NXP Semiconductors KMPC8265AZUPJDC

Overview

KMPC8265AZUPJDC from NXP Semiconductors (formerly Freescale) is a PowerQUICC™ II integrated communications processor featuring a dual-issue EC603e core, 32-bit CPM coprocessor, and integrated 60x-to-PCI bridge. It operates at up to 300 MHz core frequency, supports 32-bit local bus (up to 83 MHz) and 32-bit PCI bus (66 MHz, 3.3 V), and integrates FCC/SCC/SMC serial controllers for Ethernet, HDLC, UART, and ATM UTOPIA interfaces. It targets telecom edge routers and multi-service access platforms.

For engineers reviewing the KMPC8265AZUPJDC datasheet, KMPC8265AZUPJDC pinout, KMPC8265AZUPJDC application, or KMPC8265AZUPJDC equivalent, this page delivers verified technical context on its dual-core architecture, PCI bridge compliance, CPM-based protocol offload, thermal limits (T_j ≤ 105°C), and 480-pin TBGA package - all critical for board-level integration and real-time communications firmware development.

Technical Context

The KMPC8265AZUPJDC implements a split-architecture design: a high-performance G2 core (PowerPC EC603e) handles general-purpose processing and OS execution, while the autonomous 32-bit RISC Communications Processor Module (CPM) manages time-critical serial protocols-including three Fast Communications Controllers (FCCs), four Serial Communications Controllers (SCCs), and two Serial Management Controllers (SMCs)-via 32 KB dual-port RAM and dedicated DMA channels.

It features separate PLLs for core and CPM clock domains, enabling independent frequency scaling (e.g., 300 MHz core / 166 MHz CPM); a 64-bit 60x bus with ECC/parity support; a PCI 2.2-compliant bridge with four DMA channels; and hardware TC-layer support for IMA over TDM-though TC-layer functionality is limited to MPC8264/MPC8266 variants, not KMPC8265AZUPJDC.

Key Specifications

Pinout & Package

Package: 480-ball TBGA (Thin Ball Grid Array), 27 mm × 27 mm, 1.27 mm pitch, RoHS-compliant. Thermal resistance θ_JA = 83°C/W (4-layer board, 1 m/s airflow).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications processor applications.

Compared with MPC8260AZUQJDC, KMPC8265AZUPJDC adds PCI connectivity and higher serial density but increases thermal load; versus MPC8266AZUPJDC, it omits TC-layer acceleration - making it optimal for Ethernet-centric edge routing where PCI expansion and dual-MCC flexibility outweigh pure ATM throughput needs.

Availability

KMPC8265AZUPJDC is available at Aetrix Electronics and suitable for telecom infrastructure, industrial networking, and embedded gateway applications requiring stable component supply, long-lifecycle support, and validated thermal performance up to 70°C ambient.

Supply support for KMPC8265AZUPJDC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep heritage in Power Architecture and communications processors.

The PowerQUICC™ II family, including KMPC8265AZUPJDC, was engineered for carrier-class edge networking equipment - integrating CPU, communications coprocessor, memory controller, and PCI bridge to reduce system complexity and accelerate time-to-market for multi-protocol gateways.

FAQ

What is the maximum operating frequency of the KMPC8265AZUPJDC core?

The KMPC8265AZUPJDC supports a maximum core frequency of 300 MHz, achievable with VDD = 1.9–2.2 V and junction temperature maintained ≤105°C. At 300 MHz, the device delivers ~1.90 Dhrystone MIPS/MHz and meets SPEC95 benchmarks of 6.6–7.65. This frequency is enabled by the HiP4 0.25 µm process and requires strict adherence to power supply tracking and thermal management guidelines specified in the MPC8260AEC datasheet.

Does the KMPC8265AZUPJDC include an integrated PCI bridge?

Yes, the KMPC8265AZUPJDC includes a fully integrated PCI 2.2-compliant bridge supporting 32-bit, 66 MHz, 3.3 V operation. It functions as either PCI host or peripheral, provides four dedicated DMA channels, and supports streaming transfers between PCI and 60x memory spaces. This capability is confirmed in the MPC8260AEC document and distinguishes KMPC8265AZUPJDC from MPC8260 variants lacking the bridge.

What serial communication protocols does the KMPC8265AZUPJDC support natively?

The KMPC8265AZUPJDC natively supports Ethernet (10/100 Mbit via MII), HDLC/SDLC, UART, BISYNC, transparent serial, ATM UTOPIA Level 1, and GCI/TDM through its integrated FCCs, SCCs, and SMCs. These are implemented in hardware by the CPM - no external protocol engines are required. The device does not support CAN, USB, or PCIe; those interfaces would require external controllers connected via PCI or local bus.

What is the package type and thermal resistance of the KMPC8265AZUPJDC?

The KMPC8265AZUPJDC uses a 480-ball TBGA package (27 mm × 27 mm, 1.27 mm pitch). Its thermal resistance is θ_JA = 83°C/W under 4-layer board conditions with 1 m/s airflow, and θ_JB = 4°C/W (junction-to-board). These values are documented in Table 4 of the MPC8260AEC specification and require adherence to recommended PCB layout practices - including thermal vias, power/ground planes, and localized bypass capacitors - to maintain T_j ≤ 105°C.

Is the KMPC8265AZUPJDC pin-compatible with other MPC826xA family members?

No, the KMPC8265AZUPJDC is not fully pin-compatible with other MPC826xA devices. While it shares the 480-ball TBGA footprint with MPC8266AZUPJDC, differences in pin function allocation - particularly for FCC3, MCC2, and TC-layer signals - prevent drop-in replacement. MPC8260AZUQJDC uses a different 256-pin PBGA package and is physically incompatible. Board-level redesign is required when substituting across family members.