STMicroelectronics ISO8200BQTR

Overview

ISO8200BQTR from STMicroelectronics is a galvanically isolated octal high-side smart power solid-state relay with 8 independent channels, dual isolated supply domains (VCC up to 36 V, VDD 3.3/5 V), R_DS(on) = 0.12 Ω (TYP), per-channel overcurrent limit of 0.7 A (MIN), and integrated thermal shutdown with channel-level independence. It drives inductive, resistive, and capacitive loads in industrial PLC I/O modules.

For engineers reviewing the ISO8200BQTR datasheet, ISO8200BQTR pinout, ISO8200BQTR application, or ISO8200BQTR equivalent, this device is selected for high-reliability, fault-diagnosable, isolated high-side switching in safety-critical industrial control where galvanic isolation, per-channel thermal autonomy, and common-mode transient immunity (>50 kV/µs) are mandatory.

Technical Context

The ISO8200BQTR integrates two physically separated silicon dies - a logic-side controller (VDD/GNDDD) and a process-side power driver (VCC/GNDCC) - linked via capacitive isolation. Each output channel features independent current limiting (ILIM = 0.7–1.9 A), junction temperature sensing (TJSD = 150–170 °C), and auto-restart hysteresis (THIST = 20 °C).

It supports two operational modes: Direct Control Mode (DCM), where INx directly controls OUTx when SYNC and LOAD are tied low; and Synchronous Control Mode (SCM), where LOAD latches inputs and SYNC triggers simultaneous output update across all 8 channels with jitter ≤6 µs, enabling deterministic multi-device coordination in motion control systems.

Key Specifications

Pinout & Package

ISO8200BQTR uses a 32-pin TFQFPN package (7 mm × 7 mm, 0.5 mm pitch) with dual exposed thermal pads: TAB(VCC) internally connected to VCC, and TAB(GNDCC) externally connected to GNDCC. The layout separates logic (GNDDD/VDD) and process (GNDCC/VCC) ground domains to maintain isolation integrity.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-side isolated driver applications.

Compared with TPL7407LPWR and ADUM3223BRZ, ISO8200BQTR uniquely delivers fully integrated, isolated, self-protected high-side switching in a single 32-pin package - eliminating external protection components, reducing PCB area by >40%, and enabling certified functional safety compliance without additional ICs.

Availability

ISO8200BQTR is available at Aetrix Electronics and suitable for programmable logic controllers, industrial PC peripheral I/O, and numerical control machines requiring stable component supply, long-term lifecycle assurance, and traceable sourcing for safety-certified designs.

Supply support for ISO8200BQTR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in automotive, industrial, and power management ICs with vertical manufacturing and AEC-Q100/IEC 61508 qualification capabilities.

The ISO8200BQTR belongs to ST's ISO8200 family of galvanically isolated smart power switches, designed specifically for replacing electromechanical relays in industrial automation systems demanding high reliability, built-in diagnostics, and reinforced insulation.

FAQ

What is the maximum continuous output current per channel?

The ISO8200BQTR guarantees a minimum short-circuit current limit of 0.7 A per channel (ILIM(MIN) = 0.7 A), with typical R_DS(on) = 0.12 Ω enabling continuous 0.7 A operation at TJ ≤ 125 °C. Derating applies above 85 °C ambient per R_thj-case = 2 °C/W; full 0.7 A is sustainable with adequate PCB copper pour on TAB(GNDCC).

How does the FAULT pin behave during a communication error?

On internal communication error (data corruption across isolation barrier), the FAULT pin asserts low immediately. Outputs retain their prior state for one refresh cycle, then all turn OFF. This two-stage response prevents spurious actuation while ensuring fail-safe shutdown within ≤400 µs of error detection - critical for SIL2-compliant systems.

Can ISO8200BQTR drive inductive loads without external flyback diodes?

Yes. The device features active demagnetization with VDEMAG(TYP) = VCC − 50 V, clamping inductive flyback energy internally. Tested with ≥1 mH loads at IOUT = 0.5 A, it eliminates need for external diodes or RC snubbers - validated per IEC 61000-4-4/5 immunity requirements.

What is the difference between TJSD and TCSD thermal protections?

TJSD (junction shutdown) triggers per-channel at 150–170 °C, turning OFF only the overheated channel while others remain active. TCSD (case shutdown) activates at 115–145 °C, disabling only overloaded channels but leaving healthy ones operational. This hierarchical design enables graceful degradation - e.g., six channels stay ON during localized thermal stress on two.