NXP Semiconductors KMPC8560VT833LB

Overview

KMPC8560VT833LB from NXP (formerly Freescale) is a PowerQUICC III integrated communications processor featuring an e500 core, 256 KB L2 cache/SRAM, dual 10/100/1000 Mbps Ethernet controllers (TSECs), DDR-1 SDRAM controller (64-bit, up to 333 MHz), PCI/PCI-X (64-bit, up to 133 MHz), and 8-bit RapidIO interface - deployed in carrier-grade networking infrastructure, wireless baseband units, and telecom control plane systems.

For engineers reviewing the KMPC8560VT833LB datasheet, KMPC8560VT833LB pinout, KMPC8560VT833LB application, or KMPC8560VT833LB equivalent, this page delivers verified electrical specs (1.2 V core, 2.5 V DDR I/O, 3.3 V peripheral I/O), thermal limits (0–105 °C junction), clocking constraints (SYSCLK ≤ 166 MHz), and functional partitioning across CPM, OCeaN switch, and DMA subsystems - critical for board-level timing closure, power rail sequencing, and multi-protocol coexistence validation.

Technical Context

The KMPC8560VT833LB implements a Book E–enhanced 32-bit e500 core with 32 KB L1 instruction and 32 KB L1 data caches (parity-protected), MMU optimized for embedded real-time OS environments, and performance monitor facility supporting 8 configurable 32-bit counters. Its CPM operates at up to 333 MHz and handles serial protocols including HDLC, ATM via UTOPIA, and TDM multiplexing across eight interfaces.

System-level integration includes a 256 KB L2 cache/SRAM configurable as full cache, full SRAM, or split mode (128 KB each) with full ECC on 64-bit boundaries; DDR-1 controller supporting four banks up to 1 Gbyte each, registered DIMMs, and auto-refresh; and OCeaN four-port crossbar switch enabling priority-based packet reordering with up to 256-byte payloads.

Key Specifications

Pinout & Package

KMPC8560VT833LB uses a 783-ball Fine-Pitch Ceramic Pin Grid Array (FC-PBGA) package with 35 × 35 mm body size, 1.0 mm ball pitch, and exposed thermal pad. Ball map follows Freescale MPC8560EC Rev. 4.2, Section 14 "Package and Pin Listings" - full pinout validated against official documentation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications processor applications.

Compared with KMPC8560VT833LB, MPC8569EVT833IB extends functionality with security and storage peripherals but requires layout revision, while LS1023A shifts architecture to ARM with software-defined packet processing - making KMPC8560VT833LB optimal for maintaining legacy CPM-based protocol stacks without silicon redesign.

Availability

KMPC8560VT833LB is available at Aetrix Electronics and suitable for carrier-grade networking infrastructure, telecom signaling gateways, and industrial protocol converters requiring stable component supply across extended product lifecycles.

Supply support for KMPC8560VT833LB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors develops high-performance processing solutions for automotive, industrial, and communications markets, with heritage from Freescale's PowerQUICC portfolio.

KMPC8560VT833LB belongs to the PowerQUICC III family - designed specifically for embedded communications infrastructure requiring integrated protocol acceleration, multi-interface concurrency, and deterministic real-time operation.

FAQ

What is the maximum operating temperature for KMPC8560VT833LB?

The KMPC8560VT833LB has a specified die-junction temperature range of 0 to 105 °C. This limit applies under recommended operating conditions: VDD = 1.2 V ±60 mV, GVDD = 2.5 V ±125 mV, OVDD = 3.3 V ±165 mV, and proper thermal management per Freescale's MPC8560EC Rev. 4.2 thermal guidelines. Exceeding 105 °C risks permanent damage or functional failure.

Does KMPC8560VT833LB support DDR2 memory?

No, KMPC8560VT833LB supports DDR-1 SDRAM only, as confirmed in Section 6 "DDR SDRAM" of the MPC8560EC Rev. 4.2 specification. It does not include DDR2 timing logic, voltage tolerance (1.8 V), or command encoding. Attempting DDR2 operation will result in initialization failure or data corruption.

What clock frequencies are required for KMPC8560VT833LB operation?

KMPC8560VT833LB requires three primary clocks: SYSCLK (up to 166 MHz, single-ended CMOS), EC_GTX_CLK125 (125 MHz for TSEC gigabit PHY), and RIO_TX_CLK_IN (125 MHz for RapidIO). All must meet jitter (±150 ps), duty cycle (40–60% for SYSCLK), and voltage threshold specifications per Sections 4.1–4.3 of the hardware spec.

Is KMPC8560VT833LB pin-compatible with other MPC8560 speed grades?

Yes, KMPC8560VT833LB shares identical 783-ball FC-PBGA pinout and signal assignment with other MPC8560 variants (e.g., KMPC8560VT667LB, KMPC8560VT1000LB), as documented in Section 14 of MPC8560EC Rev. 4.2. Speed grade differences affect internal PLL ratios and power delivery requirements, not pin function or layout.

How is boot configuration handled on KMPC8560VT833LB?

KMPC8560VT833LB uses an on-chip boot sequencer that loads configuration data from external serial ROM via the I2C interface at reset. Data integrity is verified using a preamble signature and CRC check. Configuration registers and memory initialization are performed automatically before core execution begins.