IP and manufacturing scale.

The ISO8200BQ belongs to ST's Smart Power Switch family-designed specifically for industrial automation systems needing reliable, isolated, high-side switching with embedded diagnostics and safety compliance.

FAQ

What is the maximum continuous output current per channel?

The ISO8200BQ guarantees a minimum short-circuit current limit of 0.7 A per channel (ILIM(MIN) = 0.7 A), with typical continuous operation up to 0.7 A at T_A ≤ 85 °C and proper PCB thermal design. Derating applies above ambient temperature due to R_DS(on) increase and thermal limits-full 0.7 A requires ≤2.4 W total dissipation across all channels.

How does the FAULT pin behave during a communication error?

During an internal communication error across the isolation barrier, the FAULT pin goes active-low and remains asserted until the next successful data transfer. Outputs retain their prior state briefly, then shut down automatically on the next refresh cycle-ensuring fail-safe behavior without host intervention.

Can ISO8200BQ drive inductive loads without external flyback diodes?

Yes-the device integrates fast demagnetization capability with V_DEMAG = VCC − 50 V (TYP), allowing safe energy dissipation from inductive loads like solenoids and relays. This eliminates the need for external freewheeling diodes in most 24 V applications, reducing BOM count and board area.

What is the difference between TJSD and TCSD thermal protections?

TJSD (junction shutdown) triggers per channel at 150–170 °C and resets at 150 °C, enabling individual channel recovery. TCSD (case shutdown) activates at 115–145 °C for the entire chip and resets at 110 °C; it overrides TJSD to protect the whole device during sustained overload, while non-faulted channels continue operating normally.