NXP Semiconductors KMPC8250ACZUMHBC

Overview

KMPC8250ACZUMHBC from Freescale Semiconductor is a PowerQUICC II™ communications processor featuring a dual-issue EC603e-based G2 core operating at up to 200 MHz, integrated Communications Processor Module (CPM), 60x-to-PCI bridge, and memory controller supporting SDRAM, SRAM, and Flash. It delivers 280 Dhrystone MIPS at 200 MHz and supports IEEE 802.3 10/100-Mbit Ethernet via three FCCs with MII interfaces - used in telecom access equipment, industrial gateways, and legacy network infrastructure.

For engineers reviewing the KMPC8250ACZUMHBC datasheet, KMPC8250ACZUMHBC pinout, KMPC8250ACZUMHBC application, or KMPC8250ACZUMHBC equivalent, key selection criteria include its 480-pin TBGA package, 1.8 V core / 3.3 V I/O supply separation, dual PLL architecture enabling independent CPM/core clocking, and support for TDM, HDLC, UART, SPI, and I²C protocols across multiple serial controllers.

Technical Context

The KMPC8250ACZUMHBC implements a 32-bit PowerPC G2 core with separate 16-Kbyte four-way set-associative instruction and data caches, MMU, and FPU, coupled to a dedicated 32-bit RISC CPM with 32-Kbyte dual-port RAM. Its 64-bit 60x bus operates up to 133 MHz, while the local bus runs at 32-bit/66 MHz and the PCI interface complies with Revision 2.2 at 32-bit/66 MHz.

It integrates twelve-bank memory controller logic with glueless support for SDRAM, DRAM, EPROM, and Flash; four TDM interfaces handling ISDN, T1/E1, and Freescale IDL; and eight baud rate generators feeding FCCs, SCCs, and SMCs. Clock configuration is determined by MODCK[1–3] pins and MODCK_H bits during power-on reset.

Key Specifications

Pinout & Package

KMPC8250ACZUMHBC is housed in a 480-pin TBGA (Thin Ball Grid Array) package with 27 × 27 mm body size, 1.0 mm ball pitch, and JEDEC MO-251 compliant footprint. Thermal resistance θJA is 13 °C/W on single-layer board under natural convection.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar communications processor applications.

Compared with KMPC8250ACZUMHBC, MPC8260AZUUHBC offers higher compute headroom and cache bandwidth for complex routing stacks, while MPC8272CZQHBC adds cryptographic acceleration and secure boot - making it suitable for regulated environments where KMPC8250ACZUMHBC's base communications functionality is sufficient but lacks hardened security primitives.

Availability

KMPC8250ACZUMHBC is available at Aetrix Electronics and suitable for telecom access nodes, industrial protocol gateways, and legacy network routers requiring stable component supply and long-term lifecycle support.

Supply support for KMPC8250ACZUMHBC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processors, analog, and connectivity solutions for automotive, industrial, and networking markets.

KMPC8250ACZUMHBC belongs to the PowerQUICC II family - designed specifically for cost-sensitive, high-reliability communications infrastructure requiring integrated protocol offload, flexible memory interfacing, and long-lifecycle availability.

FAQ

What is the maximum operating frequency of the KMPC8250ACZUMHBC core?

The KMPC8250ACZUMHBC core is rated for a maximum operating frequency of 200 MHz. This is achieved using a 33 MHz or 66 MHz CLKIN signal with a 6:1 core PLL multiplier. At this speed, the device delivers 280 Dhrystone MIPS and supports real-time packet processing in telecom edge applications. The core voltage must be maintained between 1.7 V and 1.9 V for stable 200 MHz operation per the recommended conditions table.

Does KMPC8250ACZUMHBC support PCI Express or only PCI 2.2?

KMPC8250ACZUMHBC supports only PCI Specification Revision 2.2 - not PCI Express. Its integrated 32-bit PCI interface operates at 33 or 66 MHz with 3.3 V signaling and includes full host/agent capability, four DMA channels, and hot-swap compliance per PICMG 2.1. PCI Express was introduced years after the MPC8250's 2003 launch; no PCIe PHY or link layer is present in KMPC8250ACZUMHBC.

How many serial communication controllers does KMPC8250ACZUMHBC integrate?

KMPC8250ACZUMHBC integrates four Serial Communication Controllers (SCCs), two Serial Management Controllers (SMCs), three Fast Communication Controllers (FCCs), one SPI, and one I²C controller. Each SCC supports UART, HDLC, SDLC, BISYNC, and transparent modes; FCCs handle 10/100-Mbit Ethernet via MII; SMCs manage GCI/TDM links; and the CPM manages all serial data movement via dedicated DMA channels.

What package type is used for KMPC8250ACZUMHBC and what are its thermal characteristics?

KMPC8250ACZUMHBC uses a 480-pin TBGA (Thin Ball Grid Array) package with 27 × 27 mm body and 1.0 mm ball pitch. Its thermal resistance is θJA = 13 °C/W on a single-layer board under natural convection and θJA = 11 °C/W on a four-layer board. Junction-to-board resistance θJB is 4 °C/W, confirming effective heat transfer to the PCB - essential for fanless deployment in industrial enclosures.

Can KMPC8250ACZUMHBC operate with a 2.5 V core supply voltage?

No, KMPC8250ACZUMHBC cannot operate with a 2.5 V core supply. Its absolute maximum core supply voltage (VDD) is 2.5 V, but the recommended operating range is 1.7–1.9 V for frequencies ≤200 MHz. Exceeding 1.9 V risks accelerated electromigration and violates the DC electrical specifications - sustained operation above 1.9 V may cause functional failure or reduced lifetime, especially at elevated junction temperatures.