NXP Semiconductors KMPC8275CVRMIBA

Overview

KMPC8275CVRMIBA from Freescale Semiconductor is a PowerQUICC II integrated communications processor featuring a dual-issue G2_LE core, 16 KB I-Cache and 16 KB D-Cache, three Fast Communication Controllers (FCCs), four Serial Communications Controllers (SCCs), PCI bridge, USB 2.0 controller, and integrated memory controller - deployed in telecom edge routers for multi-protocol packet forwarding.

For engineers reviewing the KMPC8275CVRMIBA datasheet, KMPC8275CVRMIBA pinout, KMPC8275CVRMIBA application, or KMPC8275CVRMIBA equivalent, this page delivers verified package mapping (516-pin PBGA, lead-free VR package), confirmed clocking architecture (dual PLLs for core/CPM), validated thermal resistance (RθJA = 27°C/W on single-layer board), and real-world interface timing (FCC internal-clock output delay ≤5.5 ns at 83 MHz).

Technical Context

The KMPC8275CVRMIBA implements a 32-bit Power Architecture® G2_LE core with separate 16 KB instruction and data caches, physically addressed and four-way set associative, coupled to a dedicated 32 KB dual-port CPM RAM for protocol offload. Its dual PLL architecture enables independent core (166–450 MHz) and CPM (up to 292 MHz) frequency scaling.

It integrates three FCCs supporting 10/100-Mbit Ethernet via MII/RMII, ATM over UTOPIA II (2 ports), HDLC up to T3 rates, and transparent modes; plus four SCCs compatible with UART, HDLC, SDLC, BISYNC, and synchronous serial protocols - all managed by a RISC-based communications processor within the CPM.

Key Specifications

Pinout & Package

KMPC8275CVRMIBA is housed in a 516-ball plastic ball grid array (PBGA), VR package type - lead-free, RoHS-compliant, with 27 mm × 27 mm body size and 1.27 mm ball pitch. Thermal resistance: RθJA = 27°C/W (single-layer board, natural convection).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications processor applications.

Compared with MPC8275VRMIBA, KMPC8275CVRMIBA ensures full revision-controlled documentation traceability; compared with MPC8280VRMIBA, it delivers identical FCC/SCC/PCI/USB performance at lower thermal load and reduced PCB layer count - critical for compact fanless industrial enclosures.

Availability

KMPC8275CVRMIBA is available at Aetrix Electronics and suitable for telecom infrastructure, industrial protocol gateways, and embedded VoIP systems requiring stable component supply across extended product lifecycles.

Supply support for KMPC8275CVRMIBA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors since 2015) was a fabless semiconductor company specializing in embedded processors, analog, and connectivity solutions for automotive, industrial, and networking markets.

KMPC8275CVRMIBA belongs to the PowerQUICC II family - designed specifically for cost-sensitive, high-throughput communications edge devices requiring integrated protocol acceleration, multi-interface concurrency, and deterministic real-time response.

FAQ

What is the maximum operating frequency of the KMPC8275CVRMIBA core?

The KMPC8275CVRMIBA supports a maximum core frequency of 450 MHz, achieved using an 8:1 internal clock multiplier with a 56.25 MHz CLKIN reference. This is confirmed in Section 1.1 "Features" and Table 7 of the MPC8280EC Rev. 2 datasheet, which lists 450 MHz under CPU (MHz) column for 100 MHz bus configurations. The G2_LE core maintains full SPEC95 and Dhrystone performance at this speed.

Does the KMPC8275CVRMIBA support USB 2.0 device mode?

Yes, the KMPC8275CVRMIBA supports USB 2.0 full/low-speed device (slave) mode with four independent endpoints, CRC16/CRC5 checking, NRZI encoding/decoding, and automatic retransmission on transmit error - as specified in Section 1.1 "Universal serial bus (USB) controller". It does not support USB host mode beyond the documented full/low-rate capability.

What package type is used for the KMPC8275CVRMIBA?

KMPC8275CVRMIBA uses the VR package: a 516-ball lead-free plastic BGA with 27 mm × 27 mm body size and 1.27 mm ball pitch, as defined in Table 2 of the MPC8280EC Rev. 2 document. This matches the MPC8275VR designation and is distinct from the ZU/ZQ (480 TBGA) and VV packages.

How many TDM interfaces does the KMPC8275CVRMIBA support?

The KMPC8275CVRMIBA supports eight TDM interfaces - implemented as two groups of four TDM channels each, enabled by its dual multichannel controllers (MCC1 and MCC2). This is explicitly stated in the Overview section (page 7) and distinguishes it from the MPC8270, which supports only four TDM interfaces.

Is the KMPC8275CVRMIBA pin-compatible with the MPC8280?

No, KMPC8275CVRMIBA is not pin-compatible with the MPC8280. Although both use the 516 PBGA VR package, the MPC8280 requires additional pins for its TC layer, IMA engine, and second MCC - resulting in different pin assignments and signal allocations. Table 2 confirms MPC8280 and MPC8275VR are separate device entries, and Figure 1 notes TC-layer hardware is "MPC8280 only".