NXP Semiconductors KMPC8275CZQMIBA

Overview

KMPC8275CZQMIBA from NXP Semiconductors (formerly Freescale) is a PowerQUICC II integrated communications processor featuring a dual-issue G2_LE Power Architecture core, three Fast Communication Controllers (FCCs), four Serial Communications Controllers (SCCs), and PCI bridge functionality. It operates at up to 450 MHz with 16 KB instruction and data caches, supports 10/100 Ethernet via MII/RMII, and targets telecom edge routers and industrial gateways requiring deterministic real-time packet processing.

For engineers reviewing the KMPC8275CZQMIBA datasheet, KMPC8275CZQMIBA pinout, KMPC8275CZQMIBA application, or KMPC8275CZQMIBA equivalent, key selection criteria include FCC/SCC protocol support (HDLC, UART, transparent), PCI host/peripheral mode operation, 516-pin PBGA lead-free packaging, thermal resistance (RθJA = 19°C/W on 4-layer board), and dual-voltage supply requirements (VDD = 1.45–1.60 V, VDDH = 3.135–3.465 V).

Technical Context

The KMPC8275CZQMIBA integrates a G2_LE core with separate PLLs for CPU and CPM domains, enabling independent clock scaling (e.g., 450 MHz core / 233 MHz CPM). Its communication subsystem includes three FCCs supporting 10/100-Mbit Ethernet, ATM over UTOPIA II (2 ports), and HDLC up to T3 rates, plus four SCCs compatible with MPC860 protocols including UART, SDLC, and BISYNC.

Memory subsystem comprises a 64-bit 60x bus (up to 100 MHz), 32-bit local bus (up to 100 MHz), and on-chip memory controller supporting SDRAM, SRAM, Flash, and EPROM with ECC/parity. The device implements a 32-bit RISC microcontroller-based Communication Processor Module (CPM) with 32 KB dual-port RAM/ROM, virtual DMA, and eight TDM interfaces-four per MCC, with one MCC active in this variant.

Key Specifications

Pinout & Package

KMPC8275CZQMIBA uses a 516-ball plastic ball grid array (PBGA) package with ZQ designation, lead-free construction, and 1.0 mm ball pitch. The package supports thermal dissipation through solder balls to PCB ground plane and requires strict decoupling: 0.1 µF per VDD/VDDH pin plus bulk 47 µF capacitors.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications processor applications.

Compared with KMPC8275CZQMIBA, MPC8280CZQMIBA adds ATM-specific hardware at higher power and cost, while MPC8270CZUMIBA sacrifices TDM/UTOPIA capability for smaller size and simpler thermal design - selection depends strictly on whether second MCC or UTOPIA II ports are required in the target system.

Availability

KMPC8275CZQMIBA is available at Aetrix Electronics and suitable for telecom edge routers, industrial protocol gateways, secure remote access terminals, and VoIP media gateways requiring stable component supply across extended product lifecycles.

Supply support for KMPC8275CZQMIBA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, specializing in secure connectivity, automotive, and industrial processing solutions.

KMPC8275CZQMIBA belongs to the PowerQUICC II family designed specifically for embedded communications infrastructure - balancing real-time protocol offload, deterministic I/O, and Linux-capable application processing in space-constrained platforms.

FAQ

What is the maximum operating frequency of the KMPC8275CZQMIBA core?

The KMPC8275CZQMIBA supports a maximum core frequency of 450 MHz using its G2_LE Power Architecture core. This is achieved via internal PLL multiplication ratios up to 8:1 from the CLKIN input. At 450 MHz, the device delivers 855 Dhrystone MIPS performance and meets SPEC95 benchmarks. Operation above 450 MHz is not supported and violates absolute maximum ratings.

Does KMPC8275CZQMIBA support USB 2.0 functionality?

No, KMPC8275CZQMIBA does not include USB 2.0 controller hardware. While the MPC8280 variant in the same family integrates a USB 2.0 full/low-speed controller, the KMPC8275CZQMIBA omits this block entirely. Its peripheral set includes FCCs, SCCs, PCI, TDM, and I²C/SPI - but no USB PHY or controller logic. USB connectivity requires external silicon.

What package type and pin count does KMPC8275CZQMIBA use?

KMPC8275CZQMIBA uses a 516-ball plastic ball grid array (PBGA) package with ZQ designation, lead-free construction, and 1.0 mm ball pitch. This matches the VR package variant described in Freescale documentation. The ZQ package differs from the ZU/VV 480-TBGA variants by ball count, thermal pad configuration, and mechanical dimensions - PCB layout is not interchangeable.

Can KMPC8275CZQMIBA operate in slave mode to an external processor?

Yes, KMPC8275CZQMIBA supports slave mode operation. Its CPU core can be disabled via configuration bits, allowing the device to function solely as a communications coprocessor controlled by an external master over the 60x bus. In this mode, the CPM remains fully operational for protocol handling, and memory-mapped peripherals remain accessible - enabling hybrid architectures with dedicated application and comms processors.

What are the critical power supply sequencing requirements for KMPC8275CZQMIBA?

KMPC8275CZQMIBA requires strict power supply sequencing: VDD and VCCSYN must ramp before or simultaneously with VDDH during power-on reset, and must not exceed VDDH by more than 0.4 V during normal operation. VDDH may exceed VDD by up to 3.3 V only for ≤100 ms during power-on. Violating these conditions risks latch-up or permanent damage to I/O circuitry.