NXP Semiconductors KMC7457RX1000NC
- Part No.:
- KMC7457RX1000NC
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 483-BCBGA, FCCBGA
- Datasheet:
-
KMC7457RX1000NC.pdf
- Description:
- IC MPU MPC74XX 1.0GHZ 483FCCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,334
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
KMC7457RX1000NC from Freescale Semiconductor is a 1.3 V core, 1 GHz PowerPC G4 RISC microprocessor with integrated 512-Kbyte unified L2 cache, L3 cache interface supporting up to 4 Mbytes of external SRAM, and AltiVec™ vector processing unit. It implements the full 32-bit PowerPC architecture and targets high-performance networking and computing systems requiring glueless L3 expansion and IEEE 754-1985 compliant floating-point execution.
For engineers reviewing the KMC7457RX1000NC datasheet, KMC7457RX1000NC pinout, KMC7457RX1000NC application, or KMC7457RX1000NC equivalent, key selection criteria include its 7-stage superscalar pipeline, 1.3 V ±50 mV core supply, 483-ball CBGA package, L3 interface voltage flexibility (1.5/1.8/2.5 V), and support for MESI coherency in multiprocessor systems.
Technical Context
The KMC7457RX1000NC employs a high-performance superscalar core with eleven independent execution units-including four integer units, a five-stage IEEE-compliant FPU, and four AltiVec vector units-and three issue queues (FIQ, VIQ, GIQ) enabling up to three instructions dispatched per cycle. Its Harvard L1 cache architecture features separate 32-Kbyte, eight-way set associative instruction and data caches with PLRU replacement and hardware-enforced MESI coherency.
It integrates a 512-Kbyte on-chip L2 cache with 256-bit interface and nine-cycle L1 miss latency, plus an L3 controller supporting 1/2/4-Mbyte external SRAM configurations with configurable line sizes (64/128-byte), private memory capability, and parity on tags and data. The processor supports MPX and subset 60x bus protocols, JTAG/COP debug interface, and three power-saving modes (Nap, Sleep, Deep Sleep).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Frequency | 1.0 GHz - Fixed clock rate defining maximum instruction throughput and system timing budget. |
| Core Supply Voltage | 1.3 V ±50 mV DC - Tight tolerance required for stable superscalar execution and thermal management. |
| L2 Cache Size | 512-Kbyte unified - Reduces main memory bandwidth pressure and improves deterministic latency for real-time tasks. |
| L3 Interface Support | 1/2/4 Mbyte SRAM - Enables scalable cache hierarchy without glue logic; up to 2 Mbyte usable as cache. |
| Package Type | 483-ball ceramic BGA - High I/O count and thermal performance suitable for dense computing modules. |
| Process Technology | 0.13 μm CMOS - Enables high transistor density (58 million) and low-power operation at 1 GHz. |
| Floating-Point Compliance | IEEE 754-1985 - Guarantees bit-accurate double-precision results across compliant software stacks. |
Pinout & Package
The KMC7457RX1000NC is housed in a surface-mount 483-ball ceramic ball grid array (CBGA) package with 1.27 mm pitch, designed for high thermal dissipation (RθJA = 20°C/W) and signal integrity in high-speed computing applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD (multiple) | Core power supply | Supplies 1.3 V ±50 mV to processor core; decoupling critical for pipeline stability. |
| OVDD (multiple) | Processor bus I/O supply | Configurable 1.8 V or 2.5 V for MPX bus signaling; selected via BVSEL at HRESET negation. |
| GVDD (multiple) | L3 interface I/O supply | Configurable 1.5 V / 1.8 V / 2.5 V for external SRAM interface; selected via L3VSEL. |
| SYSCLK | System clock input | Differential or single-ended reference clock; feeds PLL generating internal 1 GHz core clock. |
| HRESET | Hardware reset input | Asynchronous active-low signal initializing all internal state, including voltage select latches. |
| TCK/TMS/TDO/TDI | JTAG boundary-scan interface | IEEE 1149.1-compliant test and debug access; enables in-system verification and programming. |
Key Features
| Feature | Design Value |
|---|---|
| AltiVec™ Vector Unit | Four dedicated units (VIU1/VIU2/VFPU/VPU) delivering parallel integer/floating-point operations for media and signal processing workloads. |
| Branch Prediction Engine | 128-entry BTIC + 2048-entry BHT + 8-entry link stack enabling accurate speculative execution and reducing misprediction penalty to 6 cycles. |
| L1 Cache Architecture | Separate 32-Kbyte instruction and data caches with physical tagging, PLRU replacement, and hardware MESI coherency enforcement. |
| Power Management Modes | Nap, Sleep, and Deep Sleep states reduce dynamic and leakage power while preserving context or enabling fast wake-up via QREQ/QACK handshake. |
| Memory Management | Dual MMUs with 128-entry two-way TLBs, 52-bit virtual addressing, and BAT-based region protection for secure multitasking environments. |
Applications
| Network Router Control Plane | High-Performance Workstation CPU |
|---|---|
Use Scenario: Real-time packet classification, ACL processing, and control-plane protocol stacks (BGP, OSPF) in carrier-grade routers. IC Role / Device Role / Timing Role: Primary application processor executing Linux-based routing software with deterministic interrupt latency and cache-coherent multi-core scalability. Use Value: Integrated L2 cache and L3 interface reduce off-chip memory accesses, improving packet processing throughput by minimizing memory bottlenecks. | Use Scenario: Desktop and embedded workstation platforms running scientific computing, CAD, or digital content creation applications. IC Role / Device Role / Timing Role: Main CPU executing PowerPC-optimized binaries with AltiVec acceleration for vectorized math and multimedia rendering. Use Value: IEEE 754-compliant FPU and 128-bit VR load/store paths enable reproducible floating-point results and high-bandwidth data movement for compute-intensive tasks. |
| Telecom Baseband Processing | Industrial Real-Time Controller |
Use Scenario: Channel coding (Viterbi, Turbo), modulation/demodulation, and baseband signal conditioning in 3G/4G infrastructure equipment. IC Role / Device Role / Timing Role: Programmable DSP substitute handling real-time signal flow with tight loop timing constraints and low-latency memory access. Use Value: 3-cycle GPR load latency and critical quad-word forwarding accelerate AltiVec-based signal processing kernels without external memory stalls. | Use Scenario: Deterministic motion control, PLC logic execution, and safety-critical I/O management in factory automation systems. IC Role / Device Role / Timing Role: Central deterministic controller managing time-triggered tasks, watchdog supervision, and fault-tolerant communication stacks. Use Value: Hardware-enforced MESI coherency and precise exception model ensure predictable execution timing and reliable error recovery in safety-certifiable environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RISC microprocessor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC7455EC | 256-Kbyte L2 cache; no L3 interface; same 0.13 μm process and 1.3 V core but lower max frequency (900 MHz). | Targeted at cost-sensitive networking applications where L3 scalability is unnecessary and thermal envelope is tighter. | Select MPC7455EC when L3 expansion is not required and board-level power delivery is constrained. |
| MPC7447EC | Identical core and L2 cache but lacks L3 interface; supports only 1.8 V or 2.5 V I/O (no 1.5 V L3 mode); footprint-compatible drop-in replacement. | Used in legacy MPC7455 designs requiring upgrade path without PCB redesign, but without L3 cache extension capability. | Choose MPC7447EC for migration from MPC7455 where L3 is unused and voltage margin must be preserved. |
Compared with MPC7455EC and MPC7447EC, the KMC7457RX1000NC delivers higher L2 capacity, full L3 interface flexibility, and guaranteed 1 GHz operation-making it optimal for new designs demanding scalable cache hierarchy and sustained compute throughput.
Availability
KMC7457RX1000NC is available at Aetrix Electronics and suitable for network infrastructure, high-end embedded computing, and telecom baseband applications requiring stable component supply, long-lifecycle support, and traceable sourcing.
Supply support for KMC7457RX1000NC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor was a leading designer of embedded processors, analog, and connectivity solutions before its acquisition by NXP Semiconductors in 2015; it pioneered the PowerPC architecture for high-performance computing and communications markets.
The MPC7457 product line was engineered for demanding networking and computing systems requiring high-frequency superscalar execution, integrated cache hierarchy, and AltiVec acceleration-targeting applications where deterministic performance and thermal efficiency were critical.
FAQ
What is the core supply voltage requirement for KMC7457RX1000NC?
The KMC7457RX1000NC requires a tightly regulated 1.3 V ±50 mV DC core supply (VDD). This voltage powers the processor core, FPU, and AltiVec units. Deviation beyond ±50 mV risks pipeline instability, incorrect branch prediction, or functional failure. The specification mandates low-noise decoupling near each VDD ball to maintain voltage integrity under dynamic load conditions. KMC7457RX1000NC datasheets define absolute maximums and recommended operating ranges in Table 4 of the Rev. 8 hardware specification.
Does KMC7457RX1000NC support L3 cache, and what SRAM types are compatible?
Yes, KMC7457RX1000NC includes an integrated L3 cache controller supporting 1-, 2-, or 4-Mbyte external SRAM configurations. It is compatible with MSUG2 DDR synchronous burst SRAMs, PB2 pipelined SRAMs, and pipelined late-write (LW) synchronous burst SRAMs. The L3 interface uses a 64-bit data bus and supports programmable write-back/write-through policies. KMC7457RX1000NC does not implement L3 on the MPC7447 variant, confirming this feature is exclusive to the MPC7457 family.
What package type and thermal characteristics apply to KMC7457RX1000NC?
KMC7457RX1000NC uses a 483-ball ceramic BGA package with 1.27 mm pitch. Its junction-to-ambient thermal resistance (RθJA) is 20°C/W under natural convection, and junction-to-board (RθJB) is 6°C/W. These values assume proper PCB layout with thermal vias and copper pour. The package's coefficient of thermal expansion (6.8 ppm/°C) matches common FR-4 substrates, minimizing mechanical stress during thermal cycling. KMC7457RX1000NC thermal specs are documented in Table 5 of the Rev. 8 hardware specification.
How does the KMC7457RX1000NC handle branch prediction and speculative execution?
KMC7457RX1000NC implements a three-tier branch prediction system: a 128-entry, four-way set associative Branch Target Instruction Cache (BTIC), a 2048-entry Branch History Table (BHT) with 2-bit per entry prediction, and an 8-entry link register stack. This enables accurate target address prediction for bclr instructions and reduces misprediction penalty to six cycles. Up to three outstanding speculative branches are supported. KMC7457RX1000NC leverages these structures to sustain high instruction throughput despite complex control flow.
Is KMC7457RX1000NC pin-compatible with earlier MPC7455 designs?
Yes, KMC7457RX1000NC is a footprint-compatible, drop-in replacement for MPC7455 in applications using a 1.3 V core supply. The pinout, package dimensions, and signal definitions are identical. However, KMC7457RX1000NC adds L3 interface pins and supports higher clock frequencies (1.0 GHz vs. 900 MHz), requiring validation of timing margins and power delivery stability. KMC7457RX1000NC documentation explicitly confirms this compatibility in Section 1 Overview.
KMC7457RX1000NC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 483-BCBGA, FCCBGA
- Series:
- MPC74xx
- Packaging:
- Box
- Product Status:
- Obsolete
- Core Processor:
- PowerPC G4
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 1.0GHz
- Co-Processors/DSP:
- Multimedia; SIMD
- RAM Controllers:
- -
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- -
- SATA:
- -
- USB:
- -
- Voltage - I/O:
- 1.5V, 1.8V, 2.5V
- Operating Temperature:
- 0°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 483-FCCBGA (29x29)
- Additional Interfaces:
- -
KMC7457RX1000NC FAQ
1.How can I place an order for KMC7457RX1000NC through Aetrix?
Please submit a Request for Quotation (RFQ) for KMC7457RX1000NC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for KMC7457RX1000NC reliable?
The price and inventory of KMC7457RX1000NC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for KMC7457RX1000NC is usually 5 days.
3.What payment methods are accepted for KMC7457RX1000NC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for KMC7457RX1000NC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for KMC7457RX1000NC?
KMC7457RX1000NC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your KMC7457RX1000NC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for KMC7457RX1000NC?
For technical support, including KMC7457RX1000NC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your KMC7457RX1000NC requirements.
6.How does Aetrix verify that KMC7457RX1000NC is sourced from the original manufacturer or authorized distributors?
All KMC7457RX1000NC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that KMC7457RX1000NC meets industry standards.
7.What is the process for return or replacement of KMC7457RX1000NC?
All KMC7457RX1000NC units undergo pre-shipment inspection (PSI). If there is an issue with KMC7457RX1000NC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The KMC7457RX1000NC part is unused and in its original packaging.
Return procedure for KMC7457RX1000NC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
KMC7457RX1000NC Tags

-
AT91SAM9260B-CU-999
Microchip Technology

-
AT91SAM9G25-CU
Microchip Technology

-
ATSAMA5D27C-CU
Microchip Technology

-
AT91SAM9X35-CU
Microchip Technology

-
AT91SAM9X25-CU
Microchip Technology

-
MCIMX6Y2CVM08AB
NXP Semiconductors
-
AM3352BZCZ100
Texas Instruments

-
AT91SAM9260B-CU
Microchip Technology

-
AT91SAM9260B-QU
Microchip Technology

-
ATSAMA5D31A-CU
Microchip Technology

-
AT91SAM9G20B-CU-999
Microchip Technology

-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
