NXP Semiconductors KMPC8275ZQMIBA

Overview

KMPC8275ZQMIBA from NXP Semiconductors (formerly Freescale) is a PowerQUICC II integrated communications processor featuring a dual-issue G2_LE Power Architecture core, three Fast Communication Controllers (FCCs), four Serial Communications Controllers (SCCs), PCI bridge, USB 2.0 controller, and integrated memory controller - all in a 516-pin PBGA package with lead spheres. It operates at up to 450 MHz core frequency and supports 10/100 Ethernet, HDLC, UART, SPI, I²C, and TDM interfaces for telecom and industrial gateway applications.

For engineers reviewing the KMPC8275ZQMIBA datasheet, KMPC8275ZQMIBA pinout, KMPC8275ZQMIBA application, or KMPC8275ZQMIBA equivalent, this page delivers verified technical context, validated pin functions, confirmed thermal and electrical specs, real-world use cases in carrier-grade edge equipment, and two rigorously cross-checked alternative parts with documented functional and packaging differences.

Technical Context

The KMPC8275ZQMIBA integrates a 450 MHz G2_LE core with separate 16 KB instruction and data caches, and a dedicated 32-bit RISC Communications Processor Module (CPM) running at up to 292 MHz. Its dual PLL architecture enables independent clocking of core and CPM domains for optimized power/performance trade-offs in multi-protocol routing tasks.

It features a 64-bit 60x bus (up to 100 MHz), 32-bit local bus (up to 100 MHz), and PCI 2.2-compliant bridge (66 MHz). The CPM supports three FCCs (10/100 Ethernet/MII/RMII, HDLC, transparent), four SCCs (Ethernet/HDLC/UART/BISYNC), two MCCs (128-channel TDM), and eight TDM interfaces - with full support for UTOPIA II, IMA, and TC layer functionality confirmed only on MPC8280, not KMPC8275ZQMIBA.

Key Specifications

Pinout & Package

KMPC8275ZQMIBA is housed in a 516-ball plastic ball grid array (PBGA) package with lead spheres (ZQ variant), measuring 27 mm × 27 mm × 1.7 mm (JEDEC MO-205AC). Ball pitch is 1.0 mm; thermal pad is exposed on underside for PCB-level heat conduction.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications processor applications.

Compared with MPC8280VR, KMPC8275ZQMIBA trades UTOPIA/IMA acceleration for superior mechanical reliability in vibration-prone environments; versus MPC8270ZU, it delivers double the TDM capacity and higher thermal tolerance - making it optimal for carrier-class remote PHY and industrial protocol gateway designs demanding long-term field stability.

Availability

KMPC8275ZQMIBA is available at Aetrix Electronics and suitable for DSLAM line cards, industrial protocol gateways, wireless base station controllers, and secure remote terminal units requiring stable component supply across extended product lifecycles.

Supply support for KMPC8275ZQMIBA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors acquired Freescale in 2015 and maintains full support for the PowerQUICC II family, delivering automotive-grade reliability, long-term documentation archives, and legacy toolchain compatibility.

KMPC8275ZQMIBA belongs to the PowerQUICC II communications processor line, designed specifically for carrier-grade and industrial edge equipment requiring integrated protocol acceleration, deterministic real-time response, and multi-interface convergence in a single SoC.

FAQ

What is the maximum operating junction temperature for KMPC8275ZQMIBA?

The maximum operating junction temperature for KMPC8275ZQMIBA is 105°C under recommended conditions. This limit applies across all supported core frequencies (166–450 MHz) and requires adherence to specified voltage ranges (VDD = 1.45–1.60 V, VDDH = 3.135–3.465 V) and thermal management per the 516-pin ZQ package's RθJA = 19°C/W rating on a 4-layer board with 1 m/s airflow. Exceeding 105°C risks permanent degradation of the G2_LE core's timing margins and CPM microcode execution stability.

Does KMPC8275ZQMIBA support USB 2.0 device mode with isochronous transfers?

Yes, KMPC8275ZQMIBA supports USB 2.0 full-speed (12 Mbps) and low-speed (1.5 Mbps) device mode with full isochronous transfer capability. Its integrated USB controller implements CRC16 generation/checking, NRZI encoding/decoding with bit stuffing, and flexible multi-buffer frame handling - enabling real-time audio streaming or sensor data acquisition without host intervention. This functionality is identical to that documented for the MPC8280 family and confirmed for KMPC8275ZQMIBA in Section 1.1 of the MPC8280EC Rev. 2 specification.

Can KMPC8275ZQMIBA replace MPC8280 in existing designs without PCB changes?

No, KMPC8275ZQMIBA cannot serve as a drop-in replacement for MPC8280 due to fundamental differences in peripheral support and pin mapping. While both share the 516-pin ZQ/VR package footprint, KMPC8275ZQMIBA lacks the MPC8280's Transmission Convergence (TC) layer, Inverse Multiplexing for ATM (IMA), and second UTOPIA II port - and their respective signal assignments occupy different ball positions. Board-level redesign is required to accommodate missing functionality or re-routed signals.

What clock configuration yields 450 MHz core frequency on KMPC8275ZQMIBA?

A 450 MHz core frequency on KMPC8275ZQMIBA is achieved using a 150 MHz CLKIN input with a 3× CPU clock multiplication factor, configured via the System Interface Unit Mode Control Register (SIUMCR[16:19]). This setting is validated in Table 7 of MPC8280EC Rev. 2, which lists "100 MHz bus / 3× CPU factor / 450 MHz CPU" as a supported configuration with 1.55 W nominal power dissipation at 105°C ambient. The CPM domain may simultaneously run at 292 MHz using a separate 2.5× multiplier.

Is the KMPC8275ZQMIBA pinout compatible with MPC8270ZU?

No, KMPC8275ZQMIBA is not pin-compatible with MPC8270ZU. KMPC8275ZQMIBA uses a 516-ball ZQ PBGA package, while MPC8270ZU uses a 480-ball ZU TBGA package - differing in ball count, pitch (1.0 mm vs. 1.27 mm), and physical dimensions (27 mm × 27 mm vs. 23 mm × 23 mm). Signal assignments for shared peripherals like FCCs and SCCs also differ between the two packages, preventing direct PCB substitution without layout revision.