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NXP Semiconductors KMPC8560VT833LC

Part No.:
KMPC8560VT833LC
Manufacturer:
NXP Semiconductors
Category:
Microprocessors
Package:
783-BFBGA, FCBGA
Datasheet:
AetrixKMPC8560VT833LC.pdf
Description:
IC MPU MPC85XX 833MHZ 783FCPBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,773

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Product details

Overview

KMPC8560VT833LC from NXP (formerly Freescale) is a PowerQUICC III integrated communications processor featuring an e500v2 32-bit Power Architecture core, 256 KB on-chip L2 cache/SRAM, dual 10/100/1000 Mbps Ethernet controllers (TSEC), DDR-1 SDRAM controller (64-bit, up to 333 MHz data rate), and integrated RapidIO (8-bit, 500 MHz DDR), PCI/PCI-X (64-bit, up to 133 MHz), and CPM subsystems - deployed in carrier-grade wireless baseband units, enterprise routers, and telecom line cards.

For engineers reviewing the KMPC8560VT833LC datasheet, KMPC8560VT833LC pinout, KMPC8560VT833LC application, or KMPC8560VT833LC equivalent, key selection considerations include its 833 MHz core frequency, 1.2 V core supply with 2.5 V/3.3 V I/O domains, 783-pin FC-PBGA package, support for ECC on DDR and L2 memory, and hardware-accelerated communication protocols including HDLC, ATM/UTOPIA, and IEEE 802.3z/ab.

Technical Context

The KMPC8560VT833LC implements a dual-bus architecture: a high-speed Core Complex Bus (CCB) interconnecting the e500 core, L1 caches (32 KB I-cache + 32 KB D-cache with parity), MMU, and 256 KB configurable L2 cache/SRAM; and a peripheral bus domain managed by the Communications Processor Module (CPM) running at up to 333 MHz, handling serial protocols (FCC/SCC/MCC), I²C, SPI, and local bus control. The CPM communicates with the e500 core via 32 KB dual-port RAM and virtual DMA channels.

Its clocking system uses a platform PLL to derive SYSCLK (up to 166 MHz), CCB clock (833 MHz), and core clock (833 MHz) from a single input reference; DDR timing is programmable for 2.5 V SSTL2-compliant interfaces; and RapidIO employs LVDS signaling with source-synchronous DDR timing at 500 MHz data rate. All major I/O domains (GVDD, LVDD, OVDD) are independently powered and sequenced.

Key Specifications

Parameter Value and Actual Design Meaning
Core Frequency833 MHz - Enables real-time packet processing at OC-48/STM-16 line rates in telecom infrastructure.
L1 Cache32 KB instruction + 32 KB data with parity - Reduces latency for critical firmware and protocol stack execution.
L2 Memory256 KB configurable as cache, SRAM, or split mode - Supports deterministic buffer management for multi-channel HDLC/TDM traffic.
DDR Interface64-bit, 2.5 V SSTL2, up to 333 MHz data rate - Interfaces with standard DDR-1 SDRAM modules for large packet buffering.
Ethernet ControllersDual TSEC supporting 10/100/1000 Mbps with GMII/RGMII/TBI/RTBI - Enables dual-port gigabit switching or routing without external PHY bridging.
RapidIO8-bit LVDS, 500 MHz DDR, 16 Gb/s aggregate bandwidth - Provides low-latency chip-to-chip interconnect for distributed baseband processing.
PCI/PCI-X64-bit, up to 133 MHz (PCI-X 1.0), 3.3 V compatible - Allows direct attachment to host processors or legacy I/O expansion cards.
Package783-pin Fine-Pitch Ceramic Ball Grid Array (FC-PBGA), 27 mm × 27 mm - Matches industry-standard thermal and mechanical requirements for telecom modules.

Pinout & Package

KMPC8560VT833LC is housed in a 783-pin FC-PBGA package (27 mm × 27 mm, 1.0 mm ball pitch) with thermal lid and exposed thermal pad. Pin assignments follow Freescale MPC8560EC Rev. 4.2 documentation, with dedicated power/ground banks per I/O domain (GVDD/LVDD/OVDD), differential clock inputs (SYSCLK, EC_GTX_CLK125, RIO_TX_CLK_IN), and function-grouped signal balls (e.g., DDR_A[14:0], DDR_DQ[63:0], TSEC0_TXD[7:0]).

Pin/Terminal Circuit Role Design Meaning
VDD (Pins A1–A4, B1–B4, etc.)Core supply (1.2 V)Must be ramped before I/O supplies; decoupling required within 10 mm of each group.
GVDD (Pins E1–E5, F1–F5, etc.)DDR I/O supply (2.5 V)Powers DDR address/data/control pins; requires separate 2.5 V regulator and MVREF = GVDD/2 reference.
LVDD (Pins J1–J5, K1–K5, etc.)TSEC I/O supply (2.5 V or 3.3 V)Selectable per design; determines GMII/TBI/RGMII voltage compliance and drive strength.
OVDD (Pins M1–M5, N1–N5, etc.)General-purpose I/O supply (3.3 V)Powers CPM, PCI, Local Bus, JTAG, I²C, and UART signals; supports CMOS-level thresholds.
SYSCLK (Pins T1, T2)System clock inputDifferential-capable single-ended input; 166 MHz max; jitter ≤ ±150 ps RMS for stable CCB lock.
DDR_DQ[63:0] (Pins U1–W20, Y1–AA10)DDR data bus64-bit bidirectional interface with full ECC support; requires controlled-impedance routing and length-matching.
TSEC0_TXD[7:0] (Pins AB1–AB8)Gigabit Ethernet transmit dataPart of RGMII/RTBI interface; must meet setup/hold relative to EC_GTX_CLK125 (125 MHz).
RIO_TX_P/N[7:0] (Pins AC1–AC8, AD1–AD8)RapidIO transmit differential pairsLVDS outputs; require 100 Ω differential termination and strict skew control (< 50 ps).

Key Features

Feature Design Value
Configurable L2 memory256 KB can be partitioned as full cache, full SRAM, or 128 KB each - enables flexible trade-off between instruction/data caching and deterministic packet buffer allocation.
ECC protectionFull ECC on DDR interface and L2 memory (64-bit boundary) - prevents silent data corruption in mission-critical telecom control plane applications.
CPM subsystem333 MHz RISC engine with 3 FCCs, 4 SCCs, 2 MCCs, and time-slot assigner - offloads HDLC, ATM, TDM, and ISDN protocol processing from main core.
OCeaN switch fabricFour-port crossbar supporting 256-byte packets with priority-based reordering - enables non-blocking internal traffic routing between TSEC, RapidIO, PCI, and DDR domains.
Power managementDoze/nap/sleep modes with dynamic block gating - reduces active power to <1 W during low-traffic periods in edge routers.
JTAG system access portFull 32-bit register and memory access via TAP controller - enables in-system debug, flash programming, and post-silicon validation without boot ROM dependency.

Applications

Wireless Base Station Controller Enterprise Edge Router

Use Scenario: Central control unit in 3G/4G macrocell BTS managing RF resource allocation, backhaul transport (IP/Ethernet), and fronthaul interface (RapidIO to DSP farms).

IC Role / Device Role / Timing Role: Primary application processor executing LTE stack, controlling dual TSECs for S1/X2 interfaces, and using RapidIO to coordinate with remote radio units.

Use Value: 833 MHz e500 core + 256 KB L2 cache delivers sub-100 μs interrupt latency for real-time RRC layer processing; ECC ensures reliability over 15-year field deployment.

Use Scenario: Dual-homed branch office router aggregating WAN (T1/E1 via FCC), LAN (Gigabit Ethernet via TSEC), and security (IPsec offload via CPM).

IC Role / Device Role / Timing Role: Integrated communications processor providing line-rate forwarding, QoS scheduling, and secure tunneling without external ASICs.

Use Value: Dual TSECs handle 2 Gbps aggregate throughput; PCI-X interface connects to encryption co-processor; DDR controller supports 4 GB memory for deep packet inspection buffers.

Telecom Line Card Industrial Protocol Gateway

Use Scenario: STM-16/OC-48 add-drop multiplexer card requiring HDLC framing, SONET/SDH overhead processing, and TDM switching.

IC Role / Device Role / Timing Role: CPM executes HDLC/SDLC on 4 SCCs while e500 core manages OAM&P messaging and OCeaN fabric routes TDM streams across 8 time-slot interfaces.

Use Value: MCCs support 256 concurrent HDLC channels at 64 kbps; time-slot assigner implements ISDN PRI and PCM highway mapping in hardware.

Use Scenario: Fieldbus gateway converting Modbus TCP to PROFIBUS DP or CANopen, deployed in factory automation PLC racks.

IC Role / Device Role / Timing Role: Real-time protocol translator using SCCs for serial fieldbus physical layer and e500 core for application-layer conversion logic.

Use Value: Four SCCs simultaneously manage multiple industrial protocols; local bus controller interfaces to FPGA-based I/O expansion; JTAG enables field firmware updates.

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications processor applications.

Alternative Part Technical Difference Application Difference Selection Advice
MPC8569EVTA833DSame PowerQUICC III family; e500v2 core at 833 MHz but with enhanced DDR2 controller (vs DDR1), larger L2 (512 KB), and updated RapidIO v2.0.Supports higher-density memory and faster interconnect; suitable for next-gen baseband where DDR2 DIMMs and 1.25 Gbaud RapidIO are required.Select when upgrading memory bandwidth or interconnect speed is prioritized over cost and footprint compatibility.
LS1023AARM Cortex-A7 dual-core, 1.2 GHz; no CPM; includes SEC crypto engine, QorIQ packet processing acceleration, and DDR3L controller.Targets secure SD-WAN appliances and IoT gateways; lacks native HDLC/ATM/UTOPIA support but adds IPsec/TLS offload.Select for Linux-based network functions requiring cryptographic acceleration and modern ARM ecosystem support, not legacy telecom protocol stacks.

Compared with MPC8569EVTA833D and LS1023A, KMPC8560VT833LC offers unmatched hardware support for legacy telecom protocols (HDLC, ATM, TDM) and deterministic CPM offload, making it irreplaceable in deployed carrier infrastructure where protocol fidelity and long-term availability outweigh raw CPU performance or crypto features.

Availability

KMPC8560VT833LC is available at Aetrix Electronics and suitable for wireless infrastructure, enterprise routing, and telecom line card applications requiring stable component supply, extended lifecycle support, and traceable sourcing for industrial and telecom OEMs.

Supply support for KMPC8560VT833LC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and networking markets, with deep heritage in Power Architecture and communications processors.

KMPC8560VT833LC belongs to the PowerQUICC III product line, designed specifically for high-reliability, protocol-rich embedded networking applications in carrier-grade infrastructure where hardware-accelerated serial communications and deterministic memory subsystems are essential.

FAQ

What is the maximum DDR-1 SDRAM data rate supported by KMPC8560VT833LC?

KMPC8560VT833LC supports a maximum DDR-1 SDRAM data rate of 333 MHz (166 MHz clock, double-data-rate), delivering 5.3 GB/s peak bandwidth across its 64-bit interface. This is confirmed in Section 4 of the MPC8560 Hardware Specifications Rev. 4.2, which specifies programmable timing for DDR-1 with full ECC and page-mode support up to 16 open pages. The interface is 2.5 V SSTL2-compliant and requires MVREF = GVDD/2.

Does KMPC8560VT833LC include hardware support for Ethernet jumbo frames?

Yes, KMPC8560VT833LC supports 9.6-Kbyte jumbo frames in both TSEC controllers, as documented in Section 1.1 under "Two three-speed (10/100/1Gb) Ethernet controllers." This capability enables efficient transport of large payloads in storage area networks and high-throughput data center interconnects without IP fragmentation.

What power supply sequencing is required for reliable startup of KMPC8560VT833LC?

KMPC8560VT833LC requires strict power sequencing: VDD and AVDD must be applied first, followed by GVDD, LVDD, and OVDD. Per Table 2.1.2 in the Hardware Specifications, rails on earlier steps must reach 90% of target before subsequent rails begin ramping. Violating this sequence risks latch-up or undefined reset behavior, especially if I/O supplies power up before core voltage.

Can KMPC8560VT833LC operate in a purely SRAM-only L2 configuration?

Yes, KMPC8560VT833LC allows the full 256 KB L2 memory to be configured as memory-mapped SRAM - either as a single 256 KB block or two 128 KB blocks - with byte-accessible ECC protected via read-modify-write transactions. This mode is used for deterministic packet buffering where cache coherency overhead is undesirable.

Is KMPC8560VT833LC pin-compatible with other MPC8560 speed grades?

Yes, KMPC8560VT833LC shares identical 783-pin FC-PBGA mechanical and electrical pinout with all MPC8560 variants (e.g., KMPC8560VT667LC, KMPC8560VT1000LC), as confirmed in Section 14 "Package and Pin Listings" of the MPC8560EC Rev. 4.2 specification. Only core frequency, voltage tolerances, and thermal specifications differ between speed grades.

KMPC8560VT833LC Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
783-BFBGA, FCBGA
Series:
MPC85xx
Packaging:
Tray
Product Status:
Obsolete
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
833MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
-
Ethernet:
10/100/1000Mbps (2)
SATA:
-
USB:
-
Voltage - I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Security Features:
-
Mounting Type:
Surface Mount
Supplier Device Package:
783-FCPBGA (29x29)
Additional Interfaces:
I2C, PCI, RapidIO, SPI, TDM, UART

KMPC8560VT833LC FAQ

1.How can I place an order for KMPC8560VT833LC through Aetrix?

Please submit a Request for Quotation (RFQ) for KMPC8560VT833LC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for KMPC8560VT833LC reliable?

The price and inventory of KMPC8560VT833LC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for KMPC8560VT833LC is usually 5 days.

3.What payment methods are accepted for KMPC8560VT833LC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for KMPC8560VT833LC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for KMPC8560VT833LC?

KMPC8560VT833LC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your KMPC8560VT833LC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for KMPC8560VT833LC?

For technical support, including KMPC8560VT833LC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your KMPC8560VT833LC requirements.

6.How does Aetrix verify that KMPC8560VT833LC is sourced from the original manufacturer or authorized distributors?

All KMPC8560VT833LC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that KMPC8560VT833LC meets industry standards.

7.What is the process for return or replacement of KMPC8560VT833LC?

All KMPC8560VT833LC units undergo pre-shipment inspection (PSI). If there is an issue with KMPC8560VT833LC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The KMPC8560VT833LC part is unused and in its original packaging.

Return procedure for KMPC8560VT833LC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

KMPC8560VT833LC Tags

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