NXP Semiconductors KMC7457VG1267LC
- Part No.:
- KMC7457VG1267LC
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 483-BCBGA, FCCBGA
- Datasheet:
-
KMC7457VG1267LC.pdf
- Description:
- IC MPU MPC74XX 1.267GHZ 483BGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
KMC7457VG1267LC from Freescale Semiconductor is a 1.3 V core, 512-Kbyte L2 cache, PowerPC G4 RISC microprocessor with integrated L3 cache controller, 32-Kbyte L1 instruction and data caches, and AltiVec™ vector processing unit. It targets high-performance networking and computing systems requiring glueless backside L3 SRAM expansion, IEEE 754-1985-compliant floating-point execution, and hardware-enforced MESI coherency.
For engineers reviewing the KMC7457VG1267LC datasheet, KMC7457VG1267LC pinout, KMC7457VG1267LC application, or KMC7457VG1267LC equivalent, this page delivers verified electrical specs (1.3 V ±50 mV core, 1.5/1.8/2.5 V I/O options), thermal resistance (RθJA = 20°C/W), L3 interface support (1–4 MB SRAM), superscalar dispatch (3 instructions/cycle), and 7-stage pipeline timing - all confirmed from Freescale Rev. 8 hardware specification.
Technical Context
The KMC7457VG1267LC implements a fully static, 0.13 μm CMOS, 58-million-transistor superscalar core with eleven independent execution units: four integer units (IU1a/b/c, IU2), five-stage FPU, four vector units (VIU1/VIU2/VFPU/VPU), and three-issue queues (FIQ/VIQ/GIQ). Its Harvard L1 cache subsystem features 32-Kbyte 8-way set associative instruction and data caches with PLRU replacement, critical double-word forwarding, and hardware MESI coherency.
It integrates a dedicated 512-Kbyte unified L2 cache with 256-bit pipelined interface (9-cycle L1 miss latency), an on-die L3 cache controller supporting 1–4 MB external SRAM (64-/128-byte line sizes), dual MMUs with 128-entry 2-way TLBs, and JTAG/COP debug infrastructure. Core-to-L3 frequency divisors and configurable write-back/write-through policies per page/block are supported.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Voltage | 1.3 V ±50 mV DC - ensures stable operation of 0.13 μm logic at rated frequency; exceeds 1.25 V minimum for full performance. |
| L1 Cache Size | 32-Kbyte instruction + 32-Kbyte data - enables 4-instruction/cycle fetch and 4-word/cycle load throughput with low-latency access. |
| L2 Cache Size | 512-Kbyte unified - reduces main memory bandwidth pressure via 256-bit pipelined interface and 9-cycle L1 miss latency. |
| L3 Interface Support | 1/2/4 MB external SRAM - provides glueless backside expansion with private memory capability (up to 2 MB) and MSUG2 DDR/PB2/LW compatibility. |
| Thermal Resistance | RθJA = 20°C/W (natural convection) - defines maximum power dissipation limit (~5.25 W at 105°C junction, 25°C ambient) for PCB thermal design. |
| Pipeline Stages | 7-stage minimum - balances frequency scalability and IPC; maintains 3+branch instruction throughput per cycle as in prior G4 variants. |
| Vector Processing | AltiVec™ engine with VIU1/VIU2/VFPU/VPU - executes vaddsbs/vmhaddshs/vmladduhm and IEEE 754 FP ops with 1–4 cycle latency depending on operation type. |
Pinout & Package
Package: 483-ball ceramic ball grid array (CBGA), surface-mount, 9.1 mm × 10.8 mm die size, 6.8 ppm/°C CTE.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Core power supply | 1.3 V ±50 mV input; must be decoupled per Section 9.1; violation risks logic failure or latch-up. |
| OVDD | Processor bus I/O supply | Selectable 1.8 V ±5% or 2.5 V ±5%; sets voltage threshold for MPX/60x bus signals via BVSEL sampling at ¬HRESET. |
| GVDD | L3 bus I/O supply | Selectable 1.5 V ±5%, 1.8 V ±5%, or 2.5 V ±5%; determines L3 SRAM interface signaling level and timing margins. |
| BVSEL | Bus voltage select control | Sampled at ¬HRESET to configure OVDD threshold; 0 = 1.8 V mode, HRESET = 2.5 V mode. |
| L3VSEL | L3 voltage select control | Sampled at ¬HRESET to configure GVDD threshold; ¬HRESET = 1.5 V, 0 = 1.8 V, HRESET = 2.5 V. |
| SYSCLK | System clock input | Differential-capable reference; drives PLL; VIH/VIL thresholds scale with OVDD/GVDD per Table 6. |
| HRESET | Hardware reset input | Active-low asynchronous reset; used to sample BVSEL/L3VSEL and initialize internal state machines and caches. |
Key Features
| Feature | Design Value |
|---|---|
| Superscalar Dispatch | Up to 3 instructions/cycle to FIQ/VIQ/GIQ - enables high IPC without increasing clock frequency; requires IQ0–IQ2 availability and CQ space. |
| Branch Prediction | 128-entry 4-way BTIC + 2048-entry 2-bit BHT - reduces misprediction penalty to 6 cycles and enables 1-cycle taken-branch latency on BTIC hit. |
| L2 Cache Bandwidth | 256 bits/cycle pipelined interface - sustains full L1 refill rate; eliminates L2 as bottleneck for streaming workloads. |
| Power Management Modes | Nap/Sleep/Deep Sleep - reduces dynamic power by halting instruction fetch, disabling bus snooping, or stopping PLL; supports QREQ/QACK handshake. |
| Memory Management | Dual 128-entry 2-way TLBs + 8 IBAT/8 DBAT registers - enables efficient 52-bit virtual → 32/36-bit physical translation with software/hardware page table walk. |
Applications
| Network Router Control Plane | High-End Print Server |
|---|---|
Use Scenario: Real-time packet classification, ACL enforcement, and routing table updates in carrier-grade edge routers. IC Role / Device Role / Timing Role: Primary control processor executing Linux-based routing stack with deterministic interrupt latency and AltiVec-accelerated crypto offload. Use Value: 512-Kbyte L2 cache and L3 SRAM interface reduce DRAM accesses for large FIB tables; 1.3 V core lowers thermal footprint in dense chassis. |
Use Scenario: RIP-to-PCL6 conversion, raster image processing, and network print job queuing in enterprise multifunction printers. IC Role / Device Role / Timing Role: Main application processor managing USB/Ethernet interfaces, flash storage, and real-time rendering pipelines. Use Value: AltiVec vector units accelerate JPEG decompression and halftoning; L1/L2 cache hierarchy minimizes latency for bursty print job streams. |
| Scientific Data Acquisition | Legacy Industrial HMI |
Use Scenario: High-speed analog waveform capture, FFT analysis, and real-time signal conditioning in oscilloscopes and spectrum analyzers. IC Role / Device Role / Timing Role: Embedded host processor interfacing with FPGA-based ADC front-ends and managing PCIe/PCI-X data transfers. Use Value: IEEE 754 double-precision FPU enables accurate floating-point math; 7-stage pipeline ensures predictable instruction timing for deterministic sampling loops. |
Use Scenario: Operator interface, PLC communication gateway, and local SCADA visualization in factory automation panels. IC Role / Device Role / Timing Role: Deterministic real-time controller running VxWorks with CAN/EtherCAT master stacks and graphics framebuffer management. Use Value: Hardware MESI coherency simplifies multi-core-safe shared memory access; JTAG/COP interface enables in-system firmware updates and debug. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RISC microprocessor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC7455EC | 256-Kbyte L2 cache (vs. 512-Kbyte), no L3 interface, same 0.13 μm process and 1.3 V core. | Lower-cost embedded control where L3 expansion and larger L2 are unnecessary; lacks glueless SRAM interface. | Select MPC7455EC when system memory bandwidth requirements fit within 256-Kbyte L2 and external cache is implemented via standard bus logic. |
| MPC7447EC | Identical core and L2, but L3 interface omitted; otherwise matches KMC7457VG1267LC pinout and electrical specs. | Cost-sensitive networking appliances requiring same compute throughput but no backside L3 expansion. | Choose MPC7447EC for footprint-compatible drop-in replacement where L3 functionality is disabled in software or unused. |
Compared with MPC7455EC and MPC7447EC, the KMC7457VG1267LC uniquely delivers 512-Kbyte L2 + L3 controller in a single package - enabling higher memory bandwidth density and eliminating glue logic for SRAM-based cache expansion, critical for throughput-bound router control planes and scientific instruments.
Availability
KMC7457VG1267LC is available at Aetrix Electronics and suitable for network router control planes, high-end print servers, scientific data acquisition systems, legacy industrial HMIs, and embedded computing platforms requiring stable component supply across extended product lifecycles.
Supply support for KMC7457VG1267LC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors) designed high-performance PowerPC processors for embedded networking, automotive, and industrial applications before its 2015 acquisition.
The MPC7457 product line was engineered for demanding computing systems requiring AltiVec acceleration, large on-die caches, and scalable L3 expansion - targeting telecom infrastructure, test equipment, and real-time control where deterministic performance and thermal efficiency are critical.
FAQ
What is the core supply voltage requirement for KMC7457VG1267LC?
The KMC7457VG1267LC requires a nominal 1.3 V ±50 mV DC core supply (VDD) under all operating conditions. This voltage must be maintained within tolerance during active operation and transitions; deviation beyond ±50 mV risks timing violations or functional failure. The specification explicitly states that VDD must not exceed OVDD/GVDD by more than 1.0 V during normal operation, and that AVDD (PLL supply) shares the same 1.3 V ±50 mV requirement.
Does KMC7457VG1267LC support L3 cache expansion, and what SRAM types are compatible?
Yes, the KMC7457VG1267LC includes an integrated L3 cache controller supporting 1 MB, 2 MB, or 4 MB of external SRAM. It is compatible with MSUG2 DDR synchronous burst SRAMs, PB2 pipelined synchronous burst SRAMs, and pipelined late-write (LW) synchronous burst SRAMs. The L3 interface uses a 64-bit data bus and supports programmable write-back/write-through policies per page or block, with 64-byte (1 MB) or 128-byte (2 MB) line sizes.
What are the thermal resistance values for KMC7457VG1267LC in natural convection?
The KMC7457VG1267LC has a junction-to-ambient thermal resistance (RθJA) of 20°C/W under natural convection conditions, as specified in Table 5 of the Rev. 8 hardware specification. This value assumes standard mounting on a typical PCB; it drops to 14°C/W on a four-layer board and 15°C/W with 200 ft/min airflow on a single-layer board. These figures directly determine maximum allowable power dissipation for safe junction temperature (≤105°C).
How does the branch prediction unit in KMC7457VG1267LC improve performance?
The KMC7457VG1267LC implements a branch prediction unit with a 128-entry, 4-way set associative branch target instruction cache (BTIC) and a 2048-entry, 2-bit branch history table (BHT). This configuration reduces the misprediction penalty to 6 cycles and enables 1-cycle latency for taken branches on BTIC hits. The unit also supports up to three outstanding speculative branches and an 8-entry link register stack for bclr prediction - collectively minimizing pipeline stalls in loop- and branch-heavy code.
Is KMC7457VG1267LC pin-compatible with earlier MPC74xx processors?
The KMC7457VG1267LC uses a 483-ball CBGA package, which differs from the 360-ball CBGA used by the MPC7447. While the MPC7457 is described as "footprint-compatible, drop-in replacement in a MPC7455 application" when the core supply is 1.3 V, this refers to functional and electrical compatibility-not mechanical pinout identity. Physical pin mapping differs between 360-ball and 483-ball packages; PCB layout changes are required for migration from MPC7447 or MPC7455 to KMC7457VG1267LC.
KMC7457VG1267LC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 483-BCBGA, FCCBGA
- Series:
- MPC74xx
- Packaging:
- Box
- Product Status:
- Obsolete
- Core Processor:
- PowerPC G4
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 1.267GHz
- Co-Processors/DSP:
- Multimedia; SIMD
- RAM Controllers:
- -
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- -
- SATA:
- -
- USB:
- -
- Voltage - I/O:
- 1.5V, 1.8V, 2.5V
- Operating Temperature:
- 0°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 483-FCCBGA (29x29)
- Additional Interfaces:
- -
KMC7457VG1267LC FAQ
1.How can I place an order for KMC7457VG1267LC through Aetrix?
Please submit a Request for Quotation (RFQ) for KMC7457VG1267LC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for KMC7457VG1267LC reliable?
The price and inventory of KMC7457VG1267LC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for KMC7457VG1267LC is usually 5 days.
3.What payment methods are accepted for KMC7457VG1267LC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for KMC7457VG1267LC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for KMC7457VG1267LC?
KMC7457VG1267LC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your KMC7457VG1267LC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for KMC7457VG1267LC?
For technical support, including KMC7457VG1267LC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your KMC7457VG1267LC requirements.
6.How does Aetrix verify that KMC7457VG1267LC is sourced from the original manufacturer or authorized distributors?
All KMC7457VG1267LC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that KMC7457VG1267LC meets industry standards.
7.What is the process for return or replacement of KMC7457VG1267LC?
All KMC7457VG1267LC units undergo pre-shipment inspection (PSI). If there is an issue with KMC7457VG1267LC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The KMC7457VG1267LC part is unused and in its original packaging.
Return procedure for KMC7457VG1267LC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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