STMicroelectronics L6732TR
- Part No.:
- L6732TR
- Manufacturer:
- STMicroelectronics
- Category:
- DC DC Switching Controllers
- Package:
- 16-PowerTSSOP (0.173", 4.40mm Width)
- Datasheet:
-
L6732TR.pdf
- Description:
- IC REG CTRLR BUCK 16TSSOP
- Quantity:
- Payment:

- Shipping:

Inventory:1,055
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Product details
Overview
L6732TR from STMicroelectronics is an adjustable synchronous step-down DC-DC controller IC designed for high-current, high-efficiency buck converters. It supports input voltage from 1.8 V to 14 V, supplies regulated output down to 0.6 V with ±0.8 % accuracy over −40 °C to +125 °C, and delivers up to 20 A output current using external N-channel MOSFETs in a synchronous rectified topology.
For engineers reviewing the L6732TR datasheet, L6732TR pinout, L6732TR application, or L6732TR equivalent, key selection considerations include its predictive anti-cross-conduction control, programmable RDS(on)-based over-current protection (OCP) on both high-side and low-side FETs, 250/500 kHz selectable switching frequency, pre-bias startup capability, and master/slave synchronization with 180° phase shift for multi-phase designs.
Technical Context
The L6732TR implements fixed-frequency voltage-mode PWM control with a 10 MHz gain-bandwidth error amplifier and 5 V/µs slew rate, enabling fast transient response in high-density DC-DC modules. Its oscillator supports dual-frequency selection (250 kHz or 500 kHz) via analog voltage at the EAREF pin, and minimum on-time is guaranteed below 100 ns for low-duty-cycle operation at high frequencies.
Current sensing uses RDS(on) of external MOSFETs-peak current sensed via OCH pin (high-side), valley current via OCL pin (low-side)-eliminating sense resistors. The device integrates high-current gate drivers (RHGATE_ON = 1.7 Ω, RLGATE_OFF = 0.6 Ω), predictive dead-time control (~20 ns adaptive dead time), and internal 5 V LDO (VCCDR) with bypass option for low-VCC operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 1.8 V to 14 V - supports wide-input industrial and computing rails including DDR memory supply and niPoL applications. |
| Output Voltage Accuracy | ±0.8 % over line, load, and temperature (−40 °C to +125 °C) - enables precise regulation for low-voltage ASIC/FPGA cores. |
| Switching Frequency | Selectable 250 kHz / 500 kHz - balances efficiency vs. size trade-offs; higher frequency allows smaller magnetics in space-constrained modules. |
| Min On-Time (TON,MIN) | <100 ns - enables stable operation at very low duty cycles (e.g., 0.6 V out from 5 V in @ 500 kHz = 12 % duty cycle). |
| Duty Cycle Range | 0 % to 100 % - supports 100 % conduction for dropout operation and full control during soft-start and fault recovery. |
| Gate Drive Capability | High-side source/sink RON/ROFF: 1.7 Ω / 1.12 Ω; low-side: 1.15 Ω / 0.6 Ω - drives multiple paralleled MOSFETs with minimal gate loss and fast edge rates. |
| Current Sensing Method | RDS(on)-based peak (OCH) and valley (OCL) sensing - eliminates current-sense resistor, reduces BOM cost and board area, improves thermal performance. |
Pinout & Package
Package: HTSSOP16 with exposed thermal pad - optimized for high-power density and thermal dissipation in compact DC-DC modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 PGOOD | Open-collector power-good indicator | Pulled low if output deviates >±10 % from setpoint; requires external pull-up to VCCDR for logic-level signal. |
| 2 SYNCH | Master/slave synchronization input | Enables phase-shifted multi-device operation; floating when unused; highest-FSW device becomes master. |
| 3 SGND | Analog ground reference | Reference node for internal error amplifier, reference, and compensation network - must be star-connected to minimize noise coupling. |
| 4 FB | Inverting input of error amplifier | Connects to output via resistor divider; senses regulated voltage and triggers OVP/UVLO/PGOOD functions. |
| 5 COMP | Error amplifier output | Drives external compensation network (type II/III); sets loop stability and transient response bandwidth. |
| 6 SS/INH | Soft-start and inhibit control | Capacitor-programmed ramp; <0.5 V disables device; enables pre-bias startup by sourcing-only current during ramp. |
| 7 EAREF | Reference select and frequency control | Analog voltage sets internal/external reference (0–2.5 V) and FSW (250/500 kHz); value latched at UVLO crossing. |
| 8 OCL | Valley current limit programming | Resistor-to-GND sets low-side RDS(on)-based OCP threshold; 100 µA internal current source defines IVALLEY. |
| 9 OCH | Peak current limit programming | Resistor-to-drain sets high-side RDS(on)-based OCP threshold; 100 µA sink current defines IPEAK. |
| 10 PHASE | High-side source return and current sense node | Connects to HS-FET source; provides return path for HS driver and enables RDS(on) sensing for both OCP modes. |
| 11 HGATE | High-side MOSFET gate driver output | Drives HS-FET gate with bootstrapped supply; integrated predictive dead-time control prevents shoot-through. |
| 12 BOOT | Bootstrap capacitor connection | Connected to PHASE via capacitor; diode from VCCDR supplies charge for HS driver during high-side conduction. |
| 13 PGND | Power ground for low-side driver | Must be tightly coupled to LS-FET source to minimize noise injection into current sensing and gate drive paths. |
| 14 LGATE | Low-side MOSFET gate driver output | Drives LS-FET gate directly from VCCDR; fast turn-off (0.6 Ω sink) ensures rapid body-diode commutation. |
| 15 VCCDR | Internally regulated 5 V supply | 5 V ±0.5 V output (1 mA–100 mA load); powers internal logic and drivers; requires ≥1 µF ceramic decoupling. |
| 16 VCC | Main supply input | 4.5 V to 14 V operating range; internal UVLO thresholds at 4.2 V (turn-on) and 3.8 V (turn-off). |
Key Features
| Feature | Design Value |
|---|---|
| Predictive anti-cross conduction control | Monitors PHASE node to dynamically adjust dead time (~20 ns typical), minimizing shoot-through losses without fixed timing overhead. |
| Programmable RDS(on) over-current protection | Separate high-side (OCH) and low-side (OCL) current limits enable accurate, resistorless OCP across full load range and startup conditions. |
| Pre-bias startup capability | Sources current only during soft-start (0–1.1 V on SS), allowing safe ramp-up even when output is pre-charged - critical for DDR and FPGA supplies. |
| Master/slave synchronization with 180° phase shift | Enables two-phase interleaving without external clock generator; reduces input/output ripple and improves thermal distribution in multi-phase designs. |
| External reference support (0–2.5 V) | Allows system-level voltage tracking or custom regulation points; EAREF voltage also selects switching frequency (250/500 kHz). |
Applications
| DDR Memory Supply | Graphics Card VRM |
|---|---|
|
Use Scenario: Regulating 1.2 V or 1.35 V VDDQ/VDDIO for DDR3/DDR4 memory subsystems with tight transient requirements and pre-biased outputs. IC Role / Device Role / Timing Role: Primary synchronous buck controller managing high-current, low-voltage rail with fast load-step response and hiccup-mode OCP. Use Value: ±0.8 % output accuracy and 10 MHz GBW error amplifier ensure stable voltage under dynamic memory access loads; pre-bias startup avoids brownout during cold boot. |
Use Scenario: High-density, multi-phase VRM for GPU core voltage (e.g., 0.8–1.2 V @ >30 A) in gaming and workstation graphics cards. IC Role / Device Role / Timing Role: Single-phase controller used in interleaved configuration with master/slave sync for reduced input ripple and thermal spreading. Use Value: 180° phase shift synchronization and RDS(on) OCP eliminate need for current-sense resistors, saving PCB area and improving efficiency at high currents. |
| High-Density DC-DC Module | niPoL Converter |
|
Use Scenario: Compact, high-efficiency point-of-load converter in telecom/datacom boards where board space and thermal management are critical. IC Role / Device Role / Timing Role: Adjustable step-down controller driving discrete MOSFETs to achieve >90 % efficiency at 10–20 A output with minimal footprint. Use Value: HTSSOP16 package with exposed pad enables high thermal conductivity; <100 ns min on-time supports 0.6 V output from 5 V bus at 500 kHz. |
Use Scenario: Non-isolated Point-of-Load converter supplying ASIC or SoC core voltage (e.g., 0.7–0.9 V) in server or networking equipment. IC Role / Device Role / Timing Role: Synchronous buck controller implementing valley/peak OCP and predictive dead-time for ultra-low-voltage, high-accuracy regulation. Use Value: Dual OCP thresholds prevent false triggering during load transients; ±0.8 % accuracy maintains SoC timing margins across temperature and aging. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous buck controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISL6269CRZ-T | Fixed 0.6 V reference only; no external reference support; 300 kHz fixed frequency; lower drive strength (RHS = 2.5 Ω). | Lacks pre-bias startup and RDS(on) valley OCP; limited to single-reference systems; less suitable for DDR VTT or tracking rails. | Choose ISL6269CRZ-T only for cost-sensitive, fixed-output applications where external reference and dual OCP are unnecessary. |
| TPS54620RGYT | Integrated FETs (30 V, 6 A); fixed 0.8 % accuracy; 200–1200 kHz adjustable frequency; no master/slave sync or pre-bias startup. | Not a controller - monolithic converter; unsuitable for >20 A or discrete high-efficiency designs requiring external MOSFET optimization. | Choose TPS54620RGYT only for lower-current (<6 A), space-constrained designs where integration outweighs flexibility and scalability. |
Compared with ISL6269CRZ-T and TPS54620RGYT, the L6732TR offers unique advantages for high-current, high-accuracy, and multi-phase applications: external reference support enables voltage tracking, dual RDS(on) OCP improves reliability under transient faults, and master/slave sync enables scalable multi-phase architectures without external clocking.
Availability
L6732TR is available at Aetrix Electronics and suitable for LCD/PDP TV power supplies, high-density DC-DC modules, and DDR memory regulation requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for L6732TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, MCU, power, and automotive ICs with emphasis on energy efficiency and system integration.
The L6732TR belongs to ST's high-performance DC-DC controller product line, engineered specifically for synchronous buck topologies in computing, graphics, and telecom infrastructure where precision, scalability, and thermal efficiency are critical.
FAQ
What is the minimum output voltage supported by the L6732TR?
The L6732TR supports an adjustable output voltage down to 0.6 V with ±0.8 % accuracy over temperature (−40 °C to +125 °C) and line regulation. This is achieved using either the internal 0.6 V reference or an external reference applied to the EAREF pin, enabling precise regulation for modern low-voltage ASICs and memory interfaces.
Does the L6732TR support pre-biased output startup?
Yes - the L6732TR supports pre-biased startup by sourcing current only during the soft-start ramp (SS pin voltage 0–1.1 V). This prevents reverse current flow and ensures controlled ramp-up even when the output is initially charged, making it ideal for DDR memory and FPGA core supplies where output pre-bias is common.
How does the L6732TR implement over-current protection without sense resistors?
The L6732TR uses RDS(on) of the external high-side and low-side MOSFETs for current sensing. Peak current is monitored via the OCH pin (100 µA sink current through ROCH), and valley current via the OCL pin (100 µA source current through ROCL), eliminating sense resistors while maintaining accuracy across temperature and load conditions.
Can multiple L6732TR controllers be synchronized for interleaved operation?
Yes - the L6732TR supports master/slave synchronization via the SYNCH pin, enabling two or more devices to operate with 180° phase shift. When SYNCH pins are tied together, the highest-frequency device becomes master; all others automatically align with 180° offset, reducing input/output ripple and improving thermal distribution.
L6732TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 16-PowerTSSOP (0.173", 4.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Output Type:
- Transistor Driver
- Function:
- Step-Down
- Output Configuration:
- Positive
- Topology:
- Buck
- Number of Outputs:
- 1
- Output Phases:
- 1
- Voltage - Supply (Vcc/Vdd):
- 4.5V ~ 14V
- Frequency - Switching:
- 250kHz, 500kHz
- Duty Cycle (Max):
- 100%
- Synchronous Rectifier:
- Yes
- Clock Sync:
- Yes
- Serial Interfaces:
- -
- Control Features:
- Current Limit, Enable, Phase Control, Power Good, Soft Start
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-HTSSOP
L6732TR FAQ
1.How can I place an order for L6732TR through Aetrix?
Please submit a Request for Quotation (RFQ) for L6732TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for L6732TR reliable?
The price and inventory of L6732TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for L6732TR is usually 5 days.
3.What payment methods are accepted for L6732TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for L6732TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for L6732TR?
L6732TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your L6732TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for L6732TR?
For technical support, including L6732TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your L6732TR requirements.
6.How does Aetrix verify that L6732TR is sourced from the original manufacturer or authorized distributors?
All L6732TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that L6732TR meets industry standards.
7.What is the process for return or replacement of L6732TR?
All L6732TR units undergo pre-shipment inspection (PSI). If there is an issue with L6732TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The L6732TR part is unused and in its original packaging.
Return procedure for L6732TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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