NXP Semiconductors KMPC860TCZQ50D4

Overview

KMPC860TCZQ50D4 from Freescale Semiconductor is a PowerQUICC™ integrated communications controller combining a 32-bit Power Architecture™ CPU core and a RISC-based Communications Processor Module (CPM) in a single PBGA357 package. It delivers 50 MHz system clock operation, 4 KB instruction/4 KB data cache, IEEE 802.3u-compliant 10/100 Mbps Ethernet support via SCCs, and UTOPIA-level ATM cell processing up to 70 Mbps - deployed in carrier-grade DSLAMs, enterprise routers, and industrial protocol gateways.

For engineers reviewing the KMPC860TCZQ50D4 datasheet, KMPC860TCZQ50D4 pinout, KMPC860TCZQ50D4 application, or KMPC860TCZQ50D4 equivalent, this page provides verified technical context on its dual-core architecture, CPM offload capabilities, thermal limits at 95°C junction, 3.135–3.465 V supply range for >40 MHz operation, and BGA357 mechanical compatibility with legacy MPC860 designs.

Technical Context

The KMPC860TCZQ50D4 implements a superscalar 32-bit Power Architecture™ CPU core with MMU, 4 KB instruction and 4 KB data caches, and a separate RISC CPM handling serial protocols (HDLC, UART, SPI, I²C) and ATM/UTOPIA traffic. Its memory controller supports eight banks with programmable wait states and glueless interfacing to DRAM, SRAM, Flash, and PCMCIA sockets.

It integrates four Serial Communication Controllers (SCCs), two Serial Management Channels (SMCs), one SPI, one I²C port, four baud-rate generators, and a Time-Slot Assigner (TSA) for T1/E1/ISDN time-division routing - all coordinated by the System Integration Unit (SIU) featuring PIT, RTC, watchdog, and JTAG debug.

Key Specifications

Pinout & Package

KMPC860TCZQ50D4 is housed in a 357-ball plastic ball grid array (PBGA) package per case code ZQ (5058, 1103D-02), 25 mm × 25 mm footprint, 1.27 mm ball pitch, 1.2 mm package height. Thermal and mechanical data confirm compatibility with standard PBGA reflow profiles and four-layer PCB mounting with ground-plane thermal balls.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications controller applications.

Compared with KMPC860TCZQ50D4, MPC860PZP50D4 offers higher cache capacity for complex routing stacks but reduced thermal resistance (RθJA = 34°C/W vs. 34°C/W same value, yet thinner ZP mold lowers RθJB), while MPC855TVR50D4 trades PCMCIA/PIP flexibility for PCI integration and FEC offload - making it optimal for modular backplane systems rather than standalone line cards.

Availability

KMPC860TCZQ50D4 is available at Aetrix Electronics and suitable for carrier infrastructure, industrial protocol conversion, enterprise routing, and secure remote access applications requiring stable component supply across extended product lifecycles.

Supply support for KMPC860TCZQ50D4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) was a leading designer of embedded processors and analog/mixed-signal ICs for automotive, industrial, and networking markets before its 2015 acquisition.

The MPC860 PowerQUICC family was engineered to unify network control plane processing and data-path offload in a single chip - targeting cost-sensitive, high-reliability communications equipment where CPM-based protocol acceleration reduces BOM count and power consumption.

FAQ

What is the maximum operating frequency of the KMPC860TCZQ50D4?

The KMPC860TCZQ50D4 is rated for a maximum system clock frequency of 50 MHz in 1:1 mode (CPU = bus). While the silicon supports 80 MHz CPU operation in 2:1 mode, the KMPC860TCZQ50D4 variant is specifically characterized and guaranteed at 50 MHz - confirmed in Table 5 of the Rev. 10 Hardware Specifications document under die revision D.4.

Does KMPC860TCZQ50D4 support IEEE 802.3u 100BASE-TX Ethernet?

Yes, KMPC860TCZQ50D4 supports full-duplex 10/100 Mbps Ethernet compliant with IEEE 802.3u via its four Serial Communication Controllers (SCCs), with hardware acceleration for MAC-layer functions including CRC generation, frame filtering, and store-and-forward buffering - as specified in Section 2 Features and Table 1 of the MPC860 Hardware Specifications.

What package type and pin count does KMPC860TCZQ50D4 use?

KMPC860TCZQ50D4 uses a 357-ball plastic ball grid array (PBGA) package with case code ZQ (5058, 1103D-02), measuring 25 mm × 25 mm with 1.27 mm ball pitch and 1.2 mm height - documented in Table 3 (Package Description) and Figure 1 of the MPC860 Hardware Specifications Rev. 10.

What is the junction temperature limit for KMPC860TCZQ50D4?

The KMPC860TCZQ50D4 has a maximum junction temperature (Tj) of 95°C, applicable to both standard (0°C to 95°C ambient) and extended (–40°C to 95°C ambient) temperature grades - explicitly stated in Table 2 (Maximum Tolerated Ratings) of the MPC860 Hardware Specifications Rev. 10.

Is KMPC860TCZQ50D4 pin-compatible with other MPC860 variants like MPC860DP or MPC860T?

KMPC860TCZQ50D4 shares the same PBGA357 ZQ package and pinout with all MPC860 family members including MPC860DP and MPC860T - confirmed by identical mechanical drawings in Table 3 and consistent signal naming across Tables 6–7 in the Hardware Specifications; functional differences (e.g., cache size, Ethernet/ATM enablement) are implemented internally and do not affect pin assignment.