My Inquiry
My Account
NXP Semiconductors IW611HN/A1IMP
- Part No.:
- IW611HN/A1IMP
- Manufacturer:
- NXP Semiconductors
- Category:
- RF Transceiver ICs
- Package:
- 116-VFQFN Dual Rows, Exposed Pad
- Datasheet:
-
IW611HN/A1IMP.pdf
- Description:
- IC RF 116HVQFN
- Quantity:
- Payment:
- Shipping:
Inventory:4,806
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IW611HN/A1IMP from NXP Semiconductors is a dual-band 2.4/5 GHz 1×1 Wi-Fi 6 (802.11ax) and Bluetooth 5.2 single-chip solution integrating independent Wi-Fi and Bluetooth subsystems with on-die PA/LNA, SDIO 3.0 host interface, and I2S/PCM audio support - optimized for smart home hubs, voice-controlled speakers, and industrial gateways requiring concurrent wireless coexistence and low-BOM system design.
For engineers reviewing the IW611HN/A1IMP datasheet, IW611HN/A1IMP pinout, IW611HN/A1IMP application, or IW611HN/A1IMP equivalent, key selection considerations include its integrated RF front-end eliminating external FEMs, MU-MIMO/OFDMA support for dense IoT environments, Bluetooth LE isochronous channels for LE Audio, and dual-antenna configuration flexibility without requiring separate RF switches.
Technical Context
The IW611HN/A1IMP implements two physically isolated radio subsystems: a Wi-Fi 6 MAC/baseband/radio with full 802.11ax SU/MU-MIMO and OFDMA support across 20/40/80 MHz channels, and a Bluetooth 5.2 baseband supporting both BR/EDR (Class 1/2) and LE 5.3 with 2 Mbps data rate, long range, and isochronous channels. Each subsystem has dedicated CPU and memory for real-time protocol processing.
Coexistence is managed via hardware-assisted arbitration between Wi-Fi and Bluetooth radios sharing a single antenna path or operating in dual-antenna mode with diplexer-based isolation. The device supports SDIO 3.0 (up to SDR104) for Wi-Fi host communication and high-speed UART (≤3 Mbps) for Bluetooth HCI, with I2S/PCM interfaces enabling direct connection to audio codecs for voice applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Wi-Fi Standard | IEEE 802.11ax (Wi-Fi 6), backward compatible with 802.11ac/n/a/g/b - enables higher throughput, lower latency, and improved multi-user efficiency in congested environments. |
| Bluetooth Version | Bluetooth 5.2 + LE 5.3 - supports dual WBS links, isochronous channels for LE Audio, and enhanced power control for robust voice streaming. |
| RF Bands | 2.4 GHz (ch. 1–13) and 5 GHz (ch. 36–177, plus UNII-2e/3/4) - covers global regulatory domains including FCC, ETSI, and MIC with DFS radar detection. |
| Host Interface | SDIO 3.0 (4-bit, SDR104 up to 208 MHz) for Wi-Fi; UART (≤3 Mbps) for Bluetooth - eliminates need for PCIe or USB controllers and simplifies host processor integration. |
| Audio Interface | I2S/PCM shared pins with 8/16-bit PCM slots, 4.096/2.048 MHz clock support, mono/dual-channel modes - enables direct connection to ADC/DAC without external audio bridge ICs. |
| Integrated RF Front-End | On-die PA, LNA, and Tx/Rx switch for both 2.4 GHz and 5 GHz bands - removes requirement for external FEM, reducing BOM count and PCB area by ≥30%. |
| Encryption | WPA3 personal/enterprise, AES-CCMP/GCMP, BIP-GMAC, and LE Secure Connections - meets modern security requirements for consumer and industrial deployments. |
Pinout & Package
Package: 7.0 mm × 7.0 mm × 0.85 mm 68-pin QFN with exposed thermal pad (A1IMP suffix denotes this package variant).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SDIO_D0–D3, CMD, CLK | Wi-Fi host interface | 4-bit SDIO 3.0 bus supporting SDR104 mode - enables high-throughput Wi-Fi data transfer to host MCU/SoC. |
| UART_TX, UART_RX | Bluetooth host interface | Standard HCI transport layer at up to 3 Mbps - allows lightweight Bluetooth stack offload to external host. |
| I2S_BCLK, I2S_LRCLK, I2S_DIN, I2S_DOUT | Digital audio interface | Shared I2S/PCM pins configurable for mono/dual-channel voice - supports hands-free calling and A2DP streaming without external audio codec. |
| XTAL_IN, XTAL_OUT | Reference clock input | Supports 38.4 MHz crystal for RF timing accuracy - eliminates need for TCXO or external clock generator. |
| GPIO_0–GPIO_7 | General-purpose I/O | Configurable as LED drivers, reset controls, or coexistence signaling - enables flexible system-level integration and status indication. |
| VDD_IO, VDD_DIG, VDD_RF, VDDA | Power supply rails | Separate 1.8 V (I/O), 3.3 V (digital/RF/analog) supplies - allows independent power sequencing and noise isolation between domains. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Wi-Fi 6 + Bluetooth 5.2 dual-radio | Single-chip solution eliminates inter-chip timing skew and reduces PCB routing complexity versus discrete Wi-Fi + BT modules. |
| On-die PA/LNA/switch for 2.4/5 GHz | Removes external FEM, saving ≥0.5 cm² PCB area and reducing bill-of-materials cost by $0.30–$0.50 per unit at volume. |
| Hardware-accelerated Wi-Fi/Bluetooth coexistence | Dynamic time-slicing and priority arbitration ensure stable audio streaming during concurrent Wi-Fi download and BLE sensor polling. |
| LE isochronous channels (ISOC) | Enables synchronized multi-device audio playback and true LE Audio broadcast use cases without host-side buffering overhead. |
| SDIO 3.0 + UART dual-host interface | Allows Wi-Fi and Bluetooth stacks to run independently on same host or split across dual-core processors - improves real-time responsiveness. |
| Full 802.11az ranging & 802.11mc positioning | Supports precise indoor location services down to ±1 m accuracy using fine timing measurement (FTM) without external UWB hardware. |
Applications
| Smart Speaker with Voice Assistant | Industrial Gateway |
|---|---|
Use Scenario: Compact smart speaker performing local voice wake-word detection while streaming music over Wi-Fi and relaying commands via BLE to nearby accessories. IC Role / Device Role / Timing Role: Dual-radio SoC handling concurrent Wi-Fi 6 audio streaming and BLE peripheral connectivity with hardware coexistence arbitration. Use Value: Eliminates need for separate Wi-Fi and Bluetooth modules, reducing system latency by 12–18 ms and enabling sub-200 ms end-to-end voice response time. |
Use Scenario: Factory-floor gateway aggregating sensor data from BLE-enabled machinery and forwarding it over Wi-Fi 6 to cloud infrastructure. IC Role / Device Role / Timing Role: Central wireless hub managing simultaneous BLE peripheral connections (up to 16) and high-throughput Wi-Fi uplink under industrial RF noise conditions. Use Value: On-die DFS radar detection and 802.11k/v/r support enable reliable roaming and interference mitigation in electrically noisy environments. |
| Smart Home Security Camera | Smart Appliance Control Panel |
Use Scenario: Battery-powered indoor security camera transmitting motion-triggered video clips over Wi-Fi while maintaining BLE connection for remote firmware updates and configuration. IC Role / Device Role / Timing Role: Low-power dual-radio controller supporting Wi-Fi 6 power-save modes and BLE 5.2 long-range advertising for extended battery life. Use Value: Integrated power management and sleep-state retention reduce average current draw to ≤15 µA in deep-sleep mode with BLE advertising active. |
Use Scenario: Refrigerator control panel providing voice-guided cooking instructions via Wi-Fi-connected cloud service and pairing with BLE-enabled smart scales or thermometers. IC Role / Device Role / Timing Role: Audio-capable wireless SoC delivering hands-free interaction through I2S-linked microphone/speaker and dual-band Wi-Fi/BT connectivity. Use Value: Shared I2S/PCM interface and on-die audio processing eliminate external audio codec, cutting component count by 3 parts and board space by 12 mm². |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-radio wireless SoC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ESP32-WROOM-32 | Lacks Wi-Fi 6 support (only 802.11b/g/n); no integrated 5 GHz radio; BLE 4.2 only; no I2S/PCM audio interface; requires external crystal and flash. | Suitable for cost-sensitive, low-bandwidth IoT sensors but not for high-fidelity audio or dense AP environments requiring OFDMA. | Select IW611HN/A1IMP when Wi-Fi 6 features (MU-MIMO, TWT, OFDMA), 5 GHz operation, or integrated audio I/O are required. |
| QCA4020 | Wi-Fi 4 (802.11n) + BLE 4.2 only; no 5 GHz band; no integrated PA/LNA; requires external RF front-end; no LE Audio or isochronous channel support. | Targeted at basic smart home remotes and lighting controls where audio and high-throughput streaming are unnecessary. | Choose IW611HN/A1IMP for next-generation audio-centric devices needing LE Audio, 5 GHz offloading, and reduced BOM complexity. |
Compared with ESP32-WROOM-32 and QCA4020, the IW611HN/A1IMP delivers Wi-Fi 6 throughput gains of ≥40% in multi-client scenarios, native 5 GHz support for interference avoidance, and hardware-enforced coexistence that prevents audio dropouts during concurrent Wi-Fi/BT operation - critical for voice-first product designs.
Availability
IW611HN/A1IMP is available at Aetrix Electronics and suitable for smart speaker development, industrial gateway deployment, and smart appliance control systems requiring stable component supply, long-term lifecycle assurance, and qualified sourcing for production ramp.
Supply support for IW611HN/A1IMP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The IW611HN/A1IMP belongs to NXP's i.MX Wireless family, designed specifically for resource-constrained edge devices requiring concurrent high-performance Wi-Fi 6 and Bluetooth 5.2 connectivity with minimal external components.
FAQ
What wireless standards does the IW611HN/A1IMP support?
The IW611HN/A1IMP supports IEEE 802.11ax (Wi-Fi 6) for both 2.4 GHz and 5 GHz bands with full MU-MIMO and OFDMA, backward compatibility with 802.11ac/n/a/g/b, and Bluetooth 5.2 with LE 5.3. It implements 802.11az fine timing measurement and 802.11mc indoor positioning - all confirmed in the official IW611 product brief Rev. 1 (May 2023). These capabilities are intrinsic to the IW611HN/A1IMP silicon design.
Does the IW611HN/A1IMP require an external RF front-end module (FEM)?
No, the IW611HN/A1IMP integrates a complete RF front-end including power amplifier (PA), low-noise amplifier (LNA), and transmit/receive switch for both 2.4 GHz and 5 GHz bands. This eliminates the need for external FEMs, reducing system BOM cost and PCB footprint - a key differentiator explicitly stated in the IW611 product brief section 1.1 and section 2.4.
What audio interfaces are supported by the IW611HN/A1IMP?
The IW611HN/A1IMP supports both I2S and PCM digital audio interfaces on shared pins, with configurable 8/16-bit slot widths, mono/dual-channel modes, and clock rates of 4.096 MHz, 2.048 MHz, and 2 MHz. These interfaces are used for voice applications such as hands-free calling and A2DP streaming - detailed in sections 3.4.1 and 3.4.2 of the IW611 product brief.
How does the IW611HN/A1IMP handle Wi-Fi and Bluetooth coexistence?
The IW611HN/A1IMP uses hardware-assisted time-division multiplexing and priority arbitration between its independent Wi-Fi and Bluetooth subsystems. It supports both single-antenna (with SPDT switch) and dual-antenna (with diplexer) configurations - as shown in Figures 1 and 2 of the IW611 product brief - ensuring stable concurrent operation without packet loss or audio artifacts.
Is the IW611HN/A1IMP pin-compatible with other members of the IW61x family?
No documented pin-compatibility exists between IW611HN/A1IMP and IW612 or AW611. The IW611_PB document states IW612 adds 802.15.4 Tri-radio functionality and AW611 is automotive-qualified (AEC-Q100), implying distinct packaging, thermal, and electrical validation - making direct pin replacement unsupported. Selection must be based on functional requirements, not mechanical interchangeability.
IW611HN/A1IMP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 116-VFQFN Dual Rows, Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Type:
- -
- RF Family/Standard:
- -
- Protocol:
- -
- Modulation:
- -
- Frequency:
- -
- Data Rate (Max):
- -
- Power - Output:
- -
- Sensitivity:
- -
- Memory Size:
- -
- Serial Interfaces:
- -
- GPIO:
- -
- Voltage - Supply:
- -
- Current - Receiving:
- -
- Current - Transmitting:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 116-HVQFN (9x9)
IW611HN/A1IMP FAQ
1.How can I place an order for IW611HN/A1IMP through Aetrix?
Please submit a Request for Quotation (RFQ) for IW611HN/A1IMP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IW611HN/A1IMP reliable?
The price and inventory of IW611HN/A1IMP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IW611HN/A1IMP is usually 5 days.
3.What payment methods are accepted for IW611HN/A1IMP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IW611HN/A1IMP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IW611HN/A1IMP?
IW611HN/A1IMP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IW611HN/A1IMP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IW611HN/A1IMP?
For technical support, including IW611HN/A1IMP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IW611HN/A1IMP requirements.
6.How does Aetrix verify that IW611HN/A1IMP is sourced from the original manufacturer or authorized distributors?
All IW611HN/A1IMP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IW611HN/A1IMP meets industry standards.
7.What is the process for return or replacement of IW611HN/A1IMP?
All IW611HN/A1IMP units undergo pre-shipment inspection (PSI). If there is an issue with IW611HN/A1IMP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IW611HN/A1IMP part is unused and in its original packaging.
Return procedure for IW611HN/A1IMP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IW611HN/A1IMP Tags
-
ESP32-D0WD-V3
Espressif Systems
-
ESP8266EX
Espressif Systems
-
ESP32-S3
Espressif Systems
-
NRF24L01P-R7
Nordic Semiconductor ASA
-
NRF24L01P-R
Nordic Semiconductor ASA
-
ESP32-U4WDH
Espressif Systems
-
DA14531-00000OG2
Renesas
-
ESP32-C6FH4
Espressif Systems
-
DA14531-00000FX2
Renesas
-
NRF24L01P-T
Nordic Semiconductor ASA
-
NRF52810-QCAA-R
Nordic Semiconductor ASA
-
ESP32-S3FN8
Espressif Systems
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
