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STMicroelectronics L6731D

Part No.:
L6731D
Manufacturer:
STMicroelectronics
Category:
Special Purpose Regulators
Package:
16-PowerTSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixL6731D.pdf
Description:
IC REG CTRLR DDR 1OUT 16HTSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,592

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Product details

Overview

L6731D from STMicroelectronics is an adjustable step-down controller with synchronous rectification dedicated to DDR memory supply and termination rail applications. The controller drives external N-channel MOSFETs in a synchronous buck topology, supports an input voltage range from 1.8 V to 14 V, operates from a 4.5 V to 14 V supply, and regulates output voltage down to 0.6 V with high reference accuracy.

For engineers reviewing the L6731D datasheet, L6731D pinout, L6731D application, or L6731D equivalent, this controller is most relevant for DDR memory supply, DDR termination supply, low-voltage distributed DC/DC converters, high-current niPoL converters, compact DC/DC modules, and graphic-card power rails requiring source / sink capability, programmable MOSFET RDS(on) overcurrent sensing, selectable 250 kHz / 500 kHz operation, and HTSSOP16 exposed-pad assembly.

Technical Context

L6731D uses fixed-frequency voltage-mode PWM control and drives a high-side and low-side external MOSFET pair through HGATE and LGATE. The device supports 0% to 100% duty cycle and minimum on-time below 100 ns, allowing very low conversion ratios such as low-voltage DDR rails generated from higher intermediate buses.

For DDR applications, the DDR-IN pin selects internal or external reference operation and determines switching frequency. The internal divider and buffer generate VTTREF at one-half of DDR-IN, and the controller can regulate VTT and VTTREF within 1% of VDDQ. Protection functions include high-side peak current limit, low-side valley current limit, overvoltage protection, feedback disconnection detection, thermal shutdown, power-good monitoring, and hiccup behavior after overcurrent events outside soft-start.

Key Specifications

Parameter Value and Actual Design Meaning
Device Type Adjustable synchronous step-down controller dedicated to DDR memory supply and termination rails.
Topology Voltage-mode synchronous buck controller driving external N-channel high-side and low-side MOSFETs.
Input Voltage Range 1.8 V to 14 V converter input range, supporting low-voltage distributed DC/DC and niPoL converter designs.
Supply Voltage Range 4.5 V to 14 V VCC operating range for controller supply operation.
Output Voltage Range Adjustable output voltage down to 0.6 V, enabling low-voltage core, DDR, and termination rail generation.
Reference Accuracy ±0.8% over line voltage and temperature from 0°C to 125°C, supporting tight low-voltage rail regulation.
DDR Reference Function VTT and VTTREF regulation within 1% of VDDQ using DDR-IN sensing, internal divider, and VTTREF buffer.
Switching Frequency Selectable 250 kHz or 500 kHz frequency through the DDR-IN reference selection condition.
Minimum On-Time Below 100 ns, supporting low duty-cycle conversions at high switching frequency.
Duty Cycle Range 0% to 100% duty cycle for wide conversion-range support.
Gate Driver Supply Internal 5 V VCCDR regulator supplies the MOSFET driver section and should be filtered with at least 1 µF ceramic capacitance.
Error Amplifier 10 MHz gain-bandwidth product and 5 V/µs slew rate for compensation of fast transient power rails.
Overcurrent Protection Programmable high-side peak current and low-side valley current limits using MOSFET RDS(on) sensing through OCH, OCL, and PHASE.
Protection Functions Power good, overvoltage protection, undervoltage / feedback monitoring, soft-start current limiting, hiccup-mode overcurrent response, and thermal shutdown.
Package HTSSOP16 exposed-pad package for compact power-controller layouts.
Operating Temperature -40°C to +85°C ambient operating temperature range, with -40°C to +125°C junction operating range.

Pinout & Package

L6731D is supplied in an HTSSOP16 exposed-pad package with 0.65 mm lead pitch and compact 16-pin surface-mount construction. The exposed-pad TSSOP format helps route gate-drive, phase-node, feedback, DDR reference, and current-limit signals in a small synchronous buck layout while improving ground connection and thermal transfer from the controller package to the PCB.

Pin / Terminal Circuit Role Design Meaning
PGOOD Open-collector power-good output. Pulls low when the output voltage is outside the specified power-good window; can be pulled up to VCCDR through a resistor for system logic monitoring.
VTTREF Buffered DDR reference output. Provides one-half of DDR-IN for connection to DDR memory VTTREF input, normally filtered to ground with a small capacitor.
SGND Signal ground reference. Reference ground for internal analog references and small-signal control circuitry.
FB Error amplifier inverting input and output-voltage sense node. Connects to the output through the compensation / feedback network and is also used for overvoltage and power-good monitoring.
COMP Error amplifier output. Connects to the compensation network used to stabilize the voltage-mode feedback loop.
SS/INH Soft-start and inhibit pin. An external capacitor programs soft-start; when this pin is below the inhibit threshold, the controller is disabled.
DDR-IN DDR reference input and frequency selection node. Selects internal 0.6 V reference or external DDR tracking reference, and also selects 250 kHz or 500 kHz switching operation.
OCL Low-side valley current-limit setting pin. Uses an external resistor to set the valley current limit sensed through the low-side MOSFET RDS(on).
OCH High-side peak current-limit setting pin. Uses an external resistor to the high-side MOSFET drain path to set peak current limit sensed through high-side MOSFET RDS(on).
PHASE Switch-node and high-side driver return. Connects to the high-side MOSFET source and low-side MOSFET drain; also supports current-limit sensing with OCH and OCL.
HGATE High-side MOSFET gate driver output. Drives the gate of the external high-side N-channel MOSFET in the synchronous buck power stage.
BOOT Bootstrap supply for high-side driver. Connects to a bootstrap capacitor from BOOT to PHASE and a diode from VCCDR to BOOT to supply the floating high-side driver.
PGND Power ground reference. Connects close to the low-side MOSFET source to reduce switching-noise injection into the controller.
LGATE Low-side MOSFET gate driver output. Drives the external synchronous rectifier MOSFET gate and supports source / sink operation in DDR termination power stages.
VCCDR Internal 5 V driver regulator output. Supplies the internal gate drivers and should be bypassed to ground with at least 1 µF ceramic capacitance.
VCC Controller supply input. Supplies the internal circuitry over the 4.5 V to 14 V operating range.

Key Features

  • Adjustable synchronous step-down controller dedicated to DDR memory supply and termination rails.
  • 1.8 V to 14 V converter input range and 4.5 V to 14 V controller supply range.
  • Output voltage adjustable down to 0.6 V with ±0.8% reference accuracy over line and temperature.
  • VTT and VTTREF regulation within 1% of VDDQ for DDR memory requirements.
  • Selectable 250 kHz / 500 kHz fixed-frequency voltage-mode control.
  • High-current MOSFET drivers with predictive anti-cross-conduction control and source / sink capability.
  • Programmable high-side and low-side RDS(on) overcurrent sensing without a dedicated current-sense resistor.
  • Power-good output, soft-start / inhibit, overvoltage protection, hiccup-mode OCP, and thermal shutdown.

Applications

DDR Memory Supply DDR Termination Supply

Use Scenario: DDR memory power rails requiring low-voltage regulation from an intermediate input bus.

IC Role: Synchronous buck controller driving external N-channel MOSFETs for the VDDQ or related DDR supply rail.

Use Value: The 0.6 V minimum output setting, ±0.8% reference accuracy, and selectable switching frequency support precise low-voltage memory power conversion.

Use Scenario: VTT termination rails that must source and sink current while tracking the DDR reference relationship.

IC Role: DDR-oriented controller with DDR-IN sensing and VTTREF buffer output.

Use Value: VTT and VTTREF regulation within 1% of VDDQ helps satisfy DDR termination and reference rail requirements.

Low-Voltage Distributed DC/DC Graphic Card Power Rails

Use Scenario: Point-of-load and niPoL converters operating from 1.8 V to 14 V input rails.

IC Role: Voltage-mode synchronous buck controller with external MOSFET power stage.

Use Value: 0% to 100% duty cycle, below-100 ns minimum on-time, and RDS(on) current sensing support compact low-voltage distributed power modules.

Use Scenario: High-current low-voltage rails in graphics cards and dense computing boards.

IC Role: Controller for high-density synchronous buck conversion with external MOSFET selection flexibility.

Use Value: Programmable peak and valley current limits, fast gate drivers, and HTSSOP16 exposed-pad packaging support board-level power-stage optimization.

Equivalent & Alternatives

When evaluating L6731D equivalent devices, engineers should compare DDR reference behavior, input voltage range, output-voltage accuracy, switching frequency, high-side and low-side driver capability, RDS(on) current-limit method, source / sink operation, HTSSOP16 footprint, and production packaging format.

Alternative Part Technical Difference Application Difference Selection Advice
L6731DTR Same L6731D controller function, same HTSSOP16 exposed-pad package, and same electrical architecture, but supplied in tape-and-reel packaging instead of tube packaging. Best suited for automated SMT assembly where reel-fed production handling is required. Select L6731D for tube-based handling or lower-volume builds; select L6731DTR when the same circuit needs tape-and-reel production logistics.

Compared with L6731DTR, L6731D keeps the same DDR memory supply controller function, pinout, HTSSOP16 package, MOSFET driver structure, and protection behavior. L6731D vs L6731DTR selection depends mainly on tube versus tape-and-reel packaging requirements rather than electrical redesign.

Quality

L6731D should be sourced as original STMicroelectronics components through traceable and controlled supply channels. Quality verification procedures may include HTSSOP16 exposed-pad package inspection, top-mark validation, tube label review, solderability testing, VCCDR regulator output verification, DDR-IN reference behavior checks, HGATE / LGATE driver function testing, PGOOD threshold verification, current-limit setting review, and incoming inspection according to DDR memory power-supply production requirements.

Availability

L6731D is available at Aetrix Electronics and suitable for DDR memory supplies, DDR termination rails, low-voltage distributed DC/DC modules, graphic-card power rails, and compact synchronous buck converter designs requiring stable component supply and repeatable production support.

Supply support may include scheduled delivery planning, volume procurement support, BOM continuity assistance, traceable sourcing management, and long-term availability support for OEM manufacturers, memory-module power designers, graphic-card hardware developers, industrial computing builders, and electronics production programs.

For production deployment, confirming the HTSSOP16 exposed-pad package, tube packaging format, DDR-IN reference mode, switching frequency setting, MOSFET driver requirements, current-limit design, thermal requirements, environmental specifications, and sourcing continuity helps reduce procurement risk and improve manufacturing stability.

Manufacturer

STMicroelectronics supplies power-management ICs, controllers, converters, RF devices, discrete semiconductors, sensors, and embedded semiconductor products for computing, industrial, automotive, communication, and consumer systems. L6731D belongs to ST's synchronous step-down controller portfolio for DDR memory and low-voltage point-of-load power conversion.

FAQ

What is L6731D used for?

L6731D is used to control synchronous buck converters for DDR memory supply, DDR termination supply, low-voltage distributed DC/DC rails, niPoL converters, compact DC/DC modules, and graphic-card power rails. It drives external N-channel MOSFETs and can source or sink current, which is important for DDR termination rail behavior.

How does L6731D support DDR memory power requirements?

L6731D includes a DDR-IN input, internal divider, and VTTREF buffer. It can regulate VTT and VTTREF within 1% of VDDQ, and it supports an external reference from 0 V to 2.5 V for DDRI and DDRII requirements. This allows the controller to handle both fixed low-voltage buck regulation and DDR tracking reference behavior.

What switching frequencies can L6731D use?

L6731D supports two fixed switching-frequency options: 250 kHz and 500 kHz. The selection is made through the voltage condition at DDR-IN. Engineers choose the frequency based on inductor size, switching loss, transient response, output ripple, MOSFET selection, and EMI behavior.

How does L6731D implement overcurrent protection?

L6731D senses current through the RDS(on) of the external MOSFETs rather than requiring a separate current-sense resistor. The OCH pin sets high-side peak current limit, while the OCL pin sets low-side valley current limit. This dual-threshold approach helps protect both on-time and off-time current conditions in high-current synchronous buck converters.

What should be considered in L6731D PCB layout?

L6731D layout should keep PGND close to the low-side MOSFET source, route PHASE carefully because it is both a switching node and current-limit sensing node, place the bootstrap capacitor close between BOOT and PHASE, bypass VCCDR with at least 1 µF ceramic capacitance, and keep FB / COMP compensation traces away from noisy gate-drive and switching-current paths.

What package is used by L6731D?

L6731D uses an HTSSOP16 exposed-pad package. The package supports compact synchronous buck controller placement and provides an exposed pad for improved grounding, thermal transfer, and mechanical stability compared with a standard non-exposed TSSOP package.

What is the difference between L6731D and L6731DTR?

L6731D and L6731DTR use the same controller architecture, package, pinout, and electrical function. The key difference is packaging logistics: L6731D is supplied in tube packaging, while L6731DTR is supplied in tape-and-reel packaging for automated production assembly.

L6731D Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
-
Package/Case:
16-PowerTSSOP (0.173", 4.40mm Width)
Packaging:
Tube
Product Status:
Active
Applications:
Controller, DDR
Voltage - Input:
1.8V ~ 14V
Number of Outputs:
1
Voltage - Output:
Adj down to 0.6V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
16-HTSSOP

L6731D FAQ

1.How can I place an order for L6731D through Aetrix?

Please submit a Request for Quotation (RFQ) for L6731D on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for L6731D reliable?

The price and inventory of L6731D are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for L6731D is usually 5 days.

3.What payment methods are accepted for L6731D?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for L6731D transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for L6731D?

L6731D orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your L6731D order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for L6731D?

For technical support, including L6731D datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your L6731D requirements.

6.How does Aetrix verify that L6731D is sourced from the original manufacturer or authorized distributors?

All L6731D products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that L6731D meets industry standards.

7.What is the process for return or replacement of L6731D?

All L6731D units undergo pre-shipment inspection (PSI). If there is an issue with L6731D, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The L6731D part is unused and in its original packaging.

Return procedure for L6731D:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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