NXP Semiconductors KMPC8280CVVUPEA

Overview

KMPC8280CVVUPEA from Freescale Semiconductor is a PowerQUICC II family integrated communications processor featuring a dual-issue G2_LE core (Power Architecture®-compliant), 16 KB instruction and 16 KB data caches, three Fast Communication Controllers (FCCs), four Serial Communications Controllers (SCCs), two UTOPIA II ports, two Multichannel Controllers (MCCs), PCI bridge (v2.2), USB 2.0 full/low-speed controller, and Transmission Convergence (TC) layer - deployed in carrier-grade TDM/E1/T3, ATM edge, and IMA-based access gateways.

For engineers reviewing the KMPC8280CVVUPEA datasheet, KMPC8280CVVUPEA pinout, KMPC8280CVVUPEA application, or KMPC8280CVVUPEA equivalent, this page delivers verified package mapping (480-pin TBGA, lead-free VV), confirmed clocking architecture (dual PLLs for core/CPM), validated thermal resistance (RθJA = 11°C/W natural convection, 4-layer board), real-world power dissipation (1.55 W nominal at 450 MHz CPU / 100 MHz bus), and precise functional differentiation versus MPC8270/MPC8275 variants.

Technical Context

The KMPC8280CVVUPEA integrates a 32-bit G2_LE microprocessor core with separate 16 KB I-cache and D-cache, physically addressed and four-way set associative, coupled to a dedicated 32 KB dual-port CPM RAM and instruction RAM. Its communication subsystem includes three FCCs supporting 10/100-Mbit Ethernet (MII/RMII), ATM SAR (155 Mbps via UTOPIA II), HDLC up to T3, and transparent modes - with FCC2 uniquely connected to the TC layer for IMA processing.

It implements dual independent PLLs: one for the G2_LE core (2:1 to 8:1 multiplication ratios) and one for the CPM (2:1 to 8:1), enabling asynchronous operation at up to 450 MHz core and 292 MHz CPM frequencies. The device supports 64-bit 60x bus (up to 100 MHz), 32-bit local bus (up to 100 MHz), and PCI v2.2 (32-bit, 66 MHz), with on-chip arbitration, DMA, and address remapping - all within a single 480-pin TBGA package.

Key Specifications

Pinout & Package

Package: 480-pin Thin Ball Grid Array (TBGA), lead-free VV variant (RoHS-compliant, 27 mm × 27 mm, 1.0 mm ball pitch). Thermal resistance: RθJA = 11°C/W (natural convection, 4-layer board), RθJB = 6°C/W, ΨJT = 2°C/W.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications processor applications.

Compared with MPC8275VR and MPC8270ZU, KMPC8280CVVUPEA uniquely integrates TC layer hardware and IMA engine - enabling single-chip ATM cell reassembly across eight TDM links - while retaining full backward compatibility with MPC8270/8275 software and toolchains.

Availability

KMPC8280CVVUPEA is available at Aetrix Electronics and suitable for carrier-grade DSLAM line cards, ATM edge routers, VoIP gateways, and industrial TDM multiplexers requiring stable component supply across extended product lifecycles.

Supply support for KMPC8280CVVUPEA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) was a leading designer of embedded processors and analog/mixed-signal ICs for networking, automotive, and industrial applications until its acquisition in 2015.

KMPC8280CVVUPEA belongs to the PowerQUICC II family - engineered specifically for carrier-class communications infrastructure requiring deterministic real-time processing, multi-protocol TDM/Ethernet/ATM convergence, and long-term industrial availability.

FAQ

What is the maximum operating frequency of the KMPC8280CVVUPEA CPU core?

The KMPC8280CVVUPEA CPU core operates at up to 450 MHz, achieved via its internal core PLL with selectable multiplication ratios (2:1 to 8:1) applied to a 33–100 MHz CLKIN source. This maximum frequency is validated under recommended operating conditions (VDD = 1.45–1.60 V, TA = 0–70°C, junction temperature ≤105°C) and requires appropriate thermal management per the 11°C/W RθJA rating on a 4-layer board.

Does KMPC8280CVVUPEA support USB 2.0 device mode with full-speed operation?

Yes, KMPC8280CVVUPEA supports USB 2.0 full-speed (12 Mbps) and low-speed (1.5 Mbps) operation in both host and slave modes. In slave mode, it provides four independent endpoints with control/bulk/interrupt/isochronous transfer support, CRC16/CRC5 checking, NRZI encoding/decoding, and automatic retransmission on transmit error - enabling reliable firmware updates and peripheral attachment without external USB PHY.

How many TDM interfaces does KMPC8280CVVUPEA support, and what protocols are covered?

KMPC8280CVVUPEA supports eight TDM interfaces (two groups of four), implemented via its dual SI blocks and 2048-byte SI RAM. It natively handles T1, E1, T3, E3, PCM highway, ISDN basic/primary rate, Freescale IDL, GCI, and user-defined TDM serial interfaces - with bit- or byte-resolution, independent TX/RX routing, and frame synchronization - making it suitable for carrier VoIP and SCADA multiplexing.

Is KMPC8280CVVUPEA pin-compatible with MPC8275 or MPC8270 packages?

No, KMPC8280CVVUPEA in the VV package (480-pin TBGA, lead-free) is not pin-compatible with MPC8275VR or MPC8270ZU (516-pin PBGA). While electrical and software compatibility exists across the PowerQUICC II family, the 480-pin VV footprint differs mechanically and electrically from the 516-pin VR/ZQ packages - requiring distinct PCB layouts and power delivery networks.

What thermal management is required for KMPC8280CVVUPEA at 450 MHz operation?

At 450 MHz CPU frequency and 100 MHz bus speed, KMPC8280CVVUPEA dissipates up to 1.65 W (maximum). With RθJA = 11°C/W (natural convection, 4-layer board), ambient temperature must be limited to ≤94°C to maintain junction temperature ≤105°C. Recommended practices include 0.1 µF bypass capacitors on every VDD/VDDH pin, 47 µF bulk capacitance per supply, and thermal vias under the package to ground plane.