Texas Instruments ISOTMP35BEVM

Overview

ISOTMP35BEVM from Texas Instruments is an evaluation module designed to characterize the ISOTMP35 isolated analog-output temperature sensor IC. It integrates an MSP430F5528 microcontroller, USB interface, detachable high-voltage sensor board, bottom-side copper thermal plate with screw hole, and status LEDs (D3 green for 3.3V supply, D4 red for MCU operation). It enables real-time temperature data logging in EV charging, solar inverters, and HEV/EV powertrain systems.

For engineers reviewing the ISOTMP35BEVM datasheet, ISOTMP35BEVM pinout, ISOTMP35BEVM application, or ISOTMP35BEVM equivalent, this page delivers verified hardware architecture, thermal interface guidance, GUI software integration, safety-critical HV setup procedures, and component-level BOM traceability - all specific to the ISOTMP35BEVM evaluation platform.

Technical Context

The ISOTMP35BEVM separates into two electrically isolated sections: a low-voltage controller board (MSP430F5528, TLV70033 LDOs, USB interface) and a high-voltage sensor breakout board featuring the ISOTMP35BDFQR in SOIC-7. The sensor board supports direct attachment to bus bars or MOSFETs via its back-side copper plane and screw hole, enabling thermal measurement under up to 150°C ambient and high-potential environments.

Signal integrity is maintained through on-board RC filtering (R15/C20), ADC input conditioning (C17, 100 pF), and strict capacitive load management (≤1000 pF total at ISOTMP35 output). The EVM's firmware reads the ISOTMP35's 10 mV/°C analog output, converts it to temperature, and streams data via TI's cloud-based or offline GUI Composer software.

Key Specifications

Availability

ISOTMP35BEVM is available at Aetrix Electronics and suitable for EV charging infrastructure, solar string inverters, and HEV/EV on-board chargers requiring stable component supply, rapid prototyping validation, and high-voltage thermal sensing evaluation.

Supply support for ISOTMP35BEVM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog, embedded processing, and connectivity technologies for industrial, automotive, and power applications.

The ISOTMP35BEVM belongs to TI's High Voltage Evaluation Module (HV EVM) family, engineered specifically to safely evaluate isolated sensing ICs in high-potential, high-temperature environments such as traction inverters and DC fast-charging power stages.

FAQ

What is the primary function of the ISOTMP35BEVM?

The ISOTMP35BEVM is an evaluation module for the ISOTMP35 isolated temperature sensor IC. It provides a complete, ready-to-use platform - including MSP430F5528 microcontroller, USB interface, detachable sensor board, thermal copper plate, and GUI software - to validate the ISOTMP35's performance in high-voltage, high-temperature applications like EV charging and solar inverters. The ISOTMP35BEVM itself is not a production component but a development tool for system-level thermal characterization.

How does the ISOTMP35BEVM achieve electrical isolation for temperature sensing?

The ISOTMP35BEVM achieves electrical isolation by physically separating into two sections: a low-voltage controller board (with MSP430F5528 and USB) and a high-voltage sensor breakout board containing the ISOTMP35BDFQR. These sections are connected only via insulated wires after desoldering bridge connectors along perforations. The ISOTMP35BDFQR itself provides galvanic isolation between its thermal sensing element and analog output, enabling safe measurement on potentials up to 1.5 kV_RMS - a core capability validated using the ISOTMP35BEVM.

Can the ISOTMP35BEVM sensor board be mounted directly onto a high-voltage bus bar?

Yes - the ISOTMP35BEVM sensor board features a dedicated bottom-side copper plane with an M3 screw hole, explicitly designed for direct mechanical and thermal attachment to high-voltage bus bars or power MOSFET heat sinks. TI recommends metal-to-metal contact (with optional thermal paste) and warns against insulating layers, as they increase thermal resistance and slow response time. This mounting method is fully supported per the ISOTMP35BEVM User's Guide and enables accurate thermal monitoring in live HV systems.

What software tools are compatible with the ISOTMP35BEVM?

The ISOTMP35BEVM is supported exclusively by TI's GUI Composer-based software, accessible either online at dev.ti.com/gallery/info/THSApps/ISOTMP35BEVM or as a downloadable offline application for Windows, macOS, and Linux. The software provides real-time temperature graphing, configurable sampling rates (from 500 ms to 60 s), CSV data logging, functional block diagrams, and links to collateral - all verified and documented for use with the ISOTMP35BEVM hardware revision dated August 2023.

What safety precautions apply when using the ISOTMP35BEVM in high-voltage environments?

TI mandates strict adherence to its High Voltage Evaluation Module (HV EVM) safety guidelines for the ISOTMP35BEVM: users must be qualified professionals trained in HV circuit safety; work areas require emergency power-off (EPO) protection for >50 V_RMS/75 V_DC circuits; the sensor board must be detached and reconnected with HV-rated wiring; and physical contact with energized sections is strictly prohibited. These requirements - detailed in Section 1.5 of the ISOTMP35BEVM User's Guide - are non-negotiable for safe operation of the ISOTMP35BEVM.