STMicroelectronics L6562ATDTR
- Part No.:
- L6562ATDTR
- Manufacturer:
- STMicroelectronics
- Category:
- PFC (Power Factor Correction)
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
L6562ATDTR.pdf
- Description:
- IC PFC CTRLR TRANSITION 8SO
- Quantity:
- Payment:

- Shipping:

Inventory:3,423
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
L6562ATDTR from STMicroelectronics is a transition-mode (TM) power factor correction (PFC) controller in SO-8 package, designed for high-efficiency AC-DC pre-regulators. It delivers 1% internal reference voltage accuracy (@TJ = 25 °C), ultra-low 30 µA start-up current, and integrated totem-pole gate driver with ±600/±800 mA sourcing/sinking capability-enabling direct drive of high-current MOSFETs in street lighting and IEC61000-3-2-compliant flat-panel TV power supplies.
For engineers reviewing the L6562ATDTR datasheet, L6562ATDTR pinout, L6562ATDTR application, or L6562ATDTR equivalent, this controller offers verified THD optimization circuitry, digital leading-edge blanking on CS pin, disable function via INV pin, and dual-stage overvoltage protection-critical for energy-efficient, outdoor-rated PFC designs operating across -40 °C to +150 °C junction temperature range.
Technical Context
The L6562ATDTR implements current-mode control in transition mode using a proprietary multiplier with linear gain (0.32–0.47 V/V) and dedicated THD optimizer that injects positive offset near line zero-crossings to reduce conduction dead-angle. Its error amplifier features 60–80 dB open-loop gain and 1 MHz GBW, enabling stable voltage loop compensation with external R-C networks between COMP and INV pins.
Operation relies on ZCD pin sensing boost inductor demagnetization for zero-current turn-on, CS pin with 100–300 ns leading-edge blanking for noise-immune current sensing, and dual OVP: dynamic (27 µA trigger) for load-dump events and static (COMP saturation detection) for light-load overvoltage-both reducing quiescent current to ≤2.2 mA during fault.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Control Mode | Transition-mode (TM) current-mode PFC with fixed-off-time architecture |
| Reference Voltage | 2.5 V ±1% @ TJ = 25 °C - enables precise output voltage regulation with minimal resistor-divider tolerance impact |
| Start-up Current | 30–60 µA - allows use of high-value, low-power start-up resistors for extended hold-up time |
| Gate Driver Output | ±600 mA source / ±800 mA sink - directly drives high-gate-charge MOSFETs without external buffers |
| OVP Trigger Current | 27 µA typ. (dynamic) - sets overvoltage threshold independently of regulated output voltage via R1 value |
| CS Leading-Edge Blanking | 100–300 ns - suppresses switching noise spikes at MOSFET turn-on, improving current-sense reliability |
| Operating Temperature | -40 °C to +150 °C junction - validated for outdoor street lighting and industrial ambient conditions |
Pinout & Package
SO-8 surface-mount package (8-pin, 150 °C/W junction-to-ambient thermal resistance), compliant with JEDEC MS-012AC.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (INV) | Inverting input of error amplifier / Disable input | Voltage feedback node for output regulation; <200 mV disables IC for remote ON/OFF control |
| 2 (COMP) | Error amplifier output | Drives compensation network; clamped at 2.1–2.4 V (low) and 5.1–6 V (high) for loop stability |
| 3 (MULT) | Multiplier main input | Accepts rectified mains voltage reference (0–3 V linear range); enables sinusoidal current shaping |
| 4 (CS) | Current sense comparator input | Detects MOSFET current via sense resistor; includes 200 ns blanking to reject turn-on noise |
| 5 (ZCD) | Zero-current detector input | Senses boost inductor demagnetization; triggers MOSFET turn-on on negative-going edge |
| 6 (GND) | Signal and gate-driver ground return | Common reference for analog circuitry and 800 mA sink path; requires low-impedance PCB layout |
| 7 (GD) | Gate driver output | Totem-pole stage with active pull-down during UVLO; clamped at 10–15 V to protect MOSFET gate |
| 8 (Vcc) | Supply voltage input | 10.5–22.5 V operating range; includes 12.5 V turn-on / 10 V turn-off UVLO with 2.8 V hysteresis |
Key Features
| Feature | Design Value |
|---|---|
| THD optimizer circuit | Reduces conduction dead-angle near line zero-crossings by injecting controlled multiplier offset, lowering measured THD in wide-range-mains applications |
| Digital leading-edge blanking | Configurable 100–300 ns blanking window on CS pin eliminates false current-sense triggering during MOSFET turn-on transients |
| Two-step overvoltage protection | Dynamic OVP (27 µA trigger) handles load-dump events; static OVP (via COMP saturation) manages light-load overvoltage-both reduce Iq to ≤2.2 mA |
| Ultra-low quiescent current | 2.5 mA typical operating current and ≤2.2 mA during OVP-meets Blue Angel and EnergyStar standby power requirements |
| Active pull-down during UVLO | Ensures MOSFET gate is actively discharged when Vcc drops below 10 V, preventing unintended half-bridge shoot-through |
Applications
| Street Lighting Power Supplies | Flat-Panel TV PFC Stages |
|---|---|
|
Use Scenario: Outdoor LED street luminaires requiring EN61000-3-2 Class C compliance and operation from -40 °C to +85 °C ambient. IC Role / Device Role / Timing Role: Transition-mode PFC controller regulating 400 V DC bus while shaping input current to match sinusoidal line voltage. Use Value: Proprietary THD optimizer reduces harmonic distortion below 10% at full load, meeting stringent municipal lighting standards without auxiliary filtering. |
Use Scenario: 200–400 W flat-panel TV power supplies needing high PF (>0.98) and low standby consumption (<0.5 W). IC Role / Device Role / Timing Role: Primary-side PFC pre-regulator controlling boost converter to generate stable 380–400 V rail for downstream LLC resonant converter. Use Value: 30 µA start-up current and 2.5 mA quiescent draw enable compliance with EnergyStar 8.0 standby power limits without auxiliary bias winding. |
| IEC61000-3-2 Desktop PC SMPS | Electronic Ballast Control |
|
Use Scenario: High-density ATX PSUs targeting Tier-2 efficiency and universal 90–264 V AC input with minimal component count. IC Role / Device Role / Timing Role: Fixed-off-time TM PFC controller synchronizing MOSFET turn-on to inductor zero-current crossing for lossless switching. Use Value: ±800 mA gate sink capability drives 1200 V SiC MOSFETs directly, eliminating gate driver ICs and reducing BOM cost by $0.18 per unit. |
Use Scenario: High-frequency electronic ballasts for T5/T8 fluorescent lamps requiring fast OVP response and thermal robustness. IC Role / Device Role / Timing Role: PFC controller managing lamp preheat and run phases while maintaining constant power delivery under varying lamp impedance. Use Value: Dual OVP stages detect both sudden open-circuit faults (dynamic) and slow lamp aging effects (static), extending ballast lifetime by >25%. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar transition-mode PFC controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| UCC28051DR | Fixed-frequency CCM PFC controller; no ZCD pin; requires external current-sense transformer for accurate zero-crossing detection | Better suited for >500 W continuous conduction mode designs; lacks THD optimizer and outdoor temperature rating | Select only if CCM operation and higher power density are required; not drop-in compatible due to different control architecture |
| L6562DTR | Legacy version with 40 µA dynamic OVP trigger, no disable function on INV, 1.7 V CS clamp vs. 1.08 V, and no leading-edge blanking | Valid for legacy designs but fails modern THD and standby power requirements; requires larger sense resistor and higher OVP resistor | Choose L6562ATDTR for new designs requiring lower THD, reduced heat generation, and energy-saving certifications |
Compared with UCC28051DR and L6562DTR, the L6562ATDTR uniquely combines transition-mode operation, integrated THD optimization, ultra-low start-up current, and dual OVP-making it the only option qualified for outdoor-rated, sub-10% THD, and <0.5 W standby PFC designs below 400 W.
Availability
L6562ATDTR is available at Aetrix Electronics and suitable for street lighting, flat-panel TV power supplies, and IEC61000-3-2 desktop PC SMPS requiring stable component supply, long-term lifecycle support, and traceable sourcing for industrial OEM programs.
Supply support for L6562ATDTR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in power management, analog, and automotive ICs with vertical manufacturing capabilities and ISO/TS 16949-certified processes.
The L6562AT belongs to ST's high-voltage analog PFC controller product line, engineered specifically for energy-efficient, thermally robust AC-DC conversion in outdoor, industrial, and consumer applications demanding IEC61000-3-2 compliance.
FAQ
What is the purpose of the THD optimizer circuit in the L6562ATDTR?
The THD optimizer circuit injects a controlled positive offset into the multiplier output near AC line voltage zero-crossings, reducing conduction dead-angle and minimizing crossover distortion in the input current waveform. This lowers total harmonic distortion-typically below 10% at full load-even with wide-range mains input and minimal EMI filter capacitance, as confirmed in ST application note AN3122.
How does the dual-stage overvoltage protection operate?
Dynamic OVP triggers at 27 µA current into the INV pin during abrupt load-dump events, forcing gate output low and entering idle state. Static OVP activates when the error amplifier saturates low under sustained light-load overvoltage, also disabling switching. Both modes reduce quiescent current to ≤2.2 mA to preserve Vcc hold-up time, as specified in Section 7.1 of the datasheet.
Can the L6562ATDTR operate without an auxiliary winding on the boost inductor?
Yes-the ZCD pin supports R-C network synchronization from the MOSFET drain, eliminating need for auxiliary winding. With RZCD = 330 kΩ and CZCD = 22–33 pF, the network transfers drain edges to ZCD for reliable zero-current detection, validated in 400 V output applications per Section 7.4 of the datasheet.
What is the functional difference between L6562ATDTR and L6562DTR?
L6562ATDTR adds digital leading-edge blanking on CS, relocates disable function to INV pin (vs. ZCD on L6562DTR), lowers dynamic OVP trigger from 40 µA to 27 µA, reduces CS clamp from 1.7 V to 1.08 V, and improves reference accuracy to 1% (vs. 2.4%). These changes require updated external components but deliver lower THD, reduced heat, and better energy-saving compliance.
L6562ATDTR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Mode:
- Discontinuous (Transition)
- Frequency - Switching:
- -
- Current - Startup:
- 30 µA
- Voltage - Supply:
- 10.5V ~ 22.5V
- Operating Temperature:
- -25°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
L6562ATDTR FAQ
1.How can I place an order for L6562ATDTR through Aetrix?
Please submit a Request for Quotation (RFQ) for L6562ATDTR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for L6562ATDTR reliable?
The price and inventory of L6562ATDTR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for L6562ATDTR is usually 5 days.
3.What payment methods are accepted for L6562ATDTR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for L6562ATDTR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for L6562ATDTR?
L6562ATDTR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your L6562ATDTR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for L6562ATDTR?
For technical support, including L6562ATDTR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your L6562ATDTR requirements.
6.How does Aetrix verify that L6562ATDTR is sourced from the original manufacturer or authorized distributors?
All L6562ATDTR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that L6562ATDTR meets industry standards.
7.What is the process for return or replacement of L6562ATDTR?
All L6562ATDTR units undergo pre-shipment inspection (PSI). If there is an issue with L6562ATDTR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The L6562ATDTR part is unused and in its original packaging.
Return procedure for L6562ATDTR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
L6562ATDTR Tags

-
ICE2PCS01GXUMA1
Infineon Technologies
-
NCP1654BD133R2G
onsemi
-
MC33262DR2G
onsemi

-
ICE3PCS03GXUMA1
Infineon Technologies
-
NCP1631DR2G
onsemi

-
L4981BD013TR
STMicroelectronics

-
UCC28070DWR
Texas Instruments

-
UCC28070PWR
Texas Instruments

-
UC3854DWTR
Texas Instruments

-
L4981AD013TR
STMicroelectronics
-
UCC2817D
Texas Instruments

-
UC2854BDWTR
Texas Instruments
Tech Hub
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…

