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NXP Semiconductors KMC7448HX1400ND
- Part No.:
- KMC7448HX1400ND
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 360-BCBGA, FCCBGA
- Datasheet:
-
KMC7448HX1400ND.pdf
- Description:
- IC MPU MPC74XX 1.4GHZ 360FCCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,559
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Product details
Overview
KMC7448HX1400ND from Freescale Semiconductor is a 1420 MHz PowerPC G4 RISC microprocessor with integrated 1-Mbyte unified L2 cache, 32-Kbyte L1 instruction and data caches, and AltiVec SIMD engine. It implements the PowerPC v1.0 ISA on 90 nm SOI CMOS, targeting high-performance networking and computing systems requiring deterministic real-time processing, floating-point computation, and multimedia acceleration.
For engineers reviewing the KMC7448HX1400ND datasheet, KMC7448HX1400ND pinout, KMC7448HX1400ND application, or KMC7448HX1400ND equivalent, this page delivers verified electrical specs (1.20 V core, 1.5/1.8/2.5 V I/O), thermal resistance (RθJA = 26°C/W), DFS support, and confirmed package mapping to 360-ball ceramic BGA (HCTE) - all critical for board layout, power delivery, and thermal design validation.
Technical Context
The KMC7448HX1400ND features a seven-stage superscalar pipeline with out-of-order issue for AltiVec instructions, dual integer units (IU1a/b/c and IU2), five-stage IEEE 754-compliant FPU, and four vector units (VIU1, VIU2, VFPU, VPU). Its memory subsystem supports MPX bus protocol and subset of 60x bus protocol, with hardware-enforced MESI coherency for multiprocessor systems.
It integrates separate instruction and data MMUs with 128-entry two-way TLBs, 52-bit virtual addressing, and BAT-based translation for 4-Kbyte pages and 256-Mbyte segments. Dynamic frequency switching (DFS) enables software-controlled core clock halving or quartering, while a dedicated thermal diode enables real-time junction temperature monitoring.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Frequency | 1420 MHz - defines maximum sustained instruction throughput and real-time latency bounds in control-plane or packet-processing applications. |
| Core Voltage | 1.20 V ± 50 mV - sets PCB power delivery requirements and dictates low-noise decoupling network design for stable operation. |
| L2 Cache | 1-Mbyte unified, 8-way set-associative with ECC - provides deterministic memory bandwidth and error resilience for mission-critical compute workloads. |
| L1 Caches | 32-Kbyte instruction + 32-Kbyte data, 8-way set-associative - enables high hit rates for tightly nested loops and streaming media pipelines. |
| Process Technology | 90 nm CMOS SOI - reduces leakage current and improves thermal efficiency over bulk CMOS at high clock frequencies. |
| Thermal Resistance | RθJA = 26°C/W (natural convection, 1s board) - determines minimum heatsink size and airflow requirements for safe continuous operation at Tj ≤ 105°C. |
| I/O Voltage Modes | 1.5 V / 1.8 V / 2.5 V selectable via BVSEL[0:1] pins - enables backward compatibility with legacy buses and forward migration to lower-voltage interfaces. |
Pinout & Package
Package: 360-ball ceramic ball grid array (HCTE), surface-mount, RoHS-compliant lead-free spheres. Dimensions and mechanical drawing conform to Freescale specification HCTE-360.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Core power supply | Must be supplied at 1.20 V ± 50 mV; requires low-ESR ceramic decoupling within 5 mm of each pin group to prevent voltage droop during burst execution. |
| OVDD | I/O power supply | Supplies 1.5/1.8/2.5 V to all processor bus signals; voltage mode selected by BVSEL[0:1] sampled at HRESET negation. |
| HRESET | Asynchronous reset input | Active-low signal initiating full internal reset sequence; must be held low ≥ 100 ns before release to ensure proper state initialization. |
| TCK/TDI/TMS/TRST | JTAG boundary-scan interface | Enables in-system test, debug, and programming per IEEE Std. 1149.1; TRST is optional active-low asynchronous reset for TAP controller. |
| CLKIN | Differential clock input | Accepts LVDS or SSTL_2-compatible differential reference clock; PLL multiplies input to generate 1420 MHz core frequency. |
| ADDR[0:35] | Address bus outputs | 36-bit physical address bus supporting up to 36-bit physical addressing; used for MPX bus transactions with external memory controllers. |
Key Features
| Feature | Design Value |
|---|---|
| AltiVec SIMD Engine | Four dedicated vector units (VIU1/VIU2/VFPU/VPU) enable parallel 128-bit integer/floating-point operations - accelerates video encoding, signal processing, and cryptographic workloads without CPU core intervention. |
| Dynamic Frequency Switching (DFS) | Software-selectable divide-by-two or divide-by-four core clock scaling - reduces dynamic power by up to 75% during low-load periods while preserving register state and cache contents. |
| Hardware Cache Coherency | MESI protocol enforcement across L1 data cache - eliminates need for software cache-flush sequences in SMP configurations, enabling scalable multi-core system designs. |
| Integrated Thermal Diode | On-die analog temperature sensor with calibrated output - allows real-time thermal monitoring via external ADC, enabling closed-loop fan control or frequency throttling. |
| Performance Monitor Unit | Hardware counters for instruction dispatch, cache misses, branch mispredictions, and AltiVec stalls - provides cycle-accurate profiling data for optimizing compiler-generated code and firmware. |
Applications
| Telecom Control Plane | Industrial Real-Time Controller |
|---|---|
|
Use Scenario: Packet classification, ACL enforcement, and QoS policy application in carrier-grade routers and firewalls. IC Role / Device Role / Timing Role: Primary control-plane processor executing Linux-based routing stacks with deterministic interrupt latency under 1 µs. Use Value: 1420 MHz core + AltiVec accelerates deep packet inspection at line rate; L2 ECC prevents silent corruption in long-running control tasks. |
Use Scenario: Motion control loop execution, PLC logic scanning, and safety-critical I/O management in CNC machines and robotics. IC Role / Device Role / Timing Role: Deterministic real-time host processor running VxWorks or RTEMS with sub-100 ns timer resolution and guaranteed cache hit latency. Use Value: Seven-stage pipeline + hardware branch prediction ensures bounded worst-case execution time (WCET); DFS enables thermal-safe operation in sealed enclosures. |
| Medical Imaging Workstation | Avionics Data Concentrator |
|
Use Scenario: Real-time reconstruction of CT/MRI slices using iterative algorithms and volume rendering pipelines. IC Role / Device Role / Timing Role: High-throughput compute node performing parallel floating-point and vector math on large datasets with minimal memory latency. Use Value: Dual-issue FPU + 1-Mbyte L2 cache delivers >8 GFLOPS sustained performance; 90 nm SOI process minimizes soft errors in radiation-prone environments. |
Use Scenario: ARINC 664 (AFDX) end-system aggregation of sensor data, health monitoring, and display rendering in flight decks. IC Role / Device Role / Timing Role: Safety-certifiable host processor executing DO-254/DO-178C-compliant firmware with lockstep-capable memory subsystem. Use Value: L1/L2 parity + L2 ECC meets ED-80/DO-254 fault coverage requirements; JTAG boundary scan enables structural test for DAL-A certification evidence. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RISC microprocessor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC7447AHX1300CE | 1300 MHz max frequency; 512-Kbyte L2 cache without ECC; no DFS support; same 360-ball HCTE package. | Lacks L2 ECC and DFS - unsuitable for safety-critical or thermally constrained deployments where error resilience or dynamic power scaling is required. | Select only when cost sensitivity outweighs reliability and thermal flexibility needs; verify software compatibility with MPC7448-specific DFS and ECC registers. |
| MPC7457ECX1500B | 1500 MHz max frequency; 1-Mbyte L2 cache with ECC; adds enhanced branch predictor and larger BTIC; same 90 nm SOI process. | Higher frequency and improved branch prediction yield ~12% IPC gain in speculative code; identical pinout and voltage domains enable drop-in upgrade path. | Preferred for new designs requiring higher throughput; retains full software compatibility with KMC7448HX1400ND toolchain and BSP. |
Compared with KMC7448HX1400ND, MPC7447AHX1300CE trades L2 ECC and DFS for lower cost and power, while MPC7457ECX1500B extends performance headroom and prediction accuracy within the same footprint - enabling scalable platform evolution without PCB redesign.
Availability
KMC7448HX1400ND is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, medical imaging, and avionics applications requiring stable component supply, long-term lifecycle support, and traceable sourcing from authorized channels.
Supply support for KMC7448HX1400ND includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processing, connectivity, and analog solutions for automotive, industrial, and networking markets.
KMC7448HX1400ND belongs to the MPC74xx G4 PowerPC family, designed specifically for high-reliability, high-throughput embedded computing in systems demanding real-time determinism, floating-point precision, and hardware-accelerated vector processing.
FAQ
What is the maximum operating junction temperature for KMC7448HX1400ND?
The KMC7448HX1400ND has a specified maximum die-junction temperature (Tj) of 105°C under recommended operating conditions. This limit applies across all speed grades and must be maintained during sustained Full-Power Mode operation. Thermal design must ensure that RθJA × Pdiss + Tambient ≤ 105°C, where Pdiss is the device's thermal power consumption at 1420 MHz - typically 12.5 W (Full-Power Mode–Thermal) per Table 7 of the MPC7448EC Rev. 4 datasheet. Exceeding this temperature risks timing violations and accelerated electromigration.
Does KMC7448HX1400ND support pin-compatible upgrades to higher-frequency variants?
Yes, KMC7448HX1400ND shares identical 360-ball HCTE package dimensions, pinout, and voltage domains with MPC7448HX1600ND and MPC7448HX1700ND. All three variants use the same core logic, L2 cache controller, and I/O interface architecture. However, higher-frequency versions require tighter power delivery regulation (1.25 V / 1.30 V core) and enhanced thermal management due to increased power density. No PCB changes are needed for migration, but BIOS/firmware must validate PLL configuration and DFS register settings.
How does the L2 cache ECC implementation function in KMC7448HX1400ND?
In KMC7448HX1400ND, L2 cache ECC operates on 64-bit data words with SEC-DED (Single Error Correction, Double Error Detection) capability. Parity is applied to L2 cache tags, while ECC covers L2 data storage. The error injection feature allows controlled fault testing of recovery routines. When a correctable error occurs, the L2 controller transparently corrects the data and logs the event in the Performance Monitor Unit's error status register - no software intervention or cache flush is required. Uncorrectable errors trigger a machine check exception.
Can KMC7448HX1400ND operate with mixed I/O voltage modes on different bus segments?
No. KMC7448HX1400ND selects a single I/O voltage mode (1.5 V, 1.8 V, or 2.5 V) globally via BVSEL[0:1] pins sampled at HRESET negation. All processor bus signals - including address, data, and control lines - share the same OVDD supply and threshold levels. Attempting to drive subsets of signals at different voltages violates absolute maximum ratings and risks latch-up. System-level voltage translation must occur externally using level-shifting buffers if interfacing with multiple voltage-domain peripherals.
What debug and test interfaces are available on KMC7448HX1400ND?
KMC7448HX1400ND provides IEEE Std. 1149.1 JTAG boundary-scan (TCK/TDI/TMS/TRST/TDO) for structural testing and in-circuit debugging, plus an on-chip COP (Controller On Processor) interface for real-time firmware debugging and breakpoint control. The Performance Monitor Unit supports hardware-assisted profiling, while the integrated thermal diode enables analog temperature monitoring. All debug features remain functional in Nap and Sleep power modes, though Deep Sleep disables JTAG clocking until wake-up reset completes.
KMC7448HX1400ND Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 360-BCBGA, FCCBGA
- Series:
- MPC74xx
- Packaging:
- Tray
- Product Status:
- Obsolete
- Core Processor:
- PowerPC G4
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 1.4GHz
- Co-Processors/DSP:
- Multimedia; SIMD
- RAM Controllers:
- -
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- -
- SATA:
- -
- USB:
- -
- Voltage - I/O:
- 1.5V, 1.8V, 2.5V
- Operating Temperature:
- 0°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 360-FCCBGA (25x25)
- Additional Interfaces:
- -
KMC7448HX1400ND FAQ
1.How can I place an order for KMC7448HX1400ND through Aetrix?
Please submit a Request for Quotation (RFQ) for KMC7448HX1400ND on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for KMC7448HX1400ND reliable?
The price and inventory of KMC7448HX1400ND are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for KMC7448HX1400ND is usually 5 days.
3.What payment methods are accepted for KMC7448HX1400ND?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for KMC7448HX1400ND transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for KMC7448HX1400ND?
KMC7448HX1400ND orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your KMC7448HX1400ND order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for KMC7448HX1400ND?
For technical support, including KMC7448HX1400ND datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your KMC7448HX1400ND requirements.
6.How does Aetrix verify that KMC7448HX1400ND is sourced from the original manufacturer or authorized distributors?
All KMC7448HX1400ND products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that KMC7448HX1400ND meets industry standards.
7.What is the process for return or replacement of KMC7448HX1400ND?
All KMC7448HX1400ND units undergo pre-shipment inspection (PSI). If there is an issue with KMC7448HX1400ND, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The KMC7448HX1400ND part is unused and in its original packaging.
Return procedure for KMC7448HX1400ND:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
KMC7448HX1400ND Tags
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