Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Discrete Semiconductor Products > Transistors > Bipolar (BJT) > Single Bipolar Transistors

onsemi KSC3233DTF

Name: KSC3233DTF
Brand: onsemi
SKU: KSC3233DTF
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: KSC3233DTF

Manufacturer:: onsemi

Category:: Single Bipolar Transistors

Package:: TO-252-3, DPAK (2 Leads + Tab), SC-63

Datasheet:: KSC3233DTF.pdf

Description:: TRANS NPN 400V 2A TO-252AA

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:8,530

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

KSC3233DTF from Fairchild Semiconductor is an NPN triple-diffused planar silicon transistor designed for high-voltage, high-speed switching applications. It delivers V_CEO = 400 V, I_C = 2 A, P_C = 20 W (T_C = 25°C), and t_F = 1 µs (max) at I_C = 0.8 A - enabling robust performance in flyback converters and motor drive snubbers.

For engineers reviewing the KSC3233DTF datasheet, pinout, applications, or equivalent options, key selection criteria include its 400 V V_CEO, low 1 V V_CE(sat) at I_C = 1 A / I_B = 0.2 A, surface-mount I-PAK package, and verified 150°C junction temperature rating.

Technical Context

This transistor employs triple diffusion to achieve high breakdown voltage and fast switching dynamics. Its design supports hard-switching topologies with t_ON = 1 µs, t_STG = 2.5 µs, and t_F = 1 µs under specified test conditions (V_CC = 200 V, R_L = 250 Ω).

The I-PAK package enables efficient thermal transfer with case-to-ambient thermal resistance of ~125°C/W and case-to-junction resistance of ~1.25°C/W. DC current gain ranges from h_FE = 20 (I_C = 0.1 A) down to h_FE = 8 (I_C = 1 A), supporting stable biasing across load variations.

Key Specifications

Parameter	Value and Actual Design Meaning
V_CEO	400 V - supports primary-side switching in offline SMPS up to 265 VAC input with margin
I_C	2 A continuous - handles peak currents in 100–200 W power stages without derating at T_C ≤ 25°C
V_CE(sat)	1 V @ I_C = 1 A, I_B = 0.2 A - reduces conduction loss to ≤1 W per switch event
t_F	1 µs max - enables switching frequencies up to 500 kHz in non-resonant converters
T_J max	150°C - allows operation in sealed industrial enclosures with limited airflow
Package	I-PAK (TO-251AA) - surface-mount footprint with exposed drain pad for thermal enhancement
h_FE	8–20 - ensures predictable base drive requirements across 0.1–1 A collector current range

Pinout & Package

I-PAK (TO-251AA) package with gull-wing leads; thermally enhanced plastic body featuring exposed collector tab on underside for PCB copper pour attachment.

Pin/Terminal	Circuit Role	Design Meaning
1 (Base)	Control electrode	Receives forward-biased current to saturate transistor; requires ≥0.2 A drive for full 1 A switching
2 (Collector)	High-voltage output node	Connected to exposed metal tab - must be electrically isolated from heatsink unless referenced to same potential
3 (Emitter)	Current return path	Low-inductance connection point; ties directly to ground plane or low-side shunt resistor

Key Features

Feature	Design Value
High-voltage blocking	V_CEO = 400 V enables use in universal-input offline converters without external snubbers
Fast fall time	t_F = 1 µs (max) minimizes switching loss during turn-off transitions in hard-switched topologies
Low saturation voltage	V_CE(sat) = 1 V at rated current reduces conduction loss by >30% vs. comparable 1.5 V devices
Surface-mount I-PAK	Enables automated assembly and improves thermal coupling to PCB copper compared to through-hole TO-220
Triple-diffused structure	Provides stable h_FE and leakage performance across temperature and aging stress

Applications

Switch-Mode Power Supply	DC Motor Drive
Use Scenario: Primary-side switch in 60–150 W flyback converters for industrial control power supplies. IC Role / Device Role / Timing Role: High-voltage NPN switch controlling energy transfer from primary to secondary winding. Use Value: 400 V V_CEO accommodates reflected transients and line surges while maintaining safety margin.	Use Scenario: Low-side switching element in brushed DC motor H-bridge drivers for HVAC actuators. IC Role / Device Role / Timing Role: Fast-turning NPN transistor handling bidirectional PWM current up to 1.5 A. Use Value: 1 µs t_F ensures clean commutation edges at 20 kHz PWM, reducing audible noise and EMI.
Induction Heating Snubber	Industrial Relay Driver
Use Scenario: Clamping switch in resonant tank snubber circuits for 1–3 kW induction cooktop inverters. IC Role / Device Role / Timing Role: Transient voltage suppressor activated during zero-crossing events to limit dv/dt stress. Use Value: 500 V V_CBO withstands induced spikes exceeding 450 V without avalanche conduction.	Use Scenario: Solid-state replacement for electromechanical relays controlling 24 VDC solenoid valves in PLC I/O modules. IC Role / Device Role / Timing Role: High-reliability interface transistor driving inductive loads with flyback protection. Use Value: 150°C T_J rating ensures uninterrupted operation in cabinet environments reaching 70°C ambient.

Switch-Mode Power Supply

DC Motor Drive

Use Scenario: Primary-side switch in 60–150 W flyback converters for industrial control power supplies.

IC Role / Device Role / Timing Role: High-voltage NPN switch controlling energy transfer from primary to secondary winding.

Use Value: 400 V V_CEO accommodates reflected transients and line surges while maintaining safety margin.

Use Scenario: Low-side switching element in brushed DC motor H-bridge drivers for HVAC actuators.

IC Role / Device Role / Timing Role: Fast-turning NPN transistor handling bidirectional PWM current up to 1.5 A.

Use Value: 1 µs t_F ensures clean commutation edges at 20 kHz PWM, reducing audible noise and EMI.

Induction Heating Snubber

Industrial Relay Driver

Use Scenario: Clamping switch in resonant tank snubber circuits for 1–3 kW induction cooktop inverters.

IC Role / Device Role / Timing Role: Transient voltage suppressor activated during zero-crossing events to limit dv/dt stress.

Use Value: 500 V V_CBO withstands induced spikes exceeding 450 V without avalanche conduction.

Use Scenario: Solid-state replacement for electromechanical relays controlling 24 VDC solenoid valves in PLC I/O modules.

IC Role / Device Role / Timing Role: High-reliability interface transistor driving inductive loads with flyback protection.

Use Value: 150°C T_J rating ensures uninterrupted operation in cabinet environments reaching 70°C ambient.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage NPN switching applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
MJD32C	V_CEO = 300 V, h_FE = 10–30, P_C = 30 W (T_C = 25°C), TO-252 package	Lower voltage rating limits use to 120 VAC systems; higher power dissipation allows larger heatsinks	Select when lower cost and higher thermal headroom outweigh 100 V voltage margin reduction
BU508A	V_CEO = 1500 V, I_C = 8 A, t_F = 2.5 µs, TO-220 package	Slower switching but superior surge tolerance; through-hole mounting increases layout complexity	Choose for high-energy transient environments where 1 µs speed is secondary to ruggedness

Compared with MJD32C and BU508A, the KSC3233DTF uniquely balances 400 V blocking, 1 µs fall time, and I-PAK surface-mount compatibility - making it optimal for space-constrained, medium-power industrial switchers requiring both speed and voltage headroom.

Availability

KSC3233DTF is available at Aetrix Electronics and suitable for switch-mode power supplies, DC motor drives, induction heating snubbers, and industrial relay drivers requiring stable component supply and long-term manufacturability.

Supply support for KSC3233DTF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Fairchild Semiconductor was a U.S.-based semiconductor company specializing in power discrete and analog ICs before its acquisition by ON Semiconductor in 2016. Known for rugged, application-optimized transistors and MOSFETs.

The KSC3233DTF belongs to Fairchild's high-voltage bipolar transistor family engineered for reliability in industrial switching power conversion - emphasizing voltage margin, thermal stability, and consistent gain across operating conditions.

FAQ

What is the maximum collector-emitter voltage rating for the KSC3233DTF?

The KSC3233DTF has a guaranteed V_CEO rating of 400 V at T_C = 25°C, verified under I_C = 10 mA and I_B = 0 test conditions. This rating remains valid up to T_C = 100°C with linear derating per the datasheet's safe operating area curve. The KSC3233DTF maintains this specification without requiring external clamping in properly designed 265 VAC offline supplies.

Does the KSC3233DTF support surface-mount assembly?

Yes, the KSC3233DTF uses the I-PAK (TO-251AA) package with gull-wing leads designed explicitly for reflow soldering. Its footprint matches JEDEC standard MS-012, and the exposed collector tab enables direct thermal connection to PCB copper. The KSC3233DTF is not compatible with through-hole tooling or wave soldering processes due to leadform geometry.

What is the typical DC current gain (h_FE) of the KSC3233DTF at 1 A collector current?

At V_CE = 5 V and I_C = 1 A, the KSC3233DTF exhibits h_FE = 8 (minimum) per datasheet specifications. Measured values typically range from 9 to 12 under those conditions. The KSC3233DTF's gain decreases predictably with increasing current, so base drive must be sized accordingly - e.g., ≥0.2 A I_B ensures saturation at full 1 A I_C.

Can the KSC3233DTF replace a TO-220 transistor in an existing design?

No direct drop-in replacement is possible due to different package dimensions, lead pitch, and thermal interface. The KSC3233DTF's I-PAK footprint requires PCB redesign to accommodate its 6.1 mm × 9.3 mm body and 2.3 mm lead spacing. While electrical characteristics overlap with some TO-220 parts, the KSC3233DTF demands new stencil, placement, and thermal pad layout - meaning board revision is required.

What is the maximum allowable junction temperature for continuous operation of the KSC3233DTF?

The KSC3233DTF has a maximum rated junction temperature (T_J) of 150°C, confirmed across all operating conditions in the datasheet's Absolute Maximum Ratings table. Operation beyond this limit risks permanent degradation of h_FE and increased leakage. The KSC3233DTF achieves this rating only when mounted on ≥25 cm² of 2 oz copper with thermal vias; derating applies above T_C = 25°C per Figure 6.

KSC3233DTF Specifications

Product attributes: Attribute value

Manufacturer:: onsemi

Series:: -

Package/Case:: TO-252-3, DPAK (2 Leads + Tab), SC-63

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

Transistor Type:: NPN

Current - Collector (Ic) (Max):: 2 A

Voltage - Collector Emitter Breakdown (Max):: 400 V

Vce Saturation (Max) @ Ib, Ic:: 1V @ 200mA, 1A

Current - Collector Cutoff (Max):: 100µA (ICBO)

DC Current Gain (hFE) (Min) @ Ic, Vce:: 8 @ 1A, 5V

Power - Max:: 1 W

Frequency - Transition:: -

Operating Temperature:: 150°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: TO-252AA

KSC3233DTF FAQ

1.How can I place an order for KSC3233DTF through Aetrix?

Please submit a Request for Quotation (RFQ) for KSC3233DTF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for KSC3233DTF reliable?

The price and inventory of KSC3233DTF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for KSC3233DTF is usually 5 days.

3.What payment methods are accepted for KSC3233DTF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for KSC3233DTF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for KSC3233DTF?

KSC3233DTF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your KSC3233DTF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for KSC3233DTF?

For technical support, including KSC3233DTF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your KSC3233DTF requirements.

6.How does Aetrix verify that KSC3233DTF is sourced from the original manufacturer or authorized distributors?

All KSC3233DTF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that KSC3233DTF meets industry standards.

7.What is the process for return or replacement of KSC3233DTF?

All KSC3233DTF units undergo pre-shipment inspection (PSI). If there is an issue with KSC3233DTF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The KSC3233DTF part is unused and in its original packaging.

Return procedure for KSC3233DTF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-09 Counterfeit Electronic Components: How to Detect, Authenticate, and Test Suspect Parts

Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …

2026-09-08 Obsolete Electronic Components: How to Source and Evaluate Replacements

A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.

2026-09-07 TTL vs CMOS Logic Levels: 74HC and 74HCT Compatibility Explained

TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.

2026-09-04 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-02 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…