NXP Semiconductors K32W061-DK006

Overview

K32W061-DK006 from NXP Semiconductors is an ultra-low-power Arm® Cortex®-M4 wireless microcontroller supporting concurrent Zigbee 3.0, Thread, and Bluetooth Low Energy 5.0 stacks. It integrates a 2.4 GHz IEEE 802.15.4 transceiver, BLE 5.0 transceiver (8 simultaneous connections), 640 KB Flash, 152 KB SRAM, and an embedded NTAG I2C NFC interface. Designed for coin-cell-powered smart locks and sensor nodes, it achieves 350 nA deep power-down current.

For engineers reviewing the K32W061-DK006 datasheet, K32W061-DK006 pinout, K32W061-DK006 application, or K32W061-DK006 equivalent, key selection criteria include dual-protocol radio coexistence, integrated NFC tag support, 12-bit 8-channel ADC with DMA, PDM microphone interface with voice activity detection, and HVQFN40 package compatibility with antenna diversity control.

Technical Context

The K32W061-DK006 implements a dual-radio architecture with independent IEEE 802.15.4 and Bluetooth LE 5.0 PHY/MAC layers sharing the same 2.4 GHz RF front-end and integrated balun. Its Arm Cortex-M4 core runs at up to 48 MHz with MPU, NVIC, and SWD debug support, while dedicated hardware accelerators handle AES-128/192/256 encryption, SHA-1/SHA-256 hashing, and MAC-layer packet formatting with auto-ACKs and CRC generation.

Power management includes five low-power modes-Sleep, Deep-sleep, Power-down, Deep Power-down (350 nA), and RTC-timed wake-up-with dual 32 kHz timers (41-bit and 28-bit) operating during power-down cycles. The integrated DCDC converter, battery/temperature sensors, and ISO7816 smart card interface enable secure, long-life edge-node operation without external PMIC or security elements.

Key Specifications

Pinout & Package

Package: HVQFN40 (6 × 6 mm, 0.5 mm pitch), lead-free and RoHS compliant; junction temperature range −40 °C to +125 °C.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar wireless microcontroller applications.

Compared with EFR32MG21A020F1024IM32 and CC2652R1F, the K32W061-DK006 uniquely delivers triple-protocol concurrency, integrated NFC for zero-touch commissioning, and hardware VAD for voice-aware edge intelligence-all within a compact HVQFN40 footprint optimized for space-constrained battery devices.

Availability

K32W061-DK006 is available at Aetrix Electronics and suitable for smart lock commissioning, Thread border routing, wireless thermostat hubs, and multi-protocol lighting controllers requiring stable component supply across industrial and consumer OEM programs.

Supply support for K32W061-DK006 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global leader in secure connectivity solutions for automotive, industrial, and IoT applications, delivering high-performance, low-power silicon with integrated security and wireless capabilities.

The K32W series targets ultra-low-power, multi-protocol wireless edge nodes for home/building automation, emphasizing single-chip integration of radio, MCU, NFC, and security engines to reduce system complexity and certification effort.

FAQ

What wireless protocols does the K32W061-DK006 support concurrently?

The K32W061-DK006 supports Zigbee 3.0, Thread, and Bluetooth Low Energy 5.0 simultaneously through hardware-accelerated dual-radio PHY/MAC layers sharing one 2.4 GHz transceiver. It enables eight concurrent BLE connections and full 802.15.4 frame handling-including auto-ACKs, CRC, and address filtering-without CPU intervention. This concurrency is confirmed in the NXP K32W061/K32W041 product data sheet Rev. 1.3, Section 1 and 2.2.

Does the K32W061-DK006 include an integrated NFC interface?

Yes, the K32W061-DK006 includes an integrated NTAG I2C (NFC Forum Type 2) interface, accessible via LA and LB pins for external antenna connection. This feature is exclusive to the K32W061 variant and is absent in the K32W041. The NFC tag supports read/write operations and is used for secure device provisioning and commissioning, as documented in Section 2.3 and Table 2 of the official datasheet.

What is the lowest power consumption state supported by the K32W061-DK006?

The K32W061-DK006 supports Deep Power-down mode at 350 nA with wake-up capability via GPIO interrupts. In this state, the CPU, most peripherals, and RF sections are powered down, while a dedicated 32 kHz timer remains active to maintain timing reference for RTC and scheduled wake-ups. This value is specified in Section 2.4 and confirmed in Table 10 of the NXP K32W061/K32W041 datasheet Rev. 1.3.

How many ADC channels and what resolution does the K32W061-DK006 provide?

The K32W061-DK006 features an 8-channel, 12-bit successive approximation register (SAR) ADC with maximum sampling rate of 190 ksamples/s. Channels are mapped to PIO14–PIO19 and support hardware-triggered conversions, continuous mode, and DMA-linked transfers to minimize CPU load. This specification is detailed in Section 2.3 and Figure 1 of the official datasheet.

What package type and pin count does the K32W061-DK006 use?

The K32W061-DK006 uses a 40-terminal HVQFN40 package measuring 6 × 6 × 0.85 mm with 0.5 mm pitch, as defined in Table 1 of the NXP K32W061/K32W041 datasheet Rev. 1.3. This thermally enhanced, lead-free, RoHS-compliant package includes an exposed die pad that must be connected to the RF ground plane for optimal RF performance and thermal dissipation.