Texas Instruments ISOTMP35BDFQR

Overview

ISOTMP35BDFQR from Texas Instruments is a ±1.2°C accurate, 3-kVRMS isolated analog-output temperature sensor IC with 10mV/°C slope, 500mV offset at 0°C, <2-second thermal response, and 500VRMS working voltage. It integrates galvanic isolation and sensing in a single SOIC-7 package for direct mounting on high-voltage heat sources like IGBTs or HV contactors in power conversion systems.

For engineers reviewing the ISOTMP35BDFQR datasheet, ISOTMP35BDFQR pinout, ISOTMP35BDFQR application, or ISOTMP35BDFQR equivalent, this page delivers verified specifications, thermal response behavior, isolation barrier performance, analog output drive capability, and real-world implementation guidance for high-reliability EV charging and server PSU designs.

Technical Context

The ISOTMP35BDFQR implements a monolithic integrated isolation barrier rated for 3000VRMS withstand and 500VRMS working voltage per UL 1577 and IEC 62368-1, with >50-year lifetime. Its thermal sensing path uses direct TSENSE pin-to-die conduction through a 7-pin SOIC package optimized for minimal thermal mass.

It delivers a class-AB analog output capable of sourcing up to 500μA into capacitive loads ≤1nF while maintaining ±1.2°C accuracy from 0°C to 70°C and exhibiting 50kV/μs common-mode transient immunity - enabling robust operation in noisy high-voltage domains without external isolation components.

Key Specifications

Pinout & Package

ISOTMP35BDFQR is housed in a DFQ (7-pin SOIC) package measuring 4.9mm × 6mm, with exposed thermal pad on bottom side for enhanced heat transfer from TSENSE pins to die. The package provides 4mm minimum creepage/clearance and >17µm internal DTI for reinforced isolation integrity.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar isolated temperature sensing applications.

Compared with ADuM141D and AMC1301, the ISOTMP35BDFQR uniquely integrates isolation, sensing, and analog output in one device - reducing design complexity, improving thermal fidelity, and shortening time-to-market for high-voltage power systems requiring fast, accurate temperature feedback.

Availability

ISOTMP35BDFQR is available at Aetrix Electronics and suitable for AC/DC charging stations, server PSUs, and battery backup units requiring stable component supply, long-lifecycle assurance, and certified isolation performance.

Supply support for ISOTMP35BDFQR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and high-reliability power management solutions.

The ISOTMP35BDFQR belongs to TI's isolated sensor product line, designed specifically to replace discrete isolation + sensing architectures in high-voltage power conversion, EV infrastructure, and industrial energy systems.

FAQ

What is the maximum operating temperature range supported by the ISOTMP35BDFQR?

The ISOTMP35BDFQR supports an operating ambient temperature range of –40°C to +150°C. Its temperature accuracy is specified as ±2.5°C maximum across this full range, and ±1.2°C maximum from 0°C to 70°C. The device's junction temperature can reach up to 155°C, and its isolation barrier is rated for continuous operation at 500VRMS working voltage across this thermal envelope. This makes the ISOTMP35BDFQR suitable for under-hood automotive charging modules and high-density server PSU hotspots.

How does the ISOTMP35BDFQR achieve <2-second thermal response time?

The ISOTMP35BDFQR achieves <2-second thermal response by using a direct-conduction thermal path: its TSENSE pins (2, 5, 6, 7) are physically bonded to the high-voltage heat source, and heat flows efficiently through the SOIC-7 package's low-thermal-resistance structure to the embedded sensor die. Unlike conventional sensors placed remotely for isolation compliance, the ISOTMP35BDFQR's integrated 3-kVRMS barrier allows co-location - minimizing thermal mass and eliminating insulating air gaps. Measured directional response is 1600 ms (τ = 63%) on a 2-layer PCB.

Can the ISOTMP35BDFQR drive a 1000pF capacitive load directly?

Yes, the ISOTMP35BDFQR's class-AB output driver is explicitly rated to drive capacitive loads up to 1000pF (1nF) while maintaining specified accuracy and settling behavior. Its output impedance is 20Ω at 100Hz and 50Ω at 500Hz, and it sources up to 500μA - sufficient to charge and stabilize RC filters commonly used before SAR or delta-sigma ADC inputs. For loads exceeding 1nF or long PCB traces, TI recommends adding an external buffer such as the THP210, as documented in the ISOTMP35BDFQR application notes.

What safety certifications apply to the ISOTMP35BDFQR?

The ISOTMP35BDFQR is certified to UL 1577 (3000VRMS for 1 minute) and meets IEC 62368-1 requirements for reinforced insulation. It features ≥4mm external creepage and clearance, >17µm internal distance-through-insulation (DTI), and comparative tracking index (CTI) >400V (Material Group II). While UL file and certificate numbers are pending, the device has completed qualification testing per all mandatory insulation parameters - including VIOWM = 500VRMS, VIOTM = 4250VPK, and VIMP = 5000VPK - making it suitable for end-equipment safety certification in EV charging and telecom power applications.

Does the ISOTMP35BDFQR require external calibration for accurate temperature measurement?

No, the ISOTMP35BDFQR does not require external calibration for standard applications. It delivers ±1.2°C maximum accuracy from 0°C to 70°C and ±2.5°C from –40°C to 150°C as shipped. Its output follows a piecewise-linear transfer function (10mV/°C base slope with inflection points at 100°C and 125°C), and TI provides lookup tables and equations in the datasheet to convert VOUT to temperature with <0.5°C residual error. Factory-trimmed gain and offset eliminate the need for system-level calibration unless sub-degree accuracy is required above 100°C.