NXP Semiconductors KMPC860PCZQ66D4

Overview

KMPC860PCZQ66D4 from Freescale Semiconductor is a PowerQUICC™ integrated communications controller combining a 32-bit Power Architecture™ CPU core (up to 66 MHz), dual-port CPM, 16 KB instruction/8 KB data cache, IEEE 802.3u-compliant 10/100 Mbps Ethernet MAC, and UTOPIA-level ATM support - deployed in telecom access gateways, industrial protocol converters, and legacy network edge routers.

For engineers reviewing the KMPC860PCZQ66D4 datasheet, KMPC860PCZQ66D4 pinout, KMPC860PCZQ66D4 application, or KMPC860PCZQ66D4 equivalent, key selection criteria include its 357-pin PBGA package (ZQ code), 3.3 V operation with 5 V-tolerant I/O, 95 °C max junction temperature, and support for glueless DRAM/SRAM/Flash interfaces - critical for long-lifecycle embedded control designs requiring deterministic real-time packet processing.

Technical Context

The KMPC860PCZQ66D4 integrates a superscalar Power Architecture CPU core with MMU, instruction/data caches, and a separate RISC-based Communications Processor Module (CPM) handling serial protocols (HDLC, UART, SPI, I²C, SCCs, SMCs) independently of the main CPU - enabling concurrent packet forwarding and application-layer processing. Its memory controller supports eight banks with programmable wait states, dynamic bus sizing (8/16/32-bit), and boot-selectable chip-width configuration.

It implements IEEE 1149.1 JTAG debug, four 16-bit general-purpose timers (or two 32-bit), real-time clock, periodic interrupt timer, and system integration unit features including clock synthesizer and low-power stop/sleep modes - all operating under 3.135–3.465 V at ≥40 MHz bus frequency, with thermal resistance R_θJA = 34 °C/W on single-layer board.

Key Specifications

Pinout & Package

Package: 357-ball Plastic Ball Grid Array (PBGA), ZQ package code (5058 case number), 25 mm × 25 mm × 1.2 mm body, 1.27 mm ball pitch, exposed thermal pad - requires solder paste stencil design matching JEDEC MO-251 and thermal via array to internal ground plane.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications controller applications.

Compared with KMPC860PCZQ66D4, MPC860PZQ80D4 delivers higher compute headroom at the cost of stricter voltage regulation and thermal design, while MPC855TZQ66D4 sacrifices communications flexibility for lower BOM cost - making KMPC860PCZQ66D4 the optimal balance of integrated peripherals, deterministic real-time performance, and legacy protocol support.

Availability

KMPC860PCZQ66D4 is available at Aetrix Electronics and suitable for DSL access multiplexers, industrial protocol gateways, and legacy router control planes requiring stable component supply across extended product lifecycles.

Supply support for KMPC860PCZQ66D4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors since 2015) designed high-performance embedded processors for automotive, networking, and industrial markets - emphasizing real-time determinism, peripheral integration, and long-term availability.

The MPC860 PowerQUICC family was engineered specifically for communications infrastructure edge devices requiring concurrent protocol processing, deterministic packet forwarding, and hardware-accelerated serial interface management - targeting telecom access equipment and industrial gateways with 10+ year deployment horizons.

FAQ

What is the maximum operating frequency of the KMPC860PCZQ66D4 CPU core?

The KMPC860PCZQ66D4 CPU core operates at up to 66 MHz in 1:1 mode (CPU clock equals bus clock). It also supports 80 MHz CPU frequency in 2:1 mode (CPU clock twice the bus clock), requiring the bus to run at 40 MHz. This dual-mode capability is confirmed in Table 5 of the Freescale MPC860 Hardware Specifications Rev. 10, where KMPC860PCZQ66D4 is explicitly rated for 66 MHz operation with typical power dissipation of 722 mW at 3.3 V.

Does the KMPC860PCZQ66D4 support IEEE 802.3u 100 Mbps Ethernet?

Yes, the KMPC860PCZQ66D4 supports full IEEE 802.3u-compliant 10/100 Mbps Ethernet via its integrated FEC and SCC1–SCC4 controllers. The hardware specification confirms this in Section 2 Features, stating "10/100 Mbps Ethernet support, fully compliant with the IEEE 802.3u® Standard" - and clarifies that this capability is available on specially programmed devices, which includes the KMPC860PCZQ66D4 variant as indicated by its 'C' suffix denoting communications-optimized configuration.

What package type and pin count does the KMPC860PCZQ66D4 use?

The KMPC860PCZQ66D4 uses a 357-ball Plastic Ball Grid Array (PBGA) package with ZQ package code (case number 5058), measuring 25 mm × 25 mm × 1.2 mm with 1.27 mm ball pitch. This is documented in Table 3 ("Package Description") of the MPC860 Hardware Specifications Rev. 10, where ZQ/VR is defined as "PBGA 357 25*25*1.2P1.27", and the KMPC860PCZQ66D4 ordering code directly references ZQ.

Can the KMPC860PCZQ66D4 interface directly with DDR SDRAM?

No, the KMPC860PCZQ66D4 does not support DDR SDRAM. Its memory controller is designed for asynchronous DRAM, FPM/EDO DRAM, SRAM, Flash, and EPROM - as stated in Section 2 Features: "Glueless interface to DRAM, SIMMS, SRAM, EPROM, Flash EPROM". DDR SDRAM requires source-synchronous strobes and DLL-based timing not present in the KMPC860PCZQ66D4 memory controller architecture.

What is the junction temperature limit for continuous operation of the KMPC860PCZQ66D4?

The maximum junction temperature (T_j(max)) for continuous operation of the KMPC860PCZQ66D4 is 95 °C, as specified in Table 2 ("Maximum Tolerated Ratings") under "Temperature3 (standard)" and "Temperature3 (extended)". This limit applies across the full industrial ambient range (–40 °C to 0 °C) and requires adherence to thermal design guidelines - including use of the exposed thermal pad, four 0.1 µF bypass capacitors, and appropriate PCB copper area - to maintain reliability at 66 MHz operation.