NXP Semiconductors KMPC885CZP133

Overview

KMPC885CZP133 from Freescale Semiconductor is a Power Architecture™-based 32-bit integrated communications processor with embedded MPC8xx core running at 133 MHz, dual 8-Kbyte instruction/data caches, MMU, and on-die security engine supporting AES-128/192/256, DES/3DES, SHA-1/256, and MD5. It integrates two 10/100 Mbps FECs, USB 2.0 full-/low-speed host/function controller, UTOPIA L2 interface, serial ATM, and three SCCs - deployed in carrier-grade DSLAMs, ATM edge routers, and secure IPsec gateways.

For engineers reviewing the KMPC885CZP133 datasheet, KMPC885CZP133 pinout, KMPC885CZP133 application, or KMPC885CZP133 equivalent, key selection criteria include 133-MHz core frequency (2:1 bus mode only), 1.8-V core / 3.3-V I/O operation, 357-pin PBGA package, IEEE 1149.1 JTAG debug support, and hardware-accelerated crypto-channel with 256-byte buffer per unit.

Technical Context

The KMPC885CZP133 implements a unified 32-bit RISC core with branch prediction, two-way set-associative caches (256 sets × 2 blocks), physically addressed TLBs (32-entry fully associative), and memory management supporting 4/16/512 KB and 8 MB page sizes across 16 virtual address spaces. Its CPM subsystem includes an 8-Kbyte dual-port RAM, four baud rate generators, and RISC-based serial DMA controllers for SCC/SMC offload.

PowerQUICC architecture integrates SIU functions including clock synthesizer, periodic interrupt timer, software watchdog, reset controller, and bus monitor - all synchronized to a 133-MHz core clock while external bus operates at 80 MHz in 1:1 mode or 66.5 MHz in 2:1 mode. The security engine features dedicated crypto-hardware accelerators (DEU, AESU, MDEU) with independent command descriptor chains and flow-controlled buffering.

Key Specifications

Pinout & Package

KMPC885CZP133 is housed in a 357-ball plastic ball grid array (PBGA) package with 1.27 mm pitch, designed for four-layer PCB mounting with dedicated VDD/VSS planes. Thermal performance relies on soldered thermal balls connected to internal ground plane via vias.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar communications processor applications.

Compared with MPC885CZQ133, KMPC885CZP133 trades extended thermal rating for lower cost and qualification cycle time in climate-controlled environments; versus MPC880CZP133, it adds security engine and second FEC without changing footprint or driver stack - enabling seamless upgrade path within same PCB design.

Availability

KMPC885CZP133 is available at Aetrix Electronics and suitable for DSLAM line cards, secure branch routers, ATM edge switches, and industrial protocol gateways requiring stable component supply across long-lifecycle telecom infrastructure programs.

Supply support for KMPC885CZP133 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) was a leading designer of embedded processors and analog/mixed-signal ICs for automotive, industrial, and networking markets until its 2015 acquisition.

KMPC885CZP133 belongs to the PowerQUICC family - engineered for integrated communications processing in carrier-class edge equipment, combining Power Architecture CPU, CPM peripheral offload, and hardware security acceleration in a single die.

FAQ

What is the maximum operating junction temperature for KMPC885CZP133?

The KMPC885CZP133 has a maximum guaranteed junction temperature (TJ(max)) of 95°C under standard operating conditions. This rating assumes natural convection cooling on a four-layer PCB with RθJA = 25°C/W. Exceeding this limit risks thermal shutdown or accelerated electromigration failure; derating is required above 70°C ambient unless active airflow or heatsinking is implemented for KMPC885CZP133.

Does KMPC885CZP133 support pin-compatible migration from MPC866 or MPC875?

No, KMPC885CZP133 is not pin-compatible with MPC866 or MPC875. It uses a 357-ball PBGA package with different ball map, power sequencing requirements (dual VDDL/VDDH rails), and peripheral register layout. Migration requires PCB redesign and firmware adaptation due to architectural differences in CPM memory mapping and security engine initialization sequence for KMPC885CZP133.

Can KMPC885CZP133 operate in 1:1 bus mode at 133 MHz?

No, KMPC885CZP133 does not support 1:1 bus mode at 133 MHz. The datasheet explicitly states that 133-MHz core frequency is valid only in 2:1 mode, where bus speed is 66.5 MHz. Attempting 1:1 operation at 133 MHz violates AC timing specifications and may cause data corruption on external memory or peripheral interfaces for KMPC885CZP133.

What USB modes does KMPC885CZP133 support, and are they simultaneous?

KMPC885CZP133 supports USB function endpoint, USB host controller, and loop-back diagnostic modes - but not simultaneously. The USB controller operates in either host or device mode per boot configuration; mode selection is controlled by strap pins (USB_MODE[1:0]) at reset. KMPC885CZP133 cannot act as both host and device concurrently due to shared PHY and endpoint resource allocation.

Is external memory required for KMPC885CZP133 to execute code from reset?

Yes, KMPC885CZP133 requires external boot memory. It lacks on-chip ROM or flash; reset vector fetch occurs from external address 0xFF000000, typically mapped to boot Flash or EPROM on CS0. The internal 8-Kbyte instruction cache is disabled at reset and must be enabled in software after memory controller initialization for KMPC885CZP133.