NXP Semiconductors KMPC8250ACVVMHBC

Overview

KMPC8250ACVVMHBC from NXP (formerly Freescale) is a PowerQUICC II™ communications processor featuring a dual-issue EC603e-derived G2 core operating at 200 MHz, integrated Communications Processor Module (CPM), 60x bus (64-bit/66 MHz), PCI bridge (32-bit/66 MHz), and memory controller supporting SDRAM, SRAM, and Flash. It targets embedded networking and telecom infrastructure requiring deterministic protocol offload and multi-interface concurrency.

For engineers reviewing the KMPC8250ACVVMHBC datasheet, KMPC8250ACVVMHBC pinout, KMPC8250ACVVMHBC application, or KMPC8250ACVVMHBC equivalent, this page delivers verified electrical specs, validated TBGA-480 pin mapping, confirmed CPM peripheral support (FCC/SCC/SMC/TDM), thermal resistance data (θJA = 13°C/W), and real-world alternative part comparisons for migration or sourcing continuity.

Technical Context

The KMPC8250ACVVMHBC implements a split-clock architecture with independent PLLs for the G2 core (1.5:1–6:1 multiplier) and CPM (2:1–6:1), enabling asynchronous operation-e.g., 200 MHz core / 133 MHz CPM-for power/performance tuning. Its CPM executes protocol stacks (HDLC, Ethernet MII, UART, TDM) via dedicated RISC microcontroller and 32 KB dual-port RAM, decoupling real-time I/O from main CPU execution.

It supports three clock modes (Local Bus, PCI Host, PCI Agent) selected by PCI_MODE, PCI_CFG[0], and PCI_MODCK pins, with AC timing referenced to CLKIN rising edge and internal memory controller ticks (T1–T4) aligned to PLL ratio. The SIU provides JTAG test access, RTC, watchdog, and IEEE 1149.1-compliant boundary scan.

Key Specifications

Pinout & Package

KMPC8250ACVVMHBC is packaged in a 480-pin TBGA (Thin Ball Grid Array) with 25 × 25 mm body size, 1.0 mm ball pitch, and Pb-free (RoHS-compliant) finish. Thermal pad on underside requires solder paste stencil opening per JEDEC J-STD-020.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar communications processor applications.

Compared with KMPC8250ACVVMHBC, MPC8260AZUUHBC offers higher performance and I/O density but requires PCB rework, while MPC8360EVRAGDB shifts focus to modern networking/security at the cost of CPM-based telecom protocol support-making each suitable for distinct architectural paths.

Availability

KMPC8250ACVVMHBC is available at Aetrix Electronics and suitable for telecom access gateways, industrial protocol gateways, network-attached storage controllers, secure remote terminal units, and legacy PowerQUICC II upgrade programs requiring stable component supply across extended product lifecycles.

Supply support for KMPC8250ACVVMHBC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors (formerly Freescale Semiconductor) is a global leader in secure connectivity solutions for automotive, industrial, and IoT applications, with deep heritage in Power Architecture® processors and communications silicon.

The KMPC8250ACVVMHBC belongs to the PowerQUICC II family-designed specifically for cost-sensitive, high-reliability embedded networking equipment requiring integrated protocol offload, multi-interface concurrency, and long-term industrial temperature support (0°C to 70°C).

FAQ

What is the maximum operating frequency of the KMPC8250ACVVMHBC core?

The KMPC8250ACVVMHBC features a G2 core rated for up to 200 MHz under recommended operating conditions (VDD = 1.7–1.9 V, TA = 0–70°C). This is confirmed in Section 1 "Features" and Table 2 of the MPC8250EC Rev. 2 datasheet, where 200 MHz is explicitly listed as the upper limit for the 1.7–1.9 V core supply range. Higher frequencies (e.g., 233 MHz) require increased VDD (1.7–2.1 V) and are not supported by the KMPC8250ACVVMHBC ordering option.

Does the KMPC8250ACVVMHBC support PCI Express?

No, the KMPC8250ACVVMHBC does not support PCI Express. It integrates a PCI 2.2-compliant bridge operating at 32-bit/66 MHz/3.3 V, as documented in Section 1 "Features" and Section 5 "PCI bridge". PCI Express was introduced years after the MPC8250's 2003 launch, and no revision of the KMPC8250ACVVMHBC added PCIe capability. Designs requiring PCIe must migrate to newer families such as QorIQ or Layerscape.

What package type is used for the KMPC8250ACVVMHBC?

The KMPC8250ACVVMHBC uses a 480-pin TBGA (Thin Ball Grid Array) package, as specified in Section 4 "Pinout" and Section 5 "Package Description" of the MPC8250EC Rev. 2 datasheet. While the MPC8250 family also offered a PBGA-516 variant, the KMPC8250ACVVMHBC orderable part number maps exclusively to the TBGA-480 configuration-confirmed by Freescale's official ordering information (Section 6) and package drawings.

Can the KMPC8250ACVVMHBC operate with its CPU core disabled?

Yes, the KMPC8250ACVVMHBC supports CPU core disable mode, allowing it to function as a slave device controlled by an external processor. This is explicitly stated in Section 1 "Features": "CPU core can be disabled and the device can be used in slave mode to an external core." In this mode, the CPM remains fully operational for protocol handling, reducing active power consumption significantly-verified in Table 5 for low-power configurations.

What is the thermal resistance (θJA) of the KMPC8250ACVVMHBC in its standard package?

The KMPC8250ACVVMHBC in the TBGA-480 package has a junction-to-ambient thermal resistance (θJA) of 13°C/W under natural convection on a four-layer PCB, as published in Table 4 "Thermal Characteristics" of the MPC8250EC Rev. 2 datasheet. This value assumes proper thermal vias and ground/power planes-exceeding 3 W power dissipation at 70°C ambient requires heatsink implementation to maintain TJ ≤ 105°C.