NXP Semiconductors KMPC8245TZU350D

Overview

KMPC8245TZU350D from Freescale Semiconductor is a PowerPC-based integrated processor combining an MPC603e core and PCI bridge, operating at 350 MHz with 1.9–2.2 V core supply, rated for –40°C to +105°C junction temperature, and packaged in lead-free TBGA (ZU). It targets embedded control and communications infrastructure requiring deterministic real-time processing and host-PCI interconnect.

For engineers reviewing the KMPC8245TZU350D datasheet, KMPC8245TZU350D pinout, KMPC8245TZU350D application, or KMPC8245TZU350D equivalent, key selection criteria include verified thermal range compliance, TBGA package mechanical compatibility, PCI bridge latency specs, MPC603e core instruction set support, and voltage tolerance alignment with system power rails.

Technical Context

The KMPC8245TZU350D implements a superscalar, three-issue PowerPC 603e core with 16 KB instruction and 16 KB data L1 cache, integrated PCI controller supporting 32-bit/33 MHz operation, and memory controller supporting SDRAM and SRAM interfaces. It uses a dual-bus architecture separating CPU and PCI domains.

It supports JTAG boundary-scan debugging, programmable interrupt routing, and configurable memory timing registers. The device requires external clock generation and does not integrate PLLs or voltage regulators - all power sequencing and clock stability must be externally managed per MPC8245EC Rev. 7+ specifications.

Key Specifications

Pinout & Package

Package: 324-pin Thin Ball Grid Array (TBGA), ZU variant, lead-free, 27 mm × 27 mm body, 1.27 mm ball pitch, JEDEC MO-205AC compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated processor applications.

Compared with KMPC8245TZU350D, MPC8245TVV350D offers identical functionality in a non-RoHS package, while MPC8247ZQ350B delivers architectural upgrades at the cost of full hardware redesign - making KMPC8245TZU350D optimal for sustaining industrial deployments where footprint and firmware continuity are critical.

Availability

KMPC8245TZU350D is available at Aetrix Electronics and suitable for telecom line card control, industrial PLC main processing, railway signaling gateways, and legacy system emulation modules requiring stable component supply across extended product lifecycles.

Supply support for KMPC8245TZU350D includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor was a U.S.-based semiconductor company specializing in embedded processors, analog, and connectivity solutions before its acquisition by NXP in 2015.

The MPC8245 product line delivers highly integrated PowerPC-based system-on-chip solutions targeting cost-sensitive, thermally constrained embedded control applications where PCI interconnect and deterministic real-time performance are essential.

FAQ

What is the maximum validated core frequency for KMPC8245TZU350D?

The KMPC8245TZU350D is factory-tested and guaranteed to operate reliably at 350 MHz under specified conditions: VDD_CORE = 1.9 V ± 100 mV and die-junction temperature between –40°C and +105°C. This frequency is confirmed in Freescale document MPC8245ECS01AD Rev. 1.1 and supersedes earlier revisions of the MPC8245EC specification. Operation above 350 MHz is not characterized or supported for KMPC8245TZU350D.

Does KMPC8245TZU350D include an integrated Phase-Locked Loop (PLL)?

No, KMPC8245TZU350D does not contain an on-die PLL. It relies on an external 33 MHz clock source applied to the CLKIN pin, and all internal timing is derived directly from that reference without multiplication. This design choice simplifies power delivery and reduces jitter sensitivity but requires precise external clock generation - a requirement explicitly stated in the MPC8245EC hardware specification and confirmed for KMPC8245TZU350D in MPC8245ECS01AD.

What package type and lead finish does KMPC8245TZU350D use?

KMPC8245TZU350D uses a 324-pin Thin Ball Grid Array (TBGA) package designated "ZU", which specifies lead-free solder balls and complies with JEDEC MO-205AC. The "ZU" marking distinguishes it from the leaded "VV" variant (e.g., MPC8245TVV350D). This package requires SnAgCu reflow profiles and is incompatible with traditional tin-lead assembly processes without process validation.

Is KMPC8245TZU350D suitable for automotive applications?

KMPC8245TZU350D is not qualified for automotive applications. Its temperature range (–40°C to +105°C TJ) meets industrial standards but does not satisfy AEC-Q100 stress test requirements or automotive-specific failure mode analysis. Freescale did not release any AEC-qualified variants of the MPC8245 family, and KMPC8245TZU350D documentation explicitly excludes safety-critical automotive use cases such as powertrain or ADAS control.

What memory interfaces does KMPC8245TZU350D support?

KMPC8245TZU350D supports SDRAM (up to PC100 speed grade) and asynchronous SRAM via its integrated memory controller. It does not support DDR SDRAM, LPDDR, or NAND flash natively - those require external controllers or FPGA glue logic. The memory controller provides programmable timing registers for CAS latency, RAS-to-CAS delay, and refresh intervals, as documented in the MPC8245EC specification and validated for KMPC8245TZU350D in MPC8245ECS01AD.