NXP Semiconductors KMPC8245LVV266D

Overview

KMPC8245LVV266D from Freescale Semiconductor is a 32-bit PowerPC™ MPC603e-based integrated processor combining a superscalar CPU core with PCI bridge, SDRAM memory controller, dual UARTs, DMA, I²C, and interrupt controller in a single TBGA package. It operates at 266 MHz CPU frequency, supports 66 MHz PCI bus and up to 133 MHz memory bus, and targets embedded control systems requiring high integration and deterministic real-time response.

For engineers reviewing the KMPC8245LVV266D datasheet, KMPC8245LVV266D pinout, KMPC8245LVV266D application, or KMPC8245LVV266D equivalent, key selection considerations include its 266 MHz CPU speed under 1.8–2.0 V core supply, 352-ball TBGA package, PCI 2.2 compliance, ECC/parity memory support, and dynamic power management (nap/doze/sleep modes).

Technical Context

The KMPC8245LVV266D integrates a full-featured MPC603e core-featuring 16-Kbyte instruction and data caches, FPU, MMU, and lockable L1 cache ways-with a peripheral logic block that includes a 32-bit PCI interface (66 MHz, 5.0-V tolerant), SDRAM controller (up to 2 GB, 32-/64-bit data path), dual UARTs, DMA engine, PIC, message unit, and I²C controller. The core and peripheral logic operate on independent PLLs, enabling asynchronous clock domain operation while maintaining synchronous bus coherency.

Its system architecture uses a decoupled 32-bit address / 64-bit data peripheral logic bus with store-gathering, memory prefetching, and hardware-enforced coherency for PCI-to-memory accesses. The device supports both PCI host and agent roles, big- or little-endian operation, and programmable timing for diverse SDRAM configurations (1–8 banks, 16–512 Mbit devices).

Key Specifications

Pinout & Package

Package: 352-ball TBGA (tape ball grid array), 27 mm × 27 mm, 1.27 mm ball pitch, RoHS-compliant lead-free finish. Thermal pad on underside for PCB thermal via attachment.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar embedded processor applications.

Compared with KMPC8245LVV266D, MPC8241LVV266D removes I²C and messaging capability for lower cost, while MPC8245LVV300D delivers 13% higher CPU throughput within identical thermal and PCB constraints - enabling performance scaling without redesign.

Availability

KMPC8245LVV266D is available at Aetrix Electronics and suitable for industrial control gateways, telecom line cards, medical imaging subsystems, and avionics data concentrators requiring stable component supply, long-lifecycle support, and traceable sourcing.

Supply support for KMPC8245LVV266D includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processors, analog, and connectivity solutions for automotive, industrial, and networking markets.

KMPC8245LVV266D belongs to the MPC82xx family of integrated PowerPC processors designed for high-reliability embedded systems where PCI expansion, SDRAM interfacing, and real-time determinism are essential - targeting communications infrastructure and industrial automation.

FAQ

What is the maximum supported SDRAM capacity for KMPC8245LVV266D?

KMPC8245LVV266D supports up to 2 GB of SDRAM across one to eight memory banks. It accommodates 16-, 64-, 128-, 256-, or 512-Mbit SDRAM devices with programmable timing parameters, and interfaces via a 32- or 64-bit data bus depending on configuration. This capacity is validated under recommended operating conditions with GVDD = 3.3 V ±5%.

Does KMPC8245LVV266D support both big-endian and little-endian operation?

Yes, KMPC8245LVV266D supports selectable big- or little-endian operation via configuration registers accessible through the PCI interface or internal memory-mapped space. Endianness is set at boot time and affects data ordering in memory transfers, PCI configuration space access, and peripheral register mapping - critical for interoperability with mixed-endian ASICs.

What power management modes does KMPC8245LVV266D offer, and what are their typical power draws?

KMPC8245LVV266D offers nap, doze, and sleep modes. At VDD = 2.0 V, typical power consumption is 0.4 W (nap), 1.1 W (doze), and 0.2 W (sleep). These modes disable clock domains selectively - sleep halts CPU, memory, and PCI clocks entirely, while nap retains DDR refresh and minimal wake-up logic - enabling rapid resumption in real-time systems.

Is KMPC8245LVV266D pin-compatible with other MPC8245 speed grades like KMPC8245LVV300D?

Yes, KMPC8245LVV266D is pin-compatible with KMPC8245LVV300D and KMPC8245LVV333D. All share identical 352-ball TBGA mechanical footprint, ball assignment, and power/ground pin layout. Differences are limited to speed binning, AC timing specifications, and required core voltage tolerances - allowing drop-in upgrades where thermal and signal integrity margins permit.

What is the function of the DLL circuitry in KMPC8245LVV266D, and how is it configured?

The delay-locked loop (DLL) in KMPC8245LVV266D aligns SDRAM_CLK outputs to SDRAM_SYNC_IN with sub-cycle precision, compensating for PCB trace skew and temperature drift. It is enabled by default and controlled via PMC2 register bit 7 (DLL_EXTEND); lock range depends on SDRAM_SYNC_IN frequency and loop delay - validated from 50–133 MHz with ≤190 ps pin-to-pin skew.