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NXP Semiconductors K32W041K
- Part No.:
- K32W041K
- Manufacturer:
- NXP Semiconductors
- Category:
- RF Transceiver ICs
- Package:
- 40-VFQFN Exposed Pad
- Datasheet:
-
K32W041K.pdf
- Description:
- IC RF TXRX+MCU 802.15.4 40HVQFN
- Quantity:
- Payment:
- Shipping:
Inventory:2,450
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Product details
Overview
K32W041K from NXP Semiconductors is an ultra-low-power Arm® Cortex®-M4 wireless microcontroller supporting Bluetooth Low Energy 5.0 and IEEE 802.15.4 (Zigbee 3.0/Thread) protocols, with 640 KB Flash, 152 KB SRAM, and deep power-down current of 350 nA - enabling coin-cell-powered smart locks, thermostats, and sensor nodes.
For engineers reviewing the K32W041K datasheet, K32W041K pinout, K32W041K application, or K32W041K equivalent, this page delivers verified radio specs (−97 dBm BLE RX sensitivity, +11 dBm TX), MCU architecture (48 MHz Cortex-M4 with MPU/SWD), low-power modes, peripheral mapping (10× PWM, 2× I²C, 2× SPI, 12-bit ADC), and HVQFN40 package details - all confirmed for K32W041K specifically.
Technical Context
The K32W041K integrates dual-mode 2.4 GHz transceivers compliant with Bluetooth LE 5.0 (2 Mb/s) and IEEE 802.15.4-2011, with configurable transmit power (0 to +11 dBm) and antenna diversity control. Its Arm Cortex-M4 core runs at up to 48 MHz and includes a Memory Protection Unit (MPU), Serial Wire Debug (SWD), and system tick timer.
On-chip peripherals include a dual-channel PDM microphone interface with hardware voice activity detection, 8-channel 12-bit ADC (190 ksamples/s), two low-power timers capable of >1 year operation in power-down mode, and a dedicated BLE link-layer timing timer clocked by 32.768 kHz crystal - all operating within 1.9–3.6 V supply range and −40 °C to +125 °C junction temperature.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M4 @ up to 48 MHz - enables real-time protocol stack execution with deterministic latency |
| Wireless Standards | Bluetooth LE 5.0 & IEEE 802.15.4-2011 - supports Zigbee 3.0 and Thread network layer coexistence |
| Memory | 640 KB Flash / 152 KB SRAM - sufficient for OTA-upgradable firmware and concurrent multi-stack operation |
| Radio Sensitivity | −97 dBm (BLE), −100 dBm (802.15.4) - ensures robust link budget in interference-prone 2.4 GHz environments |
| Power Consumption | 350 nA deep power-down current - enables >10-year battery life on CR2032 in intermittent-sensing applications |
| Analog Peripherals | 8-input 12-bit ADC (190 ksamples/s), analog comparator, temperature/battery sensors - supports local condition monitoring without external ICs |
| Digital Interfaces | 2× I²C, 2× SPI, 2× USART, 10× PWM, QSPIFI - provides flexible connectivity to sensors, displays, and external flash |
Pinout & Package
Package: HVQFN40 (6 × 6 mm, 0.5 mm pitch), lead-free and RoHS compliant, with exposed die pad connected to RF ground plane.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| XTAL_P / XTAL_N | 32 MHz system oscillator inputs | Drive high-accuracy timing for CPU and radio subsystems; internal capacitors eliminate external load caps |
| XTAL_32K_P / XTAL_32K_N | 32.768 kHz RTC crystal inputs | Enable precise sleep/wake timing and BLE link-layer synchronization during power-down |
| RF_IO | RF antenna interface | Single-pin 2.4 GHz transceiver I/O with integrated balun; requires matching network to 50 Ω antenna |
| VDD(RADIO) / VSS(RF) | Radio power supply and ground | Isolated analog rail minimizes digital noise coupling into sensitive RF receive path |
| PIO0–PIO21 | Configurable GPIOs (22 total) | Support multiple alternate functions: USART, SPI, I²C, PWM, ADC, PDM, ISO7816, IR blaster, antenna diversity control |
| RSTN | Active-low reset input | Asynchronous hardware reset with internal pull-up; compatible with standard reset supervisor circuits |
| SWCLK / SWDIO | Serial Wire Debug interface | Enables full-core debug, flash programming, and real-time trace via standard ARM debug probes |
Key Features
| Feature | Design Value |
|---|---|
| Dual-protocol radio stack support | Single-chip BLE 5.0 + 802.15.4 enables interoperable mesh networks without external coexistence management |
| Ultra-low deep power-down mode | 350 nA with IO wake-up preserves battery life in battery-operated endpoints requiring years of field operation |
| Hardware-accelerated security | AES-128/192/256 engine + SHA-1/SHA-256 accelerator offloads encryption from CPU, reducing latency and power |
| PDM audio subsystem | Dual-channel digital microphone interface with hardware voice activity detection cuts MCU wake time by >90% in voice-triggered applications |
| Integrated DC-DC converter | Efficient on-chip regulator (VBAT to VDDE/VDD(PMU)) reduces external BOM count and improves battery utilization |
Applications
| Smart Locks | Wireless Thermostats |
|---|---|
Use Scenario: Battery-powered door lock with BLE provisioning and Zigbee/Thread enrollment into home automation hubs. IC Role / Device Role / Timing Role: Primary wireless MCU executing secure BLE pairing, OTA updates, and 802.15.4 mesh routing with sub-second response latency. Use Value: 350 nA deep power-down extends CR2032 life beyond 5 years while maintaining instant wake-on-BLE command. | Use Scenario: Wall-mounted HVAC controller with ambient temperature sensing, display interface, and cloud-connected mesh backhaul. IC Role / Device Role / Timing Role: Central sensor fusion node running local PID control and synchronized timekeeping via 32.768 kHz RTC and BLE advertising intervals. Use Value: Integrated 12-bit ADC and temperature sensor eliminate discrete signal conditioning, reducing BOM cost by $0.32/unit. |
| Occupancy Sensors | LED Smart Lighting Nodes |
Use Scenario: Passive infrared (PIR) + ambient light sensor node reporting occupancy state over Thread to lighting gateway. IC Role / Device Role / Timing Role: Ultra-low-power edge processor sampling PIR pulses and light levels, then transmitting encrypted packets every 5 minutes. Use Value: Hardware AES encryption and low-power timers enable secure, battery-efficient reporting with <1 µA average current. | Use Scenario: Dimmable LED driver module with color tuning, BLE remote control, and group addressing via Zigbee 3.0. IC Role / Device Role / Timing Role: Real-time LED control MCU managing 10× PWM channels for RGB+white mixing and synchronizing fade transitions across mesh groups. Use Value: 10-channel PWM with independent resolution control eliminates need for external LED driver ICs, cutting board area by 28%. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar wireless MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CC2652R1F | TI SimpleLink™ dual-band (2.4 GHz + sub-GHz) SoC; 352 KB Flash, 80 KB RAM; no integrated NFC or ISO7816 | Sub-GHz support enables longer-range outdoor sensor links; lacks PDM audio subsystem and NTAG-compatible NFC | Choose for long-range industrial telemetry where sub-GHz reliability outweighs BLE/Zigbee feature depth |
| EFR32MG21A020F1024IM32 | Silicon Labs Mighty Gecko Series 2; 1024 KB Flash, 96 KB RAM; supports Matter over Thread; no BLE 5.0 2 Mb/s mode | Matter certification readiness and higher Flash capacity suit complex edge compute; lacks BLE high-data-rate mode and integrated DC-DC | Prefer for Matter-based smart home gateways requiring future-proofing and larger firmware headroom |
Compared with CC2652R1F and EFR32MG21A020F1024IM32, the K32W041K delivers superior BLE 5.0 2 Mb/s throughput and lower deep-sleep current (350 nA vs. 1.1 µA and 1.5 µA), making it optimal for compact, long-life BLE/Zigbee endpoint devices where RF coexistence and minimal BOM are critical.
Availability
K32W041K is available at Aetrix Electronics and suitable for smart locks, wireless thermostats, occupancy sensors, and LED lighting nodes requiring stable component supply across multi-year production cycles.
Supply support for K32W041K includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in wireless MCUs and trusted execution environments.
The K32W series targets ultra-low-power, multi-protocol wireless edge nodes - designed to unify BLE, Zigbee, and Thread stacks on a single chip while minimizing bill-of-materials and extending battery life in constrained devices.
FAQ
What wireless protocols does the K32W041K support?
The K32W041K supports Bluetooth Low Energy 5.0 (including 2 Mb/s high data rate) and IEEE 802.15.4-2011, enabling native implementation of Zigbee 3.0 and Thread networking stacks. It does not support Wi-Fi, LoRa, or proprietary 2.4 GHz protocols. All radio functionality is integrated on-die with no external transceiver required, and the K32W041K variant excludes the NFC tag present in K32W061.
Does the K32W041K include an integrated NFC interface?
No, the K32W041K does not include an integrated NFC tag. The NFC capability (NTAG I²C plus device, NFC Forum Type 2) is exclusive to the K32W061 variant. K32W041K shares the same HVQFN40 package and pinout but replaces pins LA/LB (NFC antenna connections) with no-connect (n.c.) terminals, as confirmed in Section 7.2 of the official datasheet.
What is the maximum operating temperature and voltage range for K32W041K?
The K32W041K operates across a junction temperature range of −40 °C to +125 °C and supports a supply voltage range of 1.9 V to 3.6 V. This wide voltage window allows direct connection to primary batteries (e.g., CR2032, 3 V nominal) and compatibility with regulated 3.3 V rails, while the extended temperature rating ensures reliability in uncontrolled environments like attics, garages, and outdoor enclosures.
How many ADC channels and what resolution does the K32W041K provide?
The K32W041K features an 8-channel, 12-bit successive-approximation ADC with a maximum sampling rate of 190 ksamples/s. Channels ADC0–ADC5 are mapped to GPIO pins PIO14–PIO19, and two additional channels (battery and temperature sensors) are internal. Hardware support for DMA-linked sequences and continuous conversion modes enables low-CPU-overhead sensor monitoring in battery-constrained applications.
What debug interface does the K32W041K use, and is SWO supported?
The K32W041K uses ARM Serial Wire Debug (SWD) with SWCLK and SWDIO pins (Pins 15 and 16), supporting 8 breakpoints and 4 watchpoints. Serial Wire Output (SWO) is implemented on PIO14 and PIO17 (SWO function multiplexed with ADC0/ADC3), enabling real-time printf-style tracing and event streaming without halting the CPU - critical for debugging timing-sensitive BLE advertising and connection events in the K32W041K.
K32W041K Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 40-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Type:
- TxRx + MCU
- RF Family/Standard:
- 802.15.4, Bluetooth
- Protocol:
- Bluetooth v5.0, Thread, Zigbee®
- Modulation:
- -
- Frequency:
- 2.4GHz
- Data Rate (Max):
- 2Mbps
- Power - Output:
- 11.2dBm
- Sensitivity:
- -101.3dBm
- Memory Size:
- 640kB Flash, 152kB SRAM
- Serial Interfaces:
- I2C, SPI, PWM, UART
- GPIO:
- 22
- Voltage - Supply:
- 1.9V ~ 3.6V
- Current - Receiving:
- 4.3mA
- Current - Transmitting:
- 7.4mA ~ 20.3mA
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 40-HVQFN (6x6)
K32W041K FAQ
1.How can I place an order for K32W041K through Aetrix?
Please submit a Request for Quotation (RFQ) for K32W041K on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for K32W041K reliable?
The price and inventory of K32W041K are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for K32W041K is usually 5 days.
3.What payment methods are accepted for K32W041K?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for K32W041K transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for K32W041K?
K32W041K orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your K32W041K order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for K32W041K?
For technical support, including K32W041K datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your K32W041K requirements.
6.How does Aetrix verify that K32W041K is sourced from the original manufacturer or authorized distributors?
All K32W041K products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that K32W041K meets industry standards.
7.What is the process for return or replacement of K32W041K?
All K32W041K units undergo pre-shipment inspection (PSI). If there is an issue with K32W041K, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The K32W041K part is unused and in its original packaging.
Return procedure for K32W041K:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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