STMicroelectronics ISO8200BTR

Overview

ISO8200BTR from STMicroelectronics is a galvanically isolated octal high-side smart power solid-state relay IC, designed for industrial I/O control with 8 independent channels, 0.12 Ω R_DS(on) per channel at 25 °C, 0.7 A continuous output current per channel, and 45 V V_CC rating. It integrates dual isolated voltage domains (V_CC for power stage, V_DD for logic), short-circuit protection, and thermal shutdown with independent junction and case monitoring - deployed in programmable logic controllers driving inductive solenoid loads.

For engineers reviewing the ISO8200BTR datasheet, ISO8200BTR pinout, ISO8200BTR application, or ISO8200BTR equivalent, key selection considerations include its 1.3 °C/W junction-to-case thermal resistance, synchronous/parallel interface timing (t_jitter(SCM) = 6 µs), V_demag = V_CC−45 V fast demagnetization capability, and UL1577-certified 1370 V_PEAK isolation voltage.

Technical Context

The ISO8200BTR implements a parallel-input, galvanically isolated architecture with two independent voltage domains: V_DD (3.3 V/5 V TTL/CMOS-compatible logic supply) and V_CC (up to 45 V power supply). Its digital interface supports both Direct Control Mode (DCM) and Synchronous Control Mode (SCM), enabling deterministic multi-device coordination with ≤6 µs output jitter in SCM.

Each of the eight high-side outputs features active current limiting (0.7–1.7 A), dual-stage thermal protection (junction shutdown at 150–170 °C, case shutdown at 115–145 °C), and loss-of-ground/V_CC detection. Fault reporting is consolidated on an open-drain FAULT pin, asserted low during junction overtemperature or internal communication error.

Key Specifications

Pinout & Package

ISO8200BTR uses the PowerSO-36 package with exposed V_CC-connected thermal tab. The 36-pin layout includes dual ground planes (GND_DD for logic, GND_CC for power), 8 dedicated input pins (IN1–IN8), 8 duplicated output pins (OUT1–OUT8, each with two pins for current sharing), and functional control pins (SYNC, LOAD, OUT_EN, FAULT).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-side isolated driver applications.

Compared with STISO8200A and TPL7407L, ISO8200BTR uniquely combines certified reinforced isolation, per-channel thermal independence, and active V_demag clamping - making it the only option qualified for direct replacement of electromechanical relays in safety-rated industrial I/O modules without additional protection components.

Availability

ISO8200BTR is available at Aetrix Electronics and suitable for programmable logic controllers, industrial PC peripheral I/O, and numerical control machines requiring stable component supply, long-term lifecycle support, and traceable sourcing for safety-critical deployments.

Supply support for ISO8200BTR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, specializing in automotive, industrial, and power management solutions with broad IP portfolios and vertical manufacturing capabilities.

The ISO8200BTR belongs to ST's Smart Power Isolation portfolio, engineered specifically for robust, high-reliability industrial digital output modules where galvanic isolation, thermal resilience, and deterministic timing are non-negotiable design requirements.

FAQ

What is the function of the SYNC and LOAD pins in ISO8200BTR?

The SYNC and LOAD pins configure the device's parallel interface operation mode. When driven independently, they enable Synchronous Control Mode (SCM) for low-jitter, coordinated multi-device updates. When shorted together, they activate Direct Control Mode (DCM), allowing real-time input-to-output mapping. Both modes retain full fault protection and thermal management functionality regardless of control configuration.

How does the FAULT pin behave during a channel overtemperature event?

The FAULT pin asserts low immediately upon detection of junction overtemperature (T_J > 150–170 °C) in any channel and remains latched low until the junction temperature falls below the reset threshold (~150 °C). It does not auto-clear during ongoing fault conditions - requiring host MCU intervention or power cycle to restore normal operation, ensuring fail-safe behavior in safety-critical systems.

Can ISO8200BTR drive inductive loads without external flyback components?

Yes. ISO8200BTR integrates active V_demag clamping with V_demag = V_CC−45 V, which safely dissipates inductive energy during turn-off. This eliminates the need for external freewheeling diodes or RC snubbers in typical 24 V industrial solenoid and valve applications, reducing PCB area and component count while maintaining fast, predictable turn-off timing.

What is the significance of the exposed thermal tab connected to V_CC?

The exposed PowerSO-36 tab is internally bonded to V_CC, serving as both primary thermal path and high-current power connection. Mounting it to a copper pour or heatsink achieves R_thj-case = 1.3 °C/W, enabling sustained 0.7 A/channel operation at ambient temperatures up to 85 °C. Electrical isolation must be maintained between this tab and other system grounds due to its V_CC potential.