NXP Semiconductors KMPC8250AVVPIBC

Overview

KMPC8250AVVPIBC from Freescale Semiconductor is a PowerQUICC II™ communications processor featuring a dual-issue EC603e-based G2 core operating at 200 MHz, integrated Communications Processor Module (CPM), 60x bus (64-bit/66 MHz), PCI bridge (32-bit/66 MHz), and memory controller supporting SDRAM, SRAM, and Flash. It targets embedded networking and telecom infrastructure requiring deterministic real-time protocol handling.

For engineers reviewing the KMPC8250AVVPIBC datasheet, KMPC8250AVVPIBC pinout, KMPC8250AVVPIBC application, or KMPC8250AVVPIBC equivalent, key selection criteria include CPM-based serial protocol offload (FCC/SCC/SMC/TDM), dual PLL clocking for independent core/CPM frequency scaling, 1.8 V core / 3.3 V I/O supply separation, and TBGA-480 package compatibility with MPC8260 footprint.

Technical Context

The KMPC8250AVVPIBC implements a split-architecture design: a high-performance PowerPC G2 integer core with 16 KB instruction and 16 KB data caches, MMU, and FPU coexists with a dedicated 32-bit RISC CPM executing serial communications tasks via dual-port RAM and DMA. Core and CPM operate on separate PLLs, enabling independent clock ratios (e.g., 4:1 core, 3:1 CPM from 50 MHz input).

Its system interface unit (SIU) integrates clock synthesis, JTAG test access, RTC, watchdog, and reset control, while the memory controller supports glueless interfacing to SDRAM, SRAM, EPROM, and Flash across twelve banks with programmable timing and parity/ECC. The 60x-to-PCI bridge complies with PCI Spec 2.2 and enables streaming transfers in host or agent mode.

Key Specifications

Pinout & Package

The KMPC8250AVVPIBC is packaged in a 480-pin TBGA (Thin Ball Grid Array) with 1.0 mm ball pitch, designed for high-density routing and thermal performance in telecom line cards and industrial gateways.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar communications processor applications.

Compared with KMPC8250AVVPIBC, MPC8260AZUUPEA delivers higher deterministic throughput for protocol stacks but shares identical CPM peripheral set and TBGA-480 footprint; MPC8360EVRAGDB offers architectural modernization with DDR and SEC but requires PCB redesign due to different package and pinout.

Availability

KMPC8250AVVPIBC is available at Aetrix Electronics and suitable for DSLAM line cards, industrial protocol gateways, wireless base station controllers, and secure remote access appliances requiring stable component supply across extended product lifecycles.

Supply support for KMPC8250AVVPIBC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor was a leading designer of embedded processors, analog, and mixed-signal semiconductors before its acquisition by NXP Semiconductors in 2015.

The KMPC8250AVVPIBC belongs to the PowerQUICC II family, engineered specifically for cost-sensitive, high-reliability communications infrastructure where CPM offload relieves the main CPU of serial protocol processing.

FAQ

What is the maximum guaranteed operating frequency of the KMPC8250AVVPIBC?

The KMPC8250AVVPIBC is rated for a maximum core frequency of 200 MHz, as confirmed by Freescale's MPC8250 Hardware Specifications Rev. 2 (2009). This speed is achieved using a 50 MHz input clock with a 4:1 core PLL multiplier. Operation above 200 MHz is not supported or characterized for this specific ordering code, and attempting higher frequencies may result in timing violations or functional failure. The CPM subsystem supports up to 133 MHz independently.

Does the KMPC8250AVVPIBC support DDR SDRAM?

No, the KMPC8250AVVPIBC does not support DDR SDRAM. Its memory controller is designed exclusively for single-data-rate (SDR) SDRAM, SRAM, EPROM, Flash, and DRAM. The controller includes dedicated SDRAM interface logic for page-mode and pipeline operations but lacks DDR-specific signaling (e.g., differential clocks, DQS strobes, or DLL calibration). For DDR support, designers must migrate to PowerQUICC III devices such as the MPC8360E.

How many independent TDM interfaces does the KMPC8250AVVPIBC support?

The KMPC8250AVVPIBC supports up to four independent TDM interfaces via its MCC2 controller and integrated TDM routing logic. The 2048-byte SI RAM and bit/byte-resolution TDM channel assignment enable flexible mapping of ISDN PRI, E1, T1, or custom time-slot formats across all four interfaces simultaneously, with independent transmit/receive routing and frame synchronization per interface.

Is the KMPC8250AVVPIBC pin-compatible with the MPC8260 series?

Yes, the KMPC8250AVVPIBC is footprint-compatible with the MPC8260 in the 480-pin TBGA package. Freescale explicitly states "Footprint-compatible with the MPC8260" in the MPC8250 Hardware Specifications. This allows mechanical and layout reuse, though electrical and functional differences - such as higher MPC8260 core speeds, larger caches, and enhanced security features - require firmware and timing validation during migration.

What are the required supply voltage sequencing requirements for KMPC8250AVVPIBC?

KMPC8250AVVPIBC requires strict voltage tracking: VDD (core), VCCSYN (PLL), and VDDH (I/O) must ramp in the same direction within ±5% and ±0.1 VDC tolerance. VDDH must not exceed VDD/VCCSYN by more than 2.5 V during normal operation or 3.3 V for ≤100 ms during power-on reset. Violating these conditions risks latch-up or permanent damage. Bypassing with ≥four 0.1 µF capacitors near each package side is mandatory.