My Inquiry
My Account
NXP Semiconductors KMC8112TVT2400V
- Part No.:
- KMC8112TVT2400V
- Manufacturer:
- NXP Semiconductors
- Category:
- DSP (Digital Signal Processors)
- Package:
- 431-BFBGA, FCBGA
- Datasheet:
-
KMC8112TVT2400V.pdf
- Description:
- IC DSP 300MHZ 431FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,664
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
KMC8112TVT2400V from Freescale Semiconductor is a dual-core StarCore® SC140 DSP processor with 448 Kbyte on-chip SRAM (M1), 475 Kbyte M2 memory, integrated Ethernet MAC (10/100 Mbps MII/RMII), four TDM interfaces, and FC-PBGA–431 package. It targets telecom infrastructure baseband processing, voice-over-IP gateways, and wireless access equipment requiring deterministic real-time signal handling.
For engineers reviewing the KMC8112TVT2400V datasheet, KMC8112TVT2400V pinout, KMC8112TVT2400V application, or KMC8112TVT2400V equivalent, key selection criteria include dual-core SC140 instruction set compatibility, 431-ball FC-PBGA mechanical footprint, 1.1 V core / 3.3 V I/O supply requirements, and support for glueless SDRAM, TDM codecs, and DSI host interface.
Technical Context
The KMC8112TVT2400V integrates two independent StarCore® SC140 DSP extended cores, each with 224 Kbyte M1 SRAM, 16-way 16 Kbyte instruction cache, and programmable interrupt controller. Core operation is synchronized to an internal PLL configured at reset via hardware pins.
It features a 128-bit MQBus connecting both cores to 475 Kbyte shared M2 memory, a 64/32-bit system bus supporting multi-master burst transfers, and a 32/64-bit Direct Slave Interface (DSI) enabling external host access to internal resources including M1 and M2 memories without CPU intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Dual StarCore® SC140 DSP extended cores with 16-way 16 KB ICache per core |
| On-Chip Memory | 448 KB M1 SRAM (224 KB/core) + 475 KB shared M2 RAM for critical data buffering |
| Supply Voltages | 1.07–1.13 V core (VDD/VCCSYN); 3.135–3.465 V I/O (VDDH) |
| Package | FC-PBGA–431, 20 mm × 20 mm, 0.8 mm ball pitch |
| Interface Support | 10/100 Mbps Ethernet (MII/RMII/SMII), four TDM modules (up to 128 Mbps aggregate), UART (6.25 Mbps), I²C boot, GPIO (32 pins) |
| Memory Controller | Flexible controller with three UPMs, GPCM, page-mode SDRAM machine, 8 banks for external memory |
| Operating Temperature | –40 °C to +105 °C junction temperature range |
Pinout & Package
FC-PBGA–431 package, 20 mm × 20 mm body, 0.8 mm ball pitch, bottom-soldered interposer-based construction optimized for high-speed signal integrity and thermal dissipation in dense telecom PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD / VDDH | Core and I/O power supply | Separate 1.1 V (VDD/VCCSYN) and 3.3 V (VDDH) rails require independent decoupling; VDDH powers all digital I/O including DSI, system bus, TDM, and Ethernet PHY interface |
| CLKIN / CLKOUT | Primary clock input and buffered output | Accepts external crystal or oscillator (typically 25–100 MHz); CLKOUT provides feedback for PLL lock monitoring and system clock distribution |
| HA[31:0] / HD[63:0] | System bus address/data | 64-bit multiplexed or split-address/data configuration supports 32/64-bit wide external memory and peripheral interfacing with glueless SDRAM, SRAM, and flash |
| DSI[63:0] / DSI_SYNC | Direct Slave Interface signals | 32/64-bit synchronous/asynchronous slave port enabling external host (e.g., ARM host CPU) to directly read/write M1/M2 memory and registers without DSP core involvement |
| ETHRX_CLK / ETHTX_CLK | Ethernet physical layer clock | Dedicated 25 MHz (100 Mbps) or 2.5 MHz (10 Mbps) clocks for MII timing; RMII mode uses single 50 MHz reference |
Key Features
| Feature | Design Value |
|---|---|
| Dual SC140 Cores with Shared M2 Bus | Enables parallel algorithm partitioning across two fully independent DSP engines with low-latency, atomic-access 128-bit MQBus interconnect |
| Four Programmable TDM Modules | Supports simultaneous E1/T1 framing, A-law/μ-law conversion, H-MVIP/H.110, AC-97, and TSI codec interfacing without external glue logic |
| Integrated Ethernet MAC | Full-duplex 10/100 Mbps with VLAN tagging, jumbo frame support, RMON statistics, and local bus master DMA for descriptor and buffer management |
| Flexible Boot Options | Configurable boot from external memory, UART, TDM, I²C EEPROM, or internal boot ROM - enables field firmware recovery and multi-image deployment |
| Hardware Semaphores & GIC | Eight programmable semaphores and global interrupt controller enable deterministic inter-core synchronization and scalable interrupt routing to both cores |
Applications
| Voice over IP Gateway | Wireless Base Station Baseband |
|---|---|
Use Scenario: Real-time voice packetization, echo cancellation, transcoding, and SIP signaling in carrier-grade VoIP edge devices. IC Role / Device Role / Timing Role: Primary signal processing engine executing multiple concurrent DSP algorithms with sub-10 ms latency guarantees. Use Value: Dual SC140 cores deliver >2400 MIPS aggregate performance at 300 MHz, enabling simultaneous G.711/G.729/G.723.1 codec execution and jitter buffer management. | Use Scenario: Channelized baseband processing for 3G/4G small cells, including channel estimation, equalization, and turbo decoding. IC Role / Device Role / Timing Role: Baseband accelerator tightly coupled to RF front-end via TDM and DSI, offloading protocol stack tasks from host processor. Use Value: Four TDM ports support up to 128 voice channels; M2 memory provides low-latency scratchpad for FFT and filter coefficient storage. |
| Media Gateway Controller | Industrial Voice/Data Multiplexer |
Use Scenario: Aggregating legacy TDM trunk lines (E1/T1) into IP networks while performing CAS/SS7 signaling translation and media transcoding. IC Role / Device Role / Timing Role: Central TDM-to-IP bridging IC with integrated Ethernet MAC and hardware-accelerated protocol stacks. Use Value: Glueless E1/T1 framer interface via TDM modules eliminates external ASICs; DSI allows ARM host to manage call control while DSP handles media path. | Use Scenario: Remote telemetry aggregation in utility substations, combining analog sensor inputs, serial Modbus RTU, and Ethernet backhaul. IC Role / Device Role / Timing Role: Deterministic real-time controller managing time-critical I/O sampling, protocol conversion, and secure data forwarding. Use Value: 32 GPIO pins with interrupt capability, dual timers, and UART support direct connection to RS-485 transceivers and analog front-ends without FPGA glue logic. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core DSP applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSC8122TVT2400V | Same SC140 dual-core architecture but with enhanced Ethernet (10/100/1000 Mbps), additional TDM channels, and larger M2 memory (768 KB) | Targets higher-bandwidth applications like LTE eNodeB and video conferencing systems requiring Gigabit Ethernet and >128-channel TDM | Select when needing Gigabit Ethernet, higher TDM channel count, or increased on-chip data buffering beyond 475 KB |
| TMS320C6455ZTZ | Single-core C64x+ DSP with 1 MB L2 cache, no integrated Ethernet MAC, requires external PHY and memory controller | Suitable for compute-intensive but non-telecom-specific applications like radar beamforming or medical imaging where Ethernet is handled externally | Select when prioritizing raw MFLOPS over integrated telecom peripherals and willing to add external Ethernet PHY and memory interface logic |
Compared with MSC8122TVT2400V, KMC8112TVT2400V offers lower cost and power for 100 Mbps-class applications; compared with TMS320C6455ZTZ, it delivers integrated telecom I/O and deterministic dual-core scheduling at the expense of peak floating-point throughput.
Availability
KMC8112TVT2400V is available at Aetrix Electronics and suitable for voice over IP gateways, wireless base station baseband units, and industrial voice/data multiplexers requiring stable component supply across long product lifecycles.
Supply support for KMC8112TVT2400V includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processors, analog, and connectivity solutions for automotive, industrial, and networking markets.
The MSC81xx family was designed specifically for carrier-grade telecommunications infrastructure, emphasizing deterministic real-time DSP performance, integrated telecom interfaces (TDM, DSI, Ethernet), and robust thermal/power management for fanless deployments.
FAQ
What is the maximum operating frequency of the KMC8112TVT2400V?
The KMC8112TVT2400V operates at a maximum core frequency of 300 MHz, as confirmed by its part number suffix "2400V" (indicating 2400 MIPS aggregate performance) and validated in the datasheet's recommended operating conditions and AC timing tables. This frequency is sustained under full load at junction temperatures up to +105 °C with proper thermal design using the specified FC-PBGA–431 package.
Does the KMC8112TVT2400V support booting from external flash memory?
Yes, the KMC8112TVT2400V supports booting from external memory via its flexible boot configuration. The device can initialize from external parallel memory (e.g., NOR flash) connected to the system bus, as well as from UART, TDM, I²C EEPROM, or internal boot ROM. Boot mode is selected using hardware strap pins (HWBS[7:0]) during reset assertion.
How many TDM channels does the KMC8112TVT2400V support simultaneously?
The KMC8112TVT2400V integrates four independent TDM modules, each configurable for 2-, 4-, 8-, or 16-bit word size and supporting hardware A-law/μ-law conversion. These modules collectively handle up to 128 Mbps aggregate data rate and provide glueless interface to E1/T1 framers, H-MVIP/H.110 devices, TSI switches, and audio codecs such as AC-97.
What is the function of the Direct Slave Interface (DSI) on the KMC8112TVT2400V?
The Direct Slave Interface (DSI) on the KMC8112TVT2400V is a 32/64-bit synchronous or asynchronous slave port that allows an external host processor (e.g., ARM-based controller) to directly access internal resources-including M1 SRAM, M2 RAM, and peripheral registers-without involving either SC140 core. This enables efficient host-DSP co-processing architectures common in telecom gateway designs.
What are the power supply requirements for the KMC8112TVT2400V?
The KMC8112TVT2400V requires two distinct power supplies: a 1.07–1.13 V core/PLL rail (VDD/VCCSYN) and a 3.135–3.465 V I/O rail (VDDH). DC electrical characteristics specify typical core current of 554 mW at 300 MHz, with Wait and Stop modes drawing 375 mA and 290 mA respectively. Decoupling must follow Freescale's layout guidelines, including dedicated VDDH planes and low-ESR capacitors near all power balls.
KMC8112TVT2400V Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- StarCore
- Package/Case:
- 431-BFBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Type:
- SC140 Core
- Interface:
- Ethernet, I2C, TDM, UART
- Clock Rate:
- 300MHz
- Non-Volatile Memory:
- External
- On-Chip RAM:
- 448kB
- Voltage - I/O:
- 3.30V
- Voltage - Core:
- 1.10V
- Operating Temperature:
- -40°C ~ 105°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 431-FCPBGA (20x20)
KMC8112TVT2400V FAQ
1.How can I place an order for KMC8112TVT2400V through Aetrix?
Please submit a Request for Quotation (RFQ) for KMC8112TVT2400V on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for KMC8112TVT2400V reliable?
The price and inventory of KMC8112TVT2400V are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for KMC8112TVT2400V is usually 5 days.
3.What payment methods are accepted for KMC8112TVT2400V?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for KMC8112TVT2400V transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for KMC8112TVT2400V?
KMC8112TVT2400V orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your KMC8112TVT2400V order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for KMC8112TVT2400V?
For technical support, including KMC8112TVT2400V datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your KMC8112TVT2400V requirements.
6.How does Aetrix verify that KMC8112TVT2400V is sourced from the original manufacturer or authorized distributors?
All KMC8112TVT2400V products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that KMC8112TVT2400V meets industry standards.
7.What is the process for return or replacement of KMC8112TVT2400V?
All KMC8112TVT2400V units undergo pre-shipment inspection (PSI). If there is an issue with KMC8112TVT2400V, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The KMC8112TVT2400V part is unused and in its original packaging.
Return procedure for KMC8112TVT2400V:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
KMC8112TVT2400V Tags
-
TMS320C5535AZAY10
Texas Instruments
-
TMS320VC5501PGF300
Texas Instruments
-
ADSP-BF592KCPZ
Analog Devices Inc.
-
ADAU1463WBCPZ150
Analog Devices Inc.
-
TMS320VC5402PGE100
Texas Instruments
-
ADAU1701JSTZ-RL
Analog Devices Inc.
-
ADAU1701JSTZ
Analog Devices Inc.
-
TMS320VC5502PGF300
Texas Instruments
-
ADAU1462WBCPZ300RL
Analog Devices Inc.
-
ADAU1452KCPZRL
Analog Devices Inc.
-
ADAU1452WBCPZ-RL
Analog Devices Inc.
-
TMS320C6747DZKB3
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
